Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

NRVBS260NT3G

onsemi · Schottky Barrier Diodes (SBD) · SMB

NRVBS260NT3G from onsemi, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Instantaneous Forward Voltage vF 0.51 V iF = 1.0 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage vF 0.475 V iF = 1.0 A, TJ = 125°C 2
Maximum Instantaneous Forward Voltage vF 0.63 V iF = 2.0 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage vF 0.55 V iF = 2.0 A, TJ = 125°C 2
Maximum Instantaneous Reverse Current IR 0.2 mA VR = 60 V, TJ = 25°C 2
Maximum Instantaneous Reverse Current IR 20 mA VR = 60 V, TJ = 125°C 2
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VR 60 V 2
Average Rectified Forward Current IO 2 A At Rated VR, TL = 95°C 2
Non-Repetitive Peak Surge Current IFSM 60 A Surge applied at rated load conditions halfwave, single phase, 60 Hz 2
Storage Temperature Range Tstg -55 150 °C 2
Operating Junction Temperature TJ -55 125 °C 2
Voltage Rate of Change dv/dt 10000 V/s Rated VR, TJ = 25°C 2
Thermal Resistance, Junction-to-Lead RθJL 24 °C/W Mounted with minimum recommended pad size, PC Board FR4 (Note 1) 2
Thermal Resistance, Junction-to-Ambient RθJA 80 °C/W 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board (Note 2) 2

CAD (KiCad official)

  • Symbol: NRVBS260NT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: nrvbs260nt3g-etched.step / nrvbs260nt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nrvbs260nt3g.step / nrvbs260nt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 ed56c227a3c15e50, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF