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NCV8170BXV250T2G

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onsemi Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOT-563. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NCV8170BXV250T2G

onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-563

NCV8170BXV250T2G from onsemi, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Power supply input; the absolute maximum input voltage is 6.0 V.
2 GND power_in Power supply ground.
3 OUT power_out Regulated output; VOUT is rated from −0.3 V to VIN + 0.3 V.
4 NC unconnected No connect.
5 GND power_in Power supply ground.
6 EN input Chip enable pin, active high ("H"); absolute maximum chip enable input range is −0.3 V to 6.0 V.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-563
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 2.2 5.5 V 6
Output Voltage VOUT 2.475 2.5 2.525 V TA = +25°C 6
Output Voltage VOUT 2.45 2.5 2.55 V −40°C ≤ TJ ≤ 125°C 6
Line Regulation LineReg 0.05 0.2 %/V 3.5 V < VIN ≤ 5.5 V, IOUT = 1 mA 6
Load Regulation LoadReg -20 1 20 mV 0 mA < IOUT ≤ 150 mA, VIN = 3.5 V 6
Dropout Voltage VDO 240 350 mV IOUT = 150 mA 6
Output Current IOUT 150 mA 6
Quiescent Current IQ 0.5 0.9 A IOUT = 0 mA 6
Standby Current ISTB 0.1 0.5 A VEN = 0 V, TJ = 25°C 6
EN Pin Threshold Voltage (H) VENH 1.2 V EN Input Voltage “H” 6
EN Pin Threshold Voltage (L) VENL 0.4 V EN Input Voltage “L” 6
Input Voltage VIN 6 V Note 1 2
Output Voltage VOUT -0.3 V Printed as −0.3 to VIN + 0.3 V; upper limit not a fixed number 2
Chip Enable Input VCE -0.3 6 V 2
Maximum Junction Temperature TJ(MAX) 125 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V Note 2, tested per AEC-Q100-002 2
ESD Capability, Machine Model ESDMM 200 V Note 2, tested per AEC-Q100-003 2
Thermal Resistance, Junction-to-Air RJA 200 °C/W SOT−563 package 2

CAD (KiCad official)

  • Symbol: NCV8170BXV250T2G
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: ncv8170bxv250t2g-etched.step / ncv8170bxv250t2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncv8170bxv250t2g.step / ncv8170bxv250t2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (23 pp, sha256 c96e72681ee339b5, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF