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NCP45521IMNTWG-H

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onsemi Power Distribution Switches, DFN-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NCP45521IMNTWG-H

onsemi · Power Distribution Switches · DFN-8-EP(2x2)

NCP45521IMNTWG-H from onsemi, in a DFN-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Drain of the internal MOSFET, operating from 0.5 V to 13.5 V; pin 1 must be connected to pin 9.
2 EN input Active-high digital enable for the MOSFET (NCP45521-H) with an internal pull-down to GND; EN input high level is 2 V minimum and low level is 0.8 V maximum.
3 VCC power_in Supply voltage to the controller, specified from 3.0 V to 5.5 V.
4 GND power_in Controller ground.
5 BLEED passive Load bleed connection that must be tied to VOUT either directly or through a resistor of 1 kΩ or less.
6 SR passive Slew rate adjustment pin for NCP45521; it may be left floating, and an external capacitor CSR to GND can lower the output slew rate.
7 VOUT power_out Source of the internal MOSFET, connected to the load.
8 VOUT power_out Source of the internal MOSFET, connected to the load.
9 VIN power_in Drain of the internal MOSFET (0.5 V to 13.5 V); must be connected to pin 1.

Key specifications

Parameter Value
Manufacturer onsemi
Package DFN-8-EP(2x2)
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage Range VCC -0.3 6 V 2
Input Voltage Range VIN -0.3 18 V 2
Output Voltage Range VOUT -0.3 18 V 2
EN Digital Input Range VEN -0.3 V 2
Thermal Resistance, Junction-to-Ambient, Steady State RθJA 40 °C/W Note 2: FR4, 1 sq-in pad, 1 oz Cu 2
Thermal Resistance, Junction-to-Ambient, Steady State RθJA 72.7 °C/W Note 3: FR4, minimum recommended pad size, 1 oz Cu 2
Thermal Resistance, Junction-to-Case (VIN Paddle) RθJC 5.3 °C/W 2
Continuous MOSFET Current IMAX 10.5 A TA = 25°C; Notes 2 and 4 2
Continuous MOSFET Current IMAX 7.8 A TA = 25°C; Notes 3 and 4 2
Transient MOSFET Current IMAX_TRANS 24 A for up to 500 s 2
Total Power Dissipation PD 2.5 W TA = 25°C; Note 2 2
Total Power Dissipation PD 1.37 W TA = 25°C; Note 3 2
Storage Temperature Range TSTG -40 150 °C 2
Lead Temperature, Soldering TSLD 260 °C 10 sec. 2
ESD Capability, Human Body Model ESDHBM 3 kV Notes 5 and 6 2
ESD Capability, Machine Model ESDMM 200 V Note 5 2
ESD Capability, Charged Device Model ESDCDM 1 kV Note 5 2
Latch-up Current Immunity LU 100 mA Notes 5 and 6 2
Supply Voltage VCC 3 5.5 V 3
Input Voltage VIN 0.5 13.5 V 3
Ambient Temperature TA -40 85 °C 3
Junction Temperature TJ -40 125 °C 3
OFF to ON Transition Energy Dissipation Limit (See application section) ETRANS 0 100 mJ 3
On-Resistance RON 9.5 12.7 mΩ VCC = 3.3 V; VIN = 1.8 V 3
On-Resistance RON 10.1 13.9 mΩ VCC = 3.3 V; VIN = 5 V 3
On-Resistance RON 12.8 22.5 mΩ VCC = 3.3 V; VIN = 12 V 3
Leakage Current (Note 8) ILEAK 0.1 1 µA VEN = 0 V; VIN = 13.5 V 3
Supply Standby Current (Note 9) ISTBY 0.65 2 µA VEN = 0 V; VCC = 3 V 3
Supply Standby Current (Note 9) ISTBY 3.2 4.5 µA VEN = 0 V; VCC = 5.5 V 3
Supply Dynamic Current (Note 10) IDYN 280 400 µA VEN = VCC = 3 V; VIN = 12 V 3
Supply Dynamic Current (Note 10) IDYN 530 750 µA VEN = VCC = 5.5 V; VIN = 1.8 V 3
Bleed Resistance RBLEED 86 115 144 Ω VEN = 0 V; VCC = 3 V 3
Bleed Resistance RBLEED 72 97 121 Ω VEN = 0 V; VCC = 5.5 V 3
Bleed Pin Leakage Current IBLEED 6 10 µA VEN = VCC = 3 V, VIN = 1.8 V 3
Bleed Pin Leakage Current IBLEED 60 70 µA VEN = VCC = 3 V, VIN = 12 V 3
EN Input High Voltage VIH 2 V VCC = 3 V − 5.5 V 3
EN Input Low Voltage VIL 0.8 V VCC = 3 V − 5.5 V 3
EN Input Leakage Current IIL 90 500 nA NCP45521−H; VEN = 0 V 3
EN Pull Down Resistance RPD 76 100 124 kΩ NCP45521−H 3
Slew Rate Control Constant (Note 13) KSR 24 31 38 µA NCP45521; VCC = 3 V 3
VIN Undervoltage Lockout Threshold VUVLO 0.25 0.35 0.45 V VCC = 3 V 3
VIN Undervoltage Lockout Hysteresis VHYS 20 50 70 mV VCC = 3 V 3
Short-Circuit Protection Threshold VSC 200 265 350 mV VCC = 3 V; VIN = 0.5 V 3
Short-Circuit Protection Threshold VSC 100 285 500 mV VCC = 3 V; VIN = 13.5 V 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper the VIN and VOUT pins of the ecoSWITCH to copper 11

CAD (KiCad official)

  • Symbol: NCP45521IMNTWG-H
  • Footprint: Package_DFN_QFN:DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
  • 3D model: DFN-8-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: ncp45521imntwg-h-etched.step / ncp45521imntwg-h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp45521imntwg-h.step / ncp45521imntwg-h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (16 pp, sha256 4a943f4754df3c79, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF