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NCV8170AMX330TCG

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onsemi Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOT-563. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

componentpower management (pmic)ncv8170amx330tcg
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docs ncv8170amx330tcg: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
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ncv8170amx330tcg-etched.fit.json ncv8170amx330tcg: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
ncv8170amx330tcg-etched.glb ncv8170amx330tcg: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
ncv8170amx330tcg-etched.step ncv8170amx330tcg: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
ncv8170amx330tcg.glb Publish 0.1.0 · Ray 2mo ago
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package.json Publish 0.1.0 · Ray 2mo ago
page.json ncv8170amx330tcg: specified limits as data (metadata.characteristics, 20 rows from the datasheet) · Ray 26d ago
README.md ncv8170amx330tcg: specified limits as data (metadata.characteristics, 20 rows from the datasheet) · Ray 26d ago

NCV8170AMX330TCG

onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-563

NCV8170AMX330TCG from onsemi, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated 3.3 V output pin. Delivers up to 150 mA with typical 180 mV dropout at 150 mA (VIN = 4.3 V). Requires a 1 µF ceramic COUT for stability; active discharge (~100 Ω) pulls this pin to GND when EN is low.
2 GND power_in Device ground and reference return. Also connected internally to the exposed pad (EPAD) on the XDFN4 package.
3 EN input Chip enable, active high. VENH ≥ 1.2 V enables the regulator; VENL ≤ 0.4 V forces the device into standby (~100 nA ISTB) and, on A-option devices, activates the ~100 Ω active output discharge. Absolute max VCE = -0.3 V to 6.0 V; must not exceed VIN + 0.3 V (see abs max).
4 IN power_in Power supply input, 2.2 V to 5.5 V operating (6.0 V absolute max). Requires a 1 µF ceramic CIN close to the pin for line-transient rejection and stability.
EPAD EPAD power_in Exposed thermal pad on the underside of the XDFN4 package. Internally connected to GND; solder to the PCB ground plane for the specified thermal resistance (RθJA ≈ 250 °C/W).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-563
Category Power Management (PMIC)
Pins 5

Ordering variants

Same part, different packaging or reel option.

  • NCV8170AMX330TCG
  • NCV8170AMX330TCGXV

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 2.2 5.5 V 9
Output Voltage VOUT 3.267 3.3 3.333 V TA = +25°C 9
Output Voltage VOUT 3.234 3.3 3.366 V −40°C ≤ TJ ≤ 125°C 9
Line Regulation LineReg 0.05 0.2 %/V 4.3 V < VIN ≤ 5.5 V, IOUT = 1 mA 9
Load Regulation LoadReg -20 1 20 mV 0 mA < IOUT ≤ 150 mA, VIN = 4.3 V 9
Dropout Voltage VDO 180 250 mV IOUT = 150 mA 9
Output Current IOUT 150 mA 9
Quiescent Current IQ 0.5 0.9 µA IOUT = 0 mA 9
Standby Current ISTB 0.1 0.5 µA VEN = 0 V, TJ = 25°C 9
EN Pin Threshold Voltage (High) VENH 1.2 V EN Input Voltage “H” 9
EN Pin Threshold Voltage (Low) VENL 0.4 V EN Input Voltage “L” 9
Input Voltage VIN 6 V 2
Output Voltage VOUT -0.3 V Upper limit printed as VIN + 0.3 V 2
Chip Enable Input Voltage VCE -0.3 6 V 2
Maximum Junction Temperature TJ(MAX) 125 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V Tested per AEC-Q100-002 (EIA/JESD22-A114) 2
ESD Capability, Machine Model ESDMM 200 V Tested per AEC-Q100-003 (EIA/JESD22-A115) 2
Operating Junction Temperature TJ -40 125 °C Range stated in electrical characteristics header 9
Thermal Resistance, Junction-to-Air (XDFN4 1 × 1 mm) RJA 250 °C/W XDFN4 1 × 1 mm package 2

CAD (KiCad official)

  • Symbol: NCV8170AMX330TCG
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: ncv8170amx330tcg-etched.step / ncv8170amx330tcg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncv8170amx330tcg.step / ncv8170amx330tcg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (23 pp, sha256 c96e72681ee339b5, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF