component
NCV8170AMX330TCG
Public Made by Adomby adom
onsemi Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOT-563. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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page.json+8−5@@ -32,7 +32,7 @@ "number": "1", "name": "OUT", "type": "power_out",- "description": "Regulated 3.3 V output pin. Delivers up to 150 mA with typical 180 mV dropout at 150 mA (VIN = 4.3 V). Requires a 1 \u00b5F ceramic COUT for stability; active discharge (~100 \u03a9) pulls this pin to GND when EN is low."+ "description": "Regulated 3.3 V output pin. Delivers up to 150 mA with typical 180 mV dropout at 150 mA (VIN = 4.3 V). Requires a 1 µF ceramic COUT for stability; active discharge (~100 Ω) pulls this pin to GND when EN is low." }, { "number": "2",@@ -44,19 +44,19 @@ "number": "3", "name": "EN", "type": "input",- "description": "Chip enable, active high. VENH \u2265 1.2 V enables the regulator; VENL \u2264 0.4 V forces the device into standby (~100 nA ISTB) and, on A-option devices, activates the ~100 \u03a9 active output discharge. Absolute max VCE = -0.3 V to 6.0 V; must not exceed VIN + 0.3 V (see abs max)."+ "description": "Chip enable, active high. VENH ≥ 1.2 V enables the regulator; VENL ≤ 0.4 V forces the device into standby (~100 nA ISTB) and, on A-option devices, activates the ~100 Ω active output discharge. Absolute max VCE = -0.3 V to 6.0 V; must not exceed VIN + 0.3 V (see abs max)." }, { "number": "4", "name": "IN", "type": "power_in",- "description": "Power supply input, 2.2 V to 5.5 V operating (6.0 V absolute max). Requires a 1 \u00b5F ceramic CIN close to the pin for line-transient rejection and stability."+ "description": "Power supply input, 2.2 V to 5.5 V operating (6.0 V absolute max). Requires a 1 µF ceramic CIN close to the pin for line-transient rejection and stability." }, { "number": "EPAD", "name": "EPAD", "type": "power_in",- "description": "Exposed thermal pad on the underside of the XDFN4 package. Internally connected to GND; solder to the PCB ground plane for the specified thermal resistance (R\u03b8JA \u2248 250 \u00b0C/W)."+ "description": "Exposed thermal pad on the underside of the XDFN4 package. Internally connected to GND; solder to the PCB ground plane for the specified thermal resistance (RθJA ≈ 250 °C/W)." } ], "provenance": {@@ -130,5 +130,8 @@ "docs/ncv8170amx330tcg-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }