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NCV1117DT33T5G

onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TO-252-2(DPAK)

NCV1117DT33T5G from onsemi, in a TO-252-2(DPAK). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Adjust/Ground power_in Adjust/ground pin: on the adjustable devices it sets the reference, and on the fixed-output devices (including the 3.3 V version) it is the ground terminal, with ground current of 3.0 mA to 5.0 mA depending on output voltage.
2 Output power_out Regulated output, also connected to the heatsink tab; for the 3.3 V version the output is 3.235 V to 3.365 V over Vin 4.75 V to 10 V and Iout 0 mA to 800 mA.
3 Input power_in Input supply pin, rated to 20 V maximum input voltage, with a 10 µF bypass capacitor recommended at Cin.

Key specifications

Parameter Value
Manufacturer onsemi
Package TO-252-2(DPAK)
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage, 3.3 V fixed (Vin = 5.3 V, Iout = 10 mA, TA = 25 °C) Vout 3.267 3.3 3.333 V Vin = 5.3 V, Iout = 10 mA, TA = 25 °C 4
Output Voltage, 3.3 V fixed (over line and load) Vout 3.235 3.365 V Vin = 4.75 V to 10 V, Iout = 0 mA to 800 mA (Note 4) 4
Line Regulation, 3.3 V Regline 0.8 4.5 mV Vin = 4.75 V to 15 V, Iout = 0 mA 4
Load Regulation, 3.3 V Regline 4.3 10 mV Iout = 0 mA to 800 mA, Vin = 4.75 V 4
Dropout Voltage (Iout = 100 mA) Vin-Vout 0.95 1.1 V Measured at Vout - 100 mV, Iout = 100 mA 4
Dropout Voltage (Iout = 500 mA) Vin-Vout 1.01 1.15 V Measured at Vout - 100 mV, Iout = 500 mA 4
Dropout Voltage (Iout = 800 mA) Vin-Vout 1.07 1.2 V Measured at Vout - 100 mV, Iout = 800 mA 4
Output Current Limit Iout 1000 1500 2200 mA Vin-Vout = 5.0 V, TA = 25°C (Note 6) 4
Quiescent Current, 3.3 V IQ 6 10 mA Vin = 15 V 5
Thermal Regulation 0.01 0.1 %/W TA = 25°C, 30 ms Pulse 5
Ripple Rejection, 3.3 V RR 60 64 dB Vin-Vout = 6.4 V, Iout = 500 mA, 10 Vpp 120 Hz Sinewave 5
Adjust Pin Current Iadj 52 120 µA Vin = 11.25 V, Iout = 800 mA 5
Adjust Pin Current Change Iadj 0.4 5 µA Vin-Vout = 1.4 V to 10 V, Iout = 10 mA to 800 mA 5
Input Voltage Vin 20 V Note 1 3
Maximum Die Junction Temperature Range TJ -55 150 °C 3
Storage Temperature Range Tstg -65 150 °C 3
Operating Ambient Temperature Range (NCV1117) TA -40 125 °C NCV1117 grade 3
Thermal Resistance, Junction-to-Ambient, Minimum Size Pad (DPAK) RJA 67 °C/W Minimum size pad, DPAK 3
Thermal Resistance, Junction-to-Case (DPAK) RJC 6 °C/W DPAK 3

CAD (KiCad official)

  • Symbol: NCV1117DT33T5G
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2(DPAK) (KiCad packages3D, STEP)
  • 3D model files: ncv1117dt33t5g-etched.step / ncv1117dt33t5g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncv1117dt33t5g.step / ncv1117dt33t5g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (20 pp, sha256 c962358436ca7db6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF