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Contents

README

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NDP13701QB

NDP · DC-DC Converters · QFN-20(5x5)

NDP13701QB from NDP, in a QFN-20(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the exposed-pad group PAD1; connect to system ground.
2 GND power_in Ground pin of the exposed-pad group PAD1; connect to system ground.
3 GND power_in Ground pin of the exposed-pad group PAD1; connect to system ground.
4 NC unconnected No internal connection; the layout note says pins 4 and 5 may be tied to VIN or GND for easier layout.
5 NC unconnected No internal connection; the layout note says pins 4 and 5 may be tied to VIN or GND for easier layout.
6 VIN power_in Power input of the exposed-pad group PAD2; VIN range is 7.5 V to 30 V with an absolute maximum of -0.3 V to 33 V to GND.
7 VIN power_in Power input of the exposed-pad group PAD2; VIN range is 7.5 V to 30 V with an absolute maximum of -0.3 V to 33 V to GND.
8 VIN power_in Power input of the exposed-pad group PAD2; VIN range is 7.5 V to 30 V with an absolute maximum of -0.3 V to 33 V to GND.
9 NC unconnected No internal connection.
10 BST power_out Boot-strap pin for the high-side driver; connect a resistor of 0-10 Ω (4.7 Ω typ) and 100 nF from BST to SW, with BST to GND rated -0.3 V to VIN+7 V.
11 NC unconnected No internal connection.
12 SW output Switching node of the exposed-pad group PAD3, connected to the inductor; SW to GND rated -0.3 V to VIN+0.3 V.
13 SW output Switching node of the exposed-pad group PAD3, connected to the inductor; SW to GND rated -0.3 V to VIN+0.3 V.
14 SW output Switching node of the exposed-pad group PAD3, connected to the inductor; SW to GND rated -0.3 V to VIN+0.3 V.
15 NC unconnected No internal connection.
16 FB input Feedback input for the output voltage divider, regulated to the 1.0 V internal reference; FB to GND rated -0.3 V to 6.5 V.
17 CSP input Positive pole of the current-sense amplifier; CSP to GND rated -0.3 V to VIN, with the CSP-CSN current-sense voltage of 51-59 mV.
18 CSN1 input Negative pole 1 of the current-sense amplifier; CSN1 to GND rated -0.3 V to VIN.
19 CSN2 input Negative pole 2 of the current-sense amplifier; CSN2 to GND rated -0.3 V to VIN.
20 FS/EN input Connect a resistor to GND to set switching frequency, or float for 130 kHz; it also serves as enable with an internal 8 µA pull-up, and FS/EN to GND is rated -0.3 V to 6.5 V; below 0.3 V the part enters shutdown.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer NDP
Package QFN-20(5x5)
Category Power Management (PMIC)
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN to GND VIN -0.3 33 V VIN to GND 4
SW to GND -0.3 V Upper limit printed as VIN+0.3 V 4
BST to GND -0.3 V Upper limit printed as VIN+7 V 4
FB, FS/EN to GND -0.3 6.5 V FB, FS/EN to GND 4
CSP, CSN1, CSN2 to GND -0.3 V Upper limit printed as VIN V 4
Operating Junction Temperature TA -40 150 °C 4
Storage Junction Temperature Tstg -65 150 °C 4
Input Voltage (VIN) VIN 8 24 V 4
Output Voltage (VOUT) VOUT 3.3 20 V 4
Maximum Duty Cycle (DMAX) DMAX 95 99 % 4
Input Voltage VIN 7.5 30 V 5
UVLO OFF Voltage VUVLO_OFF 6.8 7.1 7.5 V VIN Rising 5
UVLO ON Voltage VUVLO_ON 6 6.5 6.8 V VIN Falling 5
Standby Current ISB 1.7 2.2 mA No Load 5
FB Reference Voltage VREF 0.98 1 1.02 V 5
Current Sense AMP VCS1 VCS1 51 55 59 mV CSP-CSN1 5
Current Sense AMP VCS2 VCS2 51 55 59 mV CSP-CSN2 5
Switching Frequency FSW 110 130 150 kHz FS Floating 5
Switching Frequency FSW 220 260 300 kHz R_FS=200kΩ 5
Enable On Voltage VEN_ON 0.68 0.7 1.5 V VEN Rising 5
Enable Off Voltage VEN_OFF 0.3 0.62 0.65 V VEN Falling 5
Output Current (IOUT) IOUT 7 A 4
Quiescent Current ICCQ 1.3 mA VFB = 1.2V, No Switch 5
Enable Voltage VEN 1 V EN Floating 5
Enable Internal Pull Up Current IEN 8 μA 5
Maximum Duty Cycle 99 % 5
Minimum On-Time 250 ns 5
Current Limit ILIMIT 10 A 5
Hiccup Interval THICCUP 580 ms FS Floating 5
Soft Start Time TSS 5 ms 5
RDSON of Power MOSFET (high side) RDSON_H 10 mΩ Temperature=25℃ 5
RDSON of Power MOSFET (low side) RDSON_L 10 mΩ Temperature=25℃ 5
Thermal shutdown Temperature TSD 165 °C 5
Thermal Shutdown Hysteresis Temperature TSH 20 °C 5
Thermal Resistance from Junction to Case θJC 15 °C/W 4
Thermal Resistance from Junction to Ambient θJA 40 °C/W 4

CAD (KiCad official)

  • Symbol: NDP13701QB
  • Footprint: Package_DFN_QFN:QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm
  • 3D model: QFN-20(5x5) (KiCad packages3D, STEP)
  • 3D model files: ndp13701qb-etched.step / ndp13701qb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ndp13701qb.step / ndp13701qb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NDP datasheet (15 pp, sha256 1b9d13346e5e1af4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF