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Contents

README

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NCV8114BSN330T1G

onsemi · Linear Voltage Regulators (LDO) · TSOP-5

NCV8114BSN330T1G from onsemi, in a TSOP-5. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Input supply pin. Operating input voltage range 1.7 V to 5.5 V (absolute max −0.3 V to 6 V). A small ceramic capacitor (≥1 µF X5R/X7R recommended) should be placed close to this pin to ground to assure stability.
2 GND power_in Power supply ground reference for the regulator. Should be tied to the shortest path to the ground plane; exposed/heat-spreader area on this pin improves thermal performance.
3 EN input Enable input. Driving EN above 0.9 V (VEN_HI) turns the regulator on; driving EN below 0.4 V (VEN_LO) places the device in shutdown mode. Has an internal pull-down current source (~300 nA typ) that keeps the device off if EN is floating. If EN is not used, tie directly to IN. Absolute max −0.3 V to VIN + 0.3 V or 6 V.
4 N/C unconnected Not connected internally. May be tied to ground to improve thermal dissipation (thermal-only tie, no electrical function).
5 OUT power_out Regulated output voltage pin. For NCV8114BSN330T1G this pin regulates to 3.3 V nominal, up to 300 mA (typ current limit 600 mA). Requires a ≥1 µF ceramic (X5R/X7R) output capacitor from this pin to ground for stability.

Key specifications

Parameter Value
Manufacturer onsemi
Package TSOP-5
Category Power Supply Chip
Pins 5

Ordering variants

Same part, different packaging or reel option.

  • NCV8114BSN330T1GBSN120T1G
  • NCV8114BSN330T1GBSN150T1G
  • NCV8114BSN330T1GBSN180T1G
  • NCV8114BSN330T1GBSN280T1G
  • NCV8114BSN300T1G
  • NCV8114BSN330T1G
  • NCV8114BSN330T1GASN120T1G
  • NCV8114BSN330T1GASN150T1G
  • NCV8114BSN330T1GASN165T1G
  • NCV8114BSN330T1GASN180T1G
  • NCV8114BSN330T1GASN250T1G
  • NCV8114BSN330T1GASN280T1G
  • NCV8114BSN330T1GASN300T1G
  • NCV8114BSN330T1GASN330T1G

CAD (KiCad official)

  • Symbol: NCV8114BSN330T1G
  • Footprint: Package_SO:TSOP-5_1.65x3.05mm_P0.95mm
  • 3D model: TSOP-5 (KiCad packages3D, STEP)
  • 3D model files: ncv8114bsn330t1g-etched.step / ncv8114bsn330t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncv8114bsn330t1g.step / ncv8114bsn330t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (13 pp, sha256 f23c2c365bfad19b, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF