main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 7d ago
viewers ndd04n50zt4g-vb: viewers · Ray 7d ago
ndd04n50zt4g-vb-etched.glb Publish 0.1.0 · Ray 7d ago
ndd04n50zt4g-vb-etched.step ndd04n50zt4g-vb: factory component page (tier=lcsc) · Ray 7d ago
ndd04n50zt4g-vb-hero.glb ndd04n50zt4g-vb: hero GLB from the etched model (keeps the MPN mark) · Ray 7d ago
ndd04n50zt4g-vb-hero.overlay.json Publish 0.1.0 · Ray 7d ago
ndd04n50zt4g-vb.glb Publish 0.1.0 · Ray 7d ago
ndd04n50zt4g-vb.kicad_mod Publish 0.1.0 · Ray 7d ago
ndd04n50zt4g-vb.kicad_sym Publish 0.1.0 · Ray 7d ago
ndd04n50zt4g-vb.lbr Publish 0.1.0 · Ray 7d ago
ndd04n50zt4g-vb.step Publish 0.1.0 · Ray 7d ago
package.json Publish 0.1.0 · Ray 7d ago
page.json Set visibility: public · Ray 7d ago
README.md Publish 0.1.0 · Ray 7d ago
verification.json Verified: Published by the parts factory: tier lcsc, 3 pins · Ray 7d ago

NDD04N50ZT4G-VB

VBsemi Elec · MOSFETs · TO-252

NDD04N50ZT4G-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the N-channel MOSFET; gate-source voltage rated ±30 V max with threshold VGS(th) of 2.5 to 5.0 V.
2 D passive Drain terminal (also the TO-252 tab); drain-source voltage rated 650 V max.
3 S passive Source terminal of the N-channel MOSFET, connected to the body diode anode.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 650 V TC = 25 °C 1
Gate-Source Voltage VGS -30 30 V TC = 25 °C 1
Continuous Drain Current ID 4.2 A VGS at 10 V, TC = 100 °C 1
Pulsed Drain Current IDM 18 A TC = 25 °C 1
Linear Derating Factor 0.48 W/°C TC = 25 °C 1
Single Pulse Avalanche Energy EAS 325 mJ TC = 25 °C 1
Repetitive Avalanche Current IAR 4 A TC = 25 °C 1
Repetitive Avalanche Energy EAR 6 mJ TC = 25 °C 1
Maximum Power Dissipation PD 60 W TC = 25 °C 1
Peak Diode Recovery dV/dt dV/dt 2.8 V/ns TC = 25 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Soldering Recommendations (Peak Temperature) 300 °C for 10 s, 1.6 mm from case 1
Junction-to-Ambient Thermal Resistance RthJA -65 °C/W 2
Junction-to-Case (Drain) Thermal Resistance RthJC -2.1 °C/W 2
Drain-Source Breakdown Voltage VDS 650 V VGS = 0 V, ID = 250 µA 2
VDS Temperature Coefficient ΔVDS/TJ 670 mV/°C Reference to 25 °C, ID = 1 mA 2
Gate-Source Threshold Voltage VGS(th) 2.5 5 V VDS = VGS, ID = 250 µA 2
Gate-Source Leakage IGSS -100 100 nA VGS = ± 30 V 2
Zero Gate Voltage Drain Current IDSS 25 µA VDS = 650 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS 250 µA VDS = 520 V, VGS = 0 V, TJ = 125 °C 2
Forward Transconductance gfs 3.9 S VDS = 50 V, ID = 3.1 A 2
Input Capacitance Ciss 1417 pF VGS = 0 V, VDS = 25 V, f = 1.0 MHz 2
Output Capacitance Coss 177 pF VGS = 0 V, VDS = 25 V, f = 1.0 MHz 2
Reverse Transfer Capacitance Crss 7 pF VGS = 0 V, VDS = 25 V, f = 1.0 MHz 2
Total Gate Charge Qg 48 nC ID = 3.2 A, VDS = 400 V, VGS = 10 V 2
Gate-Source Charge Qgs 12 nC ID = 3.2 A, VDS = 400 V, VGS = 10 V 2
Gate-Drain Charge Qgd 19 nC ID = 3.2 A, VDS = 400 V, VGS = 10 V 2
Continuous Source-Drain Diode Current IS 4 A 2
Pulsed Diode Forward Current ISM 21 A 2
Body Diode Voltage VSD 1.5 V TJ = 25 °C, IS = 3.2 A, VGS = 0 V 2
Body Diode Reverse Recovery Time trr 493 739 ns TJ = 25 °C, IF = 3.2 A, dI/dt = 100 A/µs 2
Body Diode Reverse Recovery Charge Qrr 2.1 3.2 µC TJ = 25 °C, IF = 3.2 A, dI/dt = 100 A/µs 2
Rise Time tr 20 ns VDD = 325 V, ID = 3.2 A, RG = 9.1 Ω, RD = 62 Ω 2
Turn-Off Delay Time td(off) 34 ns VDD = 325 V, ID = 3.2 A, RG = 9.1 Ω, RD = 62 Ω 2
Fall Time tf 18 ns VDD = 325 V, ID = 3.2 A, RG = 9.1 Ω, RD = 62 Ω 2

CAD (KiCad official)

  • Symbol: NDD04N50ZT4G-VB
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: ndd04n50zt4g-vb-etched.step / ndd04n50zt4g-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ndd04n50zt4g-vb.step / ndd04n50zt4g-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 8843c629bba4fa3d, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF