component
NIS5420MT7TXG
Public Made by Adomby adom
onsemi Surge Suppressors, WDFN-10(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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NIS5420MT7TXG
onsemi · Surge Suppressors · WDFN-10(3x3)
NIS5420MT7TXG from onsemi, in a WDFN-10(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Negative input voltage to the device, used as the internal reference for the IC. |
| 2 | dv/dt | passive | Controls output voltage slew rate at turn-on with an internal capacitor giving about a 2 ms ramp; an external capacitor can be added to lengthen it, or leave open if no extra delay is needed. |
| 3 | En/Flt | bidirectional | Tri-state bidirectional enable/fault pin that is pulled to ground by an open-drain device to shut down the eFuse, reads about 1.4 V in thermal shutdown and about 3 V in normal operation; do not actively drive it or connect a capacitor. |
| 4 | ILIM | passive | A resistor between this pin and the source pin sets the overload and short-circuit current limit levels. |
| 5 | ISENSE | output | Load current monitor output that lets the system monitor load current in real time (1 mA/A typical with RSENSE = 1 kΩ); connect RSENSE to GND. |
| 6 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 7 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 8 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 9 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 10 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 11 | VCC | power_in | Positive input voltage to the device (belly pad), operating 8 V to 18 V steady-state. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | WDFN-10(3x3) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage, operating, steady-state | VIN | -0.6 | 18 | V | VCC to GND | 3 | |
| Input Voltage, transient | VIN | -0.6 | 25 | V | Transient (100 ms) | 3 | |
| Operating Ambient Temperature Range | TA | -40 | 125 | °C | 3 | ||
| Operating Junction Temperature Range | TJ | -40 | 150 | °C | 3 | ||
| Non-operating Temperature Range | TSTG | -55 | 155 | °C | 3 | ||
| Lead Temperature, Soldering | TL | 260 | °C | 10 Sec | 3 | ||
| Total Power Dissipation | Pmax | 1.39 | W | TA = 25°C, 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 | ||
| Kelvin ON Resistance | RDSon | 30 | 39 | 50 | mΩ | VCC = 12 V, Tj = 25°C | 4 |
| Off State Output Voltage | Voff | 50 | mV | VCC = 18 Vdc, VGS = 0 Vdc, RL = ∞ | 4 | ||
| Continuous Current | ID | 4.6 | A | TA = 25°C, 100 mm2 copper | 4 | ||
| Continuous Current | ID | 3.5 | A | TA = 80°C, minimum copper | 4 | ||
| Shutdown Temperature | TSD | 150 | 175 | 200 | °C | Verified by design | 4 |
| Thermal Shutdown Response Time | TSDRes | 10 | 15 | 20 | µs | 4 | |
| Output Clamping Voltage | VClamp1 | 12.5 | 14.5 | V | NIS5420MT2, NIS5420MT7 | 4 | |
| Output Clamping Response Time | TClamp_Res | 10 | µs | 4 | |||
| Undervoltage Lockout | VUVLO2 | 6 | 6.5 | 7 | V | NIS5420MT2, NIS5420MT6, NIS5420MT8 column | 4 |
| Kelvin Short Circuit Current Limit | ILim-SS | 1.76 | 2.1 | 2.64 | A | RLimit = 20 Ω | 4 |
| Logic Level Low (Output Disabled) | Vin-low | 0.35 | 0.58 | 0.81 | V | 4 | |
| Logic Level Mid (Thermal Fault, Output Disabled) | Vin-mid | 0.82 | 1.4 | 1.95 | V | 4 | |
| Logic Level High (Output Enabled) | Vin-high | 1.96 | 2.6 | 3 | V | 4 | |
| High State Maximum Voltage | Vin-max | 2.51 | 4.6 | 5 | V | 4 | |
| Logic Low Sink Current | Iin-low | -15 | -25 | µA | Venable = 0 V | 4 | |
| Logic High Leakage Current for External Switch | Iin-leak | 1 | µA | Venable = 3.3 V | 4 | ||
| Maximum Fanout for Fault Signal | Fan | 3 | Units | Total number of chips that can be connected to this pin for simultaneous shutdown | 4 | ||
| Bias Current (Operational) | IBias | 450 | µA | 4 | |||
| Bias Current (Shutdown) | IBias | 150 | µA | 4 | |||
| Minimum Operating Voltage | Vmin | 7.7 | V | Notes 3 and 5 | 4 | ||
| Current Monitor Sense Accuracy | IACC | -10 | 10 | % | 4 | ||
| Thermal Resistance, Junction-to-Air | RθJA | 90 | °C/W | 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 | ||
| Thermal Characterization Parameter, Junction-to-Lead | ψJ-L | 27.5 | °C/W | 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 | ||
| Thermal Characterization Parameter, Junction-to-Board | ψJ-B | 27.5 | °C/W | 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 | ||
| Thermal Characterization Parameter, Junction-to-Case Top | ψJ-T | 7.6 | °C/W | 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 | ||
| Delay Time | Tdly | 220 | µs | Enabling of chip to ID = 100 mA with 1 A resistive load | 4 | ||
| Kelvin ON Resistance | RDSon | 60 | mΩ | TJ = 140°C | 4 | ||
| Thermal Hysteresis | THyst | 45 | °C | Auto-retry part only | 4 | ||
| UVLO Hysteresis | VHyst | 0.8 | V | 4 | |||
| Kelvin Overload Current Limit | ILim-OL | 4.2 | A | RLimit = 20 Ω | 4 | ||
| Output Voltage Ramp Time | tslew | 2 | ms | VOUT = 1.2 V to 10.8 V with 12 Ω load | 4 | ||
| Current Monitor Sense | ISENSE | 1 | mA/A | RSENSE = 1 kΩ | 4 |
CAD (KiCad official)
- Symbol:
NIS5420MT7TXG - Footprint:
Package_DFN_QFN:WDFN-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm - 3D model: WDFN-10(3x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (13 pp, sha256
70fd2199cbdacd78, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# NIS5420MT7TXG
**onsemi** · Surge Suppressors · WDFN-10(3x3)
NIS5420MT7TXG from onsemi, in a WDFN-10(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Negative input voltage to the device, used as the internal reference for the IC. |
| 2 | dv/dt | passive | Controls output voltage slew rate at turn-on with an internal capacitor giving about a 2 ms ramp; an external capacitor can be added to lengthen it, or leave open if no extra delay is needed. |
| 3 | En/Flt | bidirectional | Tri-state bidirectional enable/fault pin that is pulled to ground by an open-drain device to shut down the eFuse, reads about 1.4 V in thermal shutdown and about 3 V in normal operation; do not actively drive it or connect a capacitor. |
| 4 | ILIM | passive | A resistor between this pin and the source pin sets the overload and short-circuit current limit levels. |
| 5 | ISENSE | output | Load current monitor output that lets the system monitor load current in real time (1 mA/A typical with RSENSE = 1 kΩ); connect RSENSE to GND. |
| 6 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 7 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 8 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 9 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 10 | Src | power_out | Source of the internal power FET and the output terminal of the fuse. |
| 11 | VCC | power_in | Positive input voltage to the device (belly pad), operating 8 V to 18 V steady-state. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | WDFN-10(3x3) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 11 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage, operating, steady-state | VIN | -0.6 | | 18 | V | VCC to GND | 3 |
| Input Voltage, transient | VIN | -0.6 | | 25 | V | Transient (100 ms) | 3 |
| Operating Ambient Temperature Range | TA | -40 | | 125 | °C | | 3 |
| Operating Junction Temperature Range | TJ | -40 | | 150 | °C | | 3 |
| Non-operating Temperature Range | TSTG | -55 | | 155 | °C | | 3 |
| Lead Temperature, Soldering | TL | | | 260 | °C | 10 Sec | 3 |
| Total Power Dissipation | Pmax | | | 1.39 | W | TA = 25°C, 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 |
| Kelvin ON Resistance | RDSon | 30 | 39 | 50 | mΩ | VCC = 12 V, Tj = 25°C | 4 |
| Off State Output Voltage | Voff | | | 50 | mV | VCC = 18 Vdc, VGS = 0 Vdc, RL = ∞ | 4 |
| Continuous Current | ID | | | 4.6 | A | TA = 25°C, 100 mm2 copper | 4 |
| Continuous Current | ID | | | 3.5 | A | TA = 80°C, minimum copper | 4 |
| Shutdown Temperature | TSD | 150 | 175 | 200 | °C | Verified by design | 4 |
| Thermal Shutdown Response Time | TSDRes | 10 | 15 | 20 | µs | | 4 |
| Output Clamping Voltage | VClamp1 | 12.5 | | 14.5 | V | NIS5420MT2, NIS5420MT7 | 4 |
| Output Clamping Response Time | TClamp_Res | | | 10 | µs | | 4 |
| Undervoltage Lockout | VUVLO2 | 6 | 6.5 | 7 | V | NIS5420MT2, NIS5420MT6, NIS5420MT8 column | 4 |
| Kelvin Short Circuit Current Limit | ILim-SS | 1.76 | 2.1 | 2.64 | A | RLimit = 20 Ω | 4 |
| Logic Level Low (Output Disabled) | Vin-low | 0.35 | 0.58 | 0.81 | V | | 4 |
| Logic Level Mid (Thermal Fault, Output Disabled) | Vin-mid | 0.82 | 1.4 | 1.95 | V | | 4 |
| Logic Level High (Output Enabled) | Vin-high | 1.96 | 2.6 | 3 | V | | 4 |
| High State Maximum Voltage | Vin-max | 2.51 | 4.6 | 5 | V | | 4 |
| Logic Low Sink Current | Iin-low | | -15 | -25 | µA | Venable = 0 V | 4 |
| Logic High Leakage Current for External Switch | Iin-leak | | | 1 | µA | Venable = 3.3 V | 4 |
| Maximum Fanout for Fault Signal | Fan | | | 3 | Units | Total number of chips that can be connected to this pin for simultaneous shutdown | 4 |
| Bias Current (Operational) | IBias | | | 450 | µA | | 4 |
| Bias Current (Shutdown) | IBias | | | 150 | µA | | 4 |
| Minimum Operating Voltage | Vmin | | | 7.7 | V | Notes 3 and 5 | 4 |
| Current Monitor Sense Accuracy | IACC | -10 | | 10 | % | | 4 |
| Thermal Resistance, Junction-to-Air | RθJA | | 90 | | °C/W | 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 |
| Thermal Characterization Parameter, Junction-to-Lead | ψJ-L | | 27.5 | | °C/W | 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 |
| Thermal Characterization Parameter, Junction-to-Board | ψJ-B | | 27.5 | | °C/W | 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 |
| Thermal Characterization Parameter, Junction-to-Case Top | ψJ-T | | 7.6 | | °C/W | 4 layer High-K JEDEC JESD51-7 PCB, 100 mm2, 2 oz. Cu | 3 |
| Delay Time | Tdly | | 220 | | µs | Enabling of chip to ID = 100 mA with 1 A resistive load | 4 |
| Kelvin ON Resistance | RDSon | | 60 | | mΩ | TJ = 140°C | 4 |
| Thermal Hysteresis | THyst | | 45 | | °C | Auto-retry part only | 4 |
| UVLO Hysteresis | VHyst | | 0.8 | | V | | 4 |
| Kelvin Overload Current Limit | ILim-OL | | 4.2 | | A | RLimit = 20 Ω | 4 |
| Output Voltage Ramp Time | tslew | | 2 | | ms | VOUT = 1.2 V to 10.8 V with 12 Ω load | 4 |
| Current Monitor Sense | ISENSE | | 1 | | mA/A | RSENSE = 1 kΩ | 4 |
## CAD (KiCad official)
- Symbol: `NIS5420MT7TXG`
- Footprint: `Package_DFN_QFN:WDFN-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm`
- 3D model: WDFN-10(3x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/nis5420mt7tx-d.pdf) (13 pp, sha256 `70fd2199cbdacd78`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/nis5420mt7txg-datasheet.pdf)