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Contents

README

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NCV8170BXV300T2G

onsemi · Linear Voltage Regulators (LDO) · SOT-563-6

NCV8170BXV300T2G from onsemi, in a SOT-563-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Power supply input voltage, operating range 2.2 V to 5.5 V (absolute maximum 6.0 V).
2 GND power_in Power supply ground.
3 OUT power_out Regulated output pin, 150 mA output current, requires 1.0 µF or greater ceramic output capacitor placed close to the pin.
4 NC unconnected No connect.
5 GND power_in Power supply ground.
6 EN input Chip enable, active high: device disabled below 0.4 V and enabled above 1.2 V; connect to IN if enable function is not required.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-563-6
Category Power Management ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 2.2 5.5 V 8
Output Voltage VOUT 2.97 3 3.03 V TA = +25°C 8
Output Voltage VOUT 2.94 3 3.06 V -40°C ≤ TJ ≤ 125°C 8
Line Regulation LineReg 0.05 0.2 %/V 4.0 V < VIN ≤ 5.5 V, IOUT = 1 mA 8
Load Regulation LoadReg -20 1 20 mV 0 mA < IOUT ≤ 150 mA, VIN = 4 V 8
Dropout Voltage VDO 190 260 mV IOUT = 150 mA 8
Output Current IOUT 150 mA 8
Quiescent Current IQ 0.5 0.9 µA IOUT = 0 mA 8
Standby Current ISTB 0.1 0.5 µA VEN = 0 V, TJ = 25°C 8
EN Pin Threshold Voltage High VENH 1.2 V EN Input Voltage "H" 8
EN Pin Threshold Voltage Low VENL 0.4 V EN Input Voltage "L" 8
Short Circuit Current Limit ISC 195 mA VOUT = 0 V 8
EN Pull Down Current IEN 10 nA VEN ≤ VIN ≤ 5.5 V 8
Power Supply Rejection Ratio PSRR 47 dB f = 1 kHz, VIN = 4.0 V + 200 mVpp Modulation, IOUT = 150 mA 8
Output Noise Voltage VNOISE 120 µVrms VIN = 5.5 V, IOUT = 1 mA, f = 100 Hz to 1 MHz, COUT = 1 µF 8
Thermal Shutdown Temperature TSD 175 °C Temperature Increasing from TJ = +25°C 8
Thermal Shutdown Hysteresis TSDH 25 °C Temperature Falling from TSD 8
Input Voltage VIN 6 V 2
Output Voltage VOUT -0.3 V -0.3 to VIN + 0.3 V 2
Chip Enable Input VCE -0.3 6 V 2
Maximum Junction Temperature TJ(MAX) 125 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V 2
ESD Capability, Machine Model ESDMM 200 V 2
Thermal Resistance, Junction-to-Air RθJA 200 °C/W SOT-563 2

CAD (KiCad official)

  • Symbol: NCV8170BXV300T2G
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563-6 (KiCad packages3D, STEP)
  • 3D model files: ncv8170bxv300t2g-etched.step / ncv8170bxv300t2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncv8170bxv300t2g.step / ncv8170bxv300t2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (23 pp, sha256 c96e72681ee339b5, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF