component
NCV8177AMX330TCG
Public Made by Adomby adom
onsemi Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownNCV8177AMX330TCG
onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)
NCV8177AMX330TCG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage pin, with an output voltage range of 0.7 V to 3.6 V. |
| 2 | GND | power_in | Power supply ground pin. |
| 3 | EN | input | Enable pin (active high): the device is enabled above 1.0 V and disabled below 0.4 V, with an absolute maximum rating of −0.3 V to 6.0 V. |
| 4 | IN | power_in | Power supply input voltage pin, with an operating input range of 1.6 V to 5.5 V and an absolute maximum rating of −0.3 V to 6.0 V. |
| 5 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | XDFN-4-EP(1x1) |
| Category | Power Supply Chip |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage | VIN | 1.6 | 5.5 | V | 3 | ||
| Junction Temperature | TJ | -40 | 125 | °C | 3 | ||
| Output Voltage accuracy at 25°C | VOUT | -0.8 | 0.8 | % | VOUT_NOM ≥ 1.8 V, TJ = +25°C | 4 | |
| Output Voltage accuracy over temperature | VOUT | -2 | 1 | % | VOUT_NOM ≥ 1.8 V, −40°C ≤ TJ ≤ 125°C | 4 | |
| Line Regulation | LineReg | 0.02 | 0.15 | %/V | VIN = VOUT−NOM + 0.5 V to 5.25 V, VIN ≥ 1.6 V | 4 | |
| Load Regulation | LoadReg | 1 | 10 | mV | 1 mA ≤ IOUT ≤ 500 mA, VIN ≥ 1.75 V | 4 | |
| Dropout Voltage | VDO | 110 | 190 | mV | IOUT = 500 mA, 3.0 V ≤ VOUT < 3.6 V | 4 | |
| Quiescent Current | IQ | 60 | 90 | A | IOUT = 0 mA | 4 | |
| Standby Current | ISTBY | 0.1 | 1.5 | A | VEN = 0 V | 4 | |
| Output Current Limit | IOUT | 510 | 800 | mA | VOUT = VOUT−NOM − 100 mV, VIN = VOUT−NOM + 0.5 V or VIN = 1.75 V (whichever is higher) | 4 | |
| Output Current Limit | IOUT | 300 | 600 | mA | VOUT = VOUT−NOM − 100 mV, VIN = VOUT−NOM + 0.5 V or VIN = 1.6 V (whichever is higher) | 4 | |
| Short Circuit Current | ISC | 510 | 800 | mA | VOUT = 0 V, VIN ≥ 1.75 V | 4 | |
| EN Input Voltage High | VENH | 1 | V | EN Input Voltage “H” | 4 | ||
| EN Input Voltage Low | VENL | 0.4 | V | EN Input Voltage “L” | 4 | ||
| Enable Input Current | IEN | 0.15 | 0.6 | A | VEN = VIN = 5.5 V | 4 | |
| Power Supply Rejection Ratio | PSRR | 75 | dB | f = 1 kHz, Ripple 0.2 Vp−p, VIN = VOUT−NOM + 1.0 V, IOUT = 30 mA (VOUT ≤ 2.0 V, VIN = 3.0 V) | 4 | ||
| Output Noise | 54 | VRMS | f = 10 Hz to 100 kHz | 4 | |||
| Output Discharge Resistance (NCV8177A option only) | RACTDIS | 60 | VIN = 4.0 V, VEN = 0 V, VOUT = VOUT−NOM | 4 | |||
| Thermal Shutdown Temperature | TSD_TEMP | 175 | °C | Temperature rising from 25°C | 4 | ||
| Thermal Shutdown Hysteresis | TSD_HYST | 20 | °C | Temperature falling from TSD_TEMP | 4 | ||
| Input Voltage | IN | -0.3 | 6 | V | 3 | ||
| Output Voltage | OUT | -0.3 | V | Max = VIN + 0.3 V | 3 | ||
| Chip Enable Input | EN | -0.3 | 6 | V | 3 | ||
| Operating Ambient Temperature Range | TA | -40 | 125 | °C | 3 | ||
| Maximum Junction Temperature | TJ(MAX) | 150 | °C | 3 | |||
| Storage Temperature | TSTG | -55 | 150 | °C | 3 | ||
| ESD Capability, Human Body Model | ESDHBM | 2000 | V | JESD22-A114 | 3 | ||
| ESD Capability, Machine Model | ESDMM | 200 | V | JESD22-A115 | 3 | ||
| Thermal Resistance, Junction-to-Ambient (XDFN4) | RJA | 223 | °C/W | XDFN4, measured per JEDEC board specification (JESD51-7) | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | Larger copper area connected to the pins will also improve | 10 |
CAD (KiCad official)
- Symbol:
NCV8177AMX330TCG - Footprint:
Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm - 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files:
ncv8177amx330tcg-etched.step/ncv8177amx330tcg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ncv8177amx330tcg.step/ncv8177amx330tcg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (14 pp, sha256
93a437c5a0f9153a, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).