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NCV1117DT12RKG

onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · DPAK

NCV1117DT12RKG from onsemi, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Adjust/Ground power_in Pin 1 is the Adjust/Ground terminal; on the fixed 12 V device it serves as the ground reference, and the datasheet gives no separate electrical limit for it.
2 Output power_out Regulated 12 V output, specified at 11.88 V to 12.12 V (Vin = 14 V, Iout = 10 mA, 25 °C) and 11.76 V to 12.24 V over Vin = 13.5 V to 20 V and Iout = 0 mA to 800 mA; output current must not exceed 1.0 A when Vin is greater than 12 V. The heatsink tab is connected to this pin.
3 Input power_in Unregulated input supply, with a maximum input voltage of 20 V; the 12 V fixed device is specified for Vin = 13.5 V to 20 V at Iout = 0 mA to 800 mA.

Key specifications

Parameter Value
Manufacturer onsemi
Package DPAK
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage (25 °C) Vout 11.88 12 12.12 V Vin = 14 V, Iout = 10 mA, TA = 25 °C 3
Output Voltage (full range) Vout 11.76 12.24 V Vin = 13.5 V to 20 V, Iout = 0 mA to 800 mA (Note 4) 3
Line Regulation Regline 1 7.5 mV Vin = 13.5 V to 20 V, Iout = 0 mA 3
Load Regulation Regline 16 28 mV Iout = 0 mA to 800 mA, Vin = 13.5 V 3
Dropout Voltage Vin−Vout 1.1 V Iout = 100 mA 3
Dropout Voltage Vin−Vout 1.15 V Iout = 500 mA 3
Dropout Voltage Vin−Vout 1.2 V Iout = 800 mA 3
Output Current Limit Iout 1000 1500 2200 mA Vin−Vout = 5.0 V, TA = 25°C, Note 6 3
Quiescent Current IQ 6 10 mA Vin = 20 V 4
Ripple Rejection RR 50 54 dB Vin−Vout = 6.4 V, Iout = 500 mA, 10 Vpp 120 Hz Sinewave 4
Thermal Regulation 0.01 0.1 %/W TA = 25°C, 30 ms Pulse 4
Input Voltage Vin 20 V Note 1 2
Maximum Die Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range Tstg -65 150 °C 2
Operating Ambient Temperature Range TA -40 125 °C NCV1117 2
Thermal Resistance, Junction-to-Ambient (DPAK) RJA 67 °C/W Minimum Size Pad 2
Thermal Resistance, Junction-to-Case (DPAK) RJC 6 °C/W 2

CAD (KiCad official)

  • Symbol: NCV1117DT12RKG
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: ncv1117dt12rkg-etched.step / ncv1117dt12rkg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncv1117dt12rkg.step / ncv1117dt12rkg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (19 pp, sha256 7c98b7d1b0c0f0b4, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF