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Contents

README

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NRVB120VLSFT1G

onsemi · Schottky Barrier Diodes (SBD) · SOD-123FL

NRVB120VLSFT1G from onsemi, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode terminal, identified by the cathode band polarity marking; the device blocks up to 20 V DC (VR) and carries 1.0 A average forward current.
2 A passive Anode terminal of the Schottky barrier rectifier, with a maximum forward voltage of 0.340 V at 1.0 A and TJ = 25°C.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123FL
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM/VRWM/VR 20 V 2
Average Rectified Forward Current IF(AV) 1 A Rated VR, TL = 119°C 2
Non-Repetitive Peak Surge Current IFSM 45 A Surge applied at rated load conditions, halfwave, single phase, 60 Hz 2
Storage Temperature Range Tstg -65 125 °C 2
Operating Junction Temperature TJ -65 125 °C 2
Voltage Rate of Change dv/dt 1000 V/s Rated VR 2
Maximum Instantaneous Forward Voltage VF 0.275 V IF = 0.1 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage VF 0.315 V IF = 0.5 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage VF 0.34 V IF = 1.0 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage VF 0.205 V IF = 0.1 A, TJ = 85°C 2
Maximum Instantaneous Forward Voltage VF 0.27 V IF = 0.5 A, TJ = 85°C 2
Maximum Instantaneous Forward Voltage VF 0.3 V IF = 1.0 A, TJ = 85°C 2
Maximum Instantaneous Reverse Current IR 0.6 mA Rated DC Voltage, TJ = 25°C 2
Maximum Instantaneous Reverse Current IR 15 mA Rated DC Voltage, TJ = 85°C 2
Thermal Resistance Junction-to-Lead Rtjl 26 °C/W Note 1: minimum recommended pad size, FR4 2
Thermal Resistance Junction-to-Lead Rtjl 21 °C/W Note 2: 1 in. copper pad (700 mm2) 2
Thermal Resistance Junction-to-Ambient Rtja 325 °C/W Note 1: minimum recommended pad size, FR4 2
Thermal Resistance Junction-to-Ambient Rtja 82 °C/W Note 2: 1 in. copper pad (700 mm2) 2

CAD (KiCad official)

  • Symbol: NRVB120VLSFT1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123FL (KiCad packages3D, STEP)
  • 3D model files: nrvb120vlsft1g-etched.step / nrvb120vlsft1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nrvb120vlsft1g.step / nrvb120vlsft1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 a3ab5363a27f38a8, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF