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Contents

README

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NCV78M08BDTRKG

onsemi · Linear Voltage Regulators (LDO) · DPAK

NCV78M08BDTRKG from onsemi, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Input power_in Unregulated input voltage pin; maximum input voltage is 35 Vdc for 5.0 V-18 V versions, and a 0.33 µF or larger bypass capacitor is recommended close to this pin if supply wires are long.
2 Ground power_in Ground pin, also connected internally to the heatsink surface (tab, shown as terminal 4 in the case outline).
3 Output power_out Regulated 8.0 V output (7.70 V to 8.30 V at TJ = 25°C) for the NCV78M08B, with a maximum output current of 500 mA with adequate heatsinking.

Key specifications

Parameter Value
Manufacturer onsemi
Package DPAK
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage (TJ = 25°C) VO 7.7 8 8.3 Vdc TJ = 25°C 3
Output Voltage Variation VO 7.6 8.4 Vdc 10.5 Vdc ≤ VI ≤ 23 Vdc, 5.0 mA ≤ IO ≤ 350 mA 3
Line Regulation Regline 6 50 mV TJ = 25°C, 10.5 Vdc ≤ VI ≤ 25 Vdc, IO = 200 mA 3
Load Regulation Regload 25 160 mV TJ = 25°C, 5.0 mA ≤ IO ≤ 500 mA 3
Load Regulation Regload 10 80 mV TJ = 25°C, 5.0 mA ≤ IO ≤ 200 mA 3
Input Bias Current (TJ = 25°C) IIB 3.2 6 mA TJ = 25°C 3
Quiescent Current Change IIB 0.8 mA 10.5 Vdc ≤ VI ≤ 25 Vdc, IO = 200 mA 3
Quiescent Current Change IIB 0.5 mA 5.0 mA ≤ IO ≤ 350 mA 3
Ripple Rejection RR 56 dB IO = 100 mA, f = 120 Hz, 11.5 V ≤VI ≤ 21.5 V 3
Ripple Rejection RR 56 80 dB IO = 300 mA, f = 120 Hz, 11.5 V ≤VI ≤ 21.5 V, TJ = 25°C 3
Maximum Input Voltage (5.0 V−18 V output group) VI 35 Vdc (5.0 V−18 V) 2
Operating Junction Temperature Range TJ 150 °C 2
Storage Temperature Range Tstg -65 150 °C 2
Thermal Resistance, Junction-to-Air (DT suffix) θJA 92 °C/W DT suffix (DPAK) 2
Thermal Resistance, Junction-to-Case (DT suffix) θJC 5 °C/W DT suffix (DPAK) 2
Dropout Voltage (TJ = 25°C) VI−VO 2 Vdc TJ = 25°C 3
Short Circuit Current Limit IOS 350 mA TJ = 25°C, VI = 35 V 3
Average Temperature Coefficient of Output Voltage VO/T 0.2 mV/°C IO = 5.0 mA 3
Peak Output Current (TJ = 25°C) IO 700 mA TJ = 25°C 3
Output Noise Voltage (TA = 25°C, 10 Hz ≤ f ≤ 100 kHz) Vn 52 V TA = 25°C, 10 Hz ≤ f ≤ 100 kHz 3

CAD (KiCad official)

  • Symbol: NCV78M08BDTRKG
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: ncv78m08bdtrkg-etched.step / ncv78m08bdtrkg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncv78m08bdtrkg.step / ncv78m08bdtrkg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (16 pp, sha256 e443e04634baeb42, retrieved 2026-11-08, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF