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NCP716BSN500T1G

onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TSOP-5

NCP716BSN500T1G from onsemi, in a TSOP-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output voltage pin; a small 1.0 µF ceramic capacitor is needed from this pin to ground to assure stability.
2 GND power_in Power supply ground.
3 IN power_in Input pin with an operating input voltage range of 2.5 V to 24 V; a small capacitor is needed from this pin to ground to assure stability.
4 N/C unconnected No connection; this pin can be tied to ground to improve thermal dissipation or left disconnected.
5 N/C unconnected No connection; this pin can be tied to ground to improve thermal dissipation or left disconnected.

Key specifications

Parameter Value
Manufacturer onsemi
Package TSOP-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 2.5 24 V 3
Output Voltage Accuracy VOUT 4.9 5 5.1 V −40°C ≤ TJ ≤ 125°C 3
Line Regulation RegLINE 4 10 mV VOUT + 1 V ≤ VIN ≤ 24 V, IOUT = 0.1 mA 3
Load Regulation RegLOAD 0.0013 0.008 %/mA IOUT = 0.1 mA to 150 mA 3
Dropout Voltage VDO 600 955 mV VOUT = 0.97 VOUT(NOM), IOUT = 150 mA 3
Ground Current IGND 3.2 4.7 A IOUT = 0 mA, −40 < TA < 125°C 3
Input Voltage (absolute maximum) VIN -0.3 24 V Note 1 2
Output Voltage (absolute maximum) VOUT -0.3 6 V 2
Maximum Junction Temperature TJ(MAX) 150 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V Note 2, tested per EIA/JESD22−A114 2
ESD Capability, Machine Model ESDMM 200 V Note 2, tested per EIA/JESD22−A115 2
Thermal Resistance, Junction-to-Air, TSOP-5 RJA 250 °C/W 2
Thermal Shutdown Hysteresis TSDH -10 °C Temperature falling from TSD; Note 8 3

CAD (KiCad official)

  • Symbol: NCP716BSN500T1G
  • Footprint: Package_SO:TSOP-5_1.65x3.05mm_P0.95mm
  • 3D model: TSOP-5 (KiCad packages3D, STEP)
  • 3D model files: ncp716bsn500t1g-etched.step / ncp716bsn500t1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp716bsn500t1g.step / ncp716bsn500t1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 e6c31af935c04f35, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF