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Contents

README

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NCP59151MN50TYG

onsemi · Global Sourcing Parts · DFN-8-EP(4x4)

NCP59151MN50TYG from onsemi, in a DFN-8-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference for the regulator. All voltages referenced to this pin. The exposed pad (EP) must also be tied to GND for heat removal.
2 EN input Enable input, CMOS/TTL logic compatible. Logic high (>=1.8 V typ) enables the regulator; logic low (<=0.8 V) shuts it down. Absolute max 18 V; do not leave floating. In shutdown draws only microamperes of leakage.
3 VIN power_in Input voltage supply that powers both internal circuitry and the pass-element load current. Recommended operating range 2.24 V to 13.5 V (18 V absolute max). A ~1 uF ceramic bypass capacitor is recommended within 1 inch of the pin.
4 NC unconnected Not internally connected. May be left floating or tied to GND.
5 NC unconnected Not internally connected. May be left floating or tied to GND.
6 VOUT power_out Regulated linear regulator output, factory-trimmed to 5.0 V on this option code (MN50). Rated for output currents in excess of 1.5 A with typical dropout of 300 mV at 1.5 A. Requires a >=47 uF ceramic output capacitor for stability.
7 VOUT_SENSE input Fixed voltage regulator feedback (remote sense) input. Must be connected to the output voltage node (typically directly to VOUT at the load) so the internal error amplifier can regulate the trimmed output. On the adjustable NCP59152 variant this pin is ADJ instead.
8 FLG output Error flag open-collector output. Pulled low to signal an output fault (VOUT below ~95% of nominal or thermal/current-limit event); high-impedance during normal operation. Sinks up to 5 mA and withstands up to 18 V; requires an external pull-up resistor.
EP EP power_in Exposed thermal pad on the underside of the DFN8 package used for heat removal. Must be connected to GND (electrically identical to pin 1) and to a copper heat-spreading area (~500 mm2, 2 oz Cu) to achieve the specified 75 C/W junction-to-ambient thermal resistance.

Key specifications

Parameter Value
Manufacturer onsemi
Package DFN-8-EP(4x4)
Category Global Sourcing Parts
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • NCP59151MN50TYGMN18TYG
  • NCP59151MN50TYGMN25TYG
  • NCP59151MN50TYGMN28TYG
  • NCP59151MN50TYGMN30TYG
  • NCP59151MN50TYGMN33TYG
  • NCP59151MN50TYG
  • NCP59151MN50TYGMNADJTYG
  • NCP59151MN50TYGDS18R4G
  • NCP59151MN50TYGDS25R4G
  • NCP59151MN50TYGDS28R4G
  • NCP59151MN50TYGDS30R4G
  • NCP59151MN50TYGDS33R4G
  • NCP59151MN50TYGDS50R4G
  • NCP59151MN50TYGDSADJR4G

CAD (KiCad official)

  • Symbol: NCP59151MN50TYG
  • Footprint: Package_DFN_QFN:DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm
  • 3D model: DFN-8-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: ncp59151mn50tyg-etched.step / ncp59151mn50tyg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp59151mn50tyg.step / ncp59151mn50tyg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (14 pp, sha256 9d5038bd5d72819b, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF