# NCP45495XMNTWG

**onsemi** · Monitors & Reset Circuits · QFN-32(4x4)

NCP45495XMNTWG from onsemi, in a QFN-32(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN_N1 | input | Channel 1 sense resistor sense minus high-voltage input (recommended 5 to 26 V, absolute max 30 V). |
| 2 | IN_P1 | input | Channel 1 sense resistor sense plus high-voltage input (recommended 5 to 26 V, absolute max 30 V). |
| 3 | BV_IN1 | input | Channel 1 bus voltage input for voltage monitoring (absolute max 30 V). |
| 4 | IN_N2 | input | Channel 2 sense resistor sense minus high-voltage input (recommended 5 to 26 V, absolute max 30 V). |
| 5 | IN_P2 | input | Channel 2 sense resistor sense plus high-voltage input (recommended 5 to 26 V, absolute max 30 V). |
| 6 | BV_IN2 | input | Channel 2 bus voltage input for voltage monitoring (absolute max 30 V). |
| 7 | IMON_IN1 | input | Current monitor channel input, high impedance; float or ground if unused. |
| 8 | IMON_IN2 | input | Current monitor channel input, high impedance; float or ground if unused. |
| 9 | RGND | power_in | Reference ground for the multiplexer and differential amplifier. |
| 10 | NC | unconnected | No connect pin. |
| 11 | BV_IN3 | input | Channel 3 bus voltage input for voltage monitoring (absolute max 30 V). |
| 12 | IN_P3 | input | Channel 3 sense resistor sense plus high-voltage input (recommended 5 to 26 V, absolute max 30 V). |
| 13 | IN_N3 | input | Channel 3 sense resistor sense minus high-voltage input (recommended 5 to 26 V, absolute max 30 V). |
| 14 | BV_IN4 | input | Channel 4 bus voltage input for voltage monitoring (absolute max 30 V). |
| 15 | IN_P4 | input | Channel 4 sense resistor sense plus high-voltage input (recommended 5 to 26 V, absolute max 30 V). |
| 16 | IN_N4 | input | Channel 4 sense resistor sense minus high-voltage input (recommended 5 to 26 V, absolute max 30 V). |
| 17 | BG_REF_OUT | output | Buffered bandgap voltage analog output (-0.3 to 5.5 V). |
| 18 | BV_REF | input | BV_OK comparator threshold reference analog input. |
| 19 | DIFF_OUT_N | output | Negative differential analog output (-0.3 to 5.5 V); route matched with DIFF_OUT_P. |
| 20 | DIFF_OUT_P | output | Positive differential analog output (-0.3 to 5.5 V); route matched with DIFF_OUT_N. |
| 21 | ADRS[0] | input | I2C address bit 0 set input; tie to GND or VCC. |
| 22 | ADRS[1] | input | I2C address bit 1 set input; tie to GND or VCC. |
| 23 | SCL | input | I2C clock input (-0.3 to 5.5 V). |
| 24 | SDA | bidirectional | I2C data signal, input/output (-0.3 to 5.5 V). |
| 25 | SKIP | input | Skip function control that masks BV_OK; high level is VCC (2.8 to 3.8 V) and low level is GND. |
| 26 | NC | unconnected | No connect pin. |
| 27 | VCC | power_in | Device power supply, recommended 2.8 to 3.8 V (absolute max -0.3 to 5.5 V). |
| 28 | EN_B | input | Device enable bar input; when high, places the device in low-power state. |
| 29 | MUX_SEL | input | Multiplexer select input; keep isolated from other dynamic signals. |
| 30 | BV_OK | output | Bus OK open-drain output; high impedance means bus OK. |
| 31 | SYNC | output | Sync output that pulses at the beginning of every MUX_SEL sequence; float if unused. |
| 32 | NC | unconnected | No connect pin. |
| 33 | GND | power_in | Device ground (exposed back paddle), to be connected to GND. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | QFN-32(4x4) |
| Category | Power Supply Chip |
| Pins | 33 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage Range (Recommended) | VCC | 2.8 |  | 3.8 | V |  | 3 |
| Bus Input Pin Voltage Range | VIN_PX, VIN_Nx | 5 |  | 26 | V |  | 3 |
| Digital Input High Voltage | VIH | 0.945 |  |  | V | EN_B, SCLK, SDA, ADRS[x], MUX_SEL | 3 |
| Digital Input Low Voltage | VIL |  |  | 0.405 | V | EN_B, SCLK, SDA, ADRS[x], MUX_SEL | 3 |
| SKIP Input High Voltage | SKIPVIH | 2.8 |  | 3.8 | V |  | 3 |
| SKIP Input Low Voltage | SKIPVIL |  |  | 0.405 | V |  | 3 |
| Ambient Temperature | TA | -40 |  | 85 | °C |  | 3 |
| Junction Temperature | TJ | -40 |  | 125 | °C |  | 3 |
| Supply Voltage Range (Abs Max) | VCC | -0.3 |  | 5.5 | V | GND = 0 V | 3 |
| Bus Input Voltage Range | VBV_IN | -0.3 |  | 30 | V | BV_INx, IN_Px, IN_Nx; GND = 0 V | 3 |
| Digital Input Voltage Range | VLV | -0.3 |  | 5.5 | V | MUX_SEL, EN_B, SKIP, SCL, SDA, ADRS[x]; GND = 0 V | 3 |
| Low Voltage I/O Range | VLV | -0.3 |  | 5.5 | V | DIFF_OUT_P, DIFF_OUT_N, BV_OK, BG_REF_OUT; GND = 0 V | 3 |
| Operating Temperature Range | TA1 | -40 |  | 105 | °C |  | 3 |
| Functional Temperature Range | TA2 | -40 |  | 125 | °C |  | 3 |
| Maximum Junction Temperature | TJ |  |  | 125 | °C |  | 3 |
| Storage Temperature Range | TSTG | -40 |  | 150 | °C |  | 3 |
| Lead Temperature, Soldering | TSLD |  |  | 260 | °C | 10 sec. | 3 |
| Thermal Resistance, Junction-to-Air | RθJA |  | 40 |  | °C/W |  | 3 |
| Thermal Resistance, Junction-to-Case | RθJC |  | 5 |  | °C/W | VIN Paddle | 3 |
| BG_REF_OUT Voltage | VBG | 1.274 | 1.3 | 1.326 | V |  | 4 |
| BV_REF Voltage Range | BV_REF | 100 |  | 800 | mV |  | 4 |
| BV_OK Comparator Hysteresis |  | 7.5 | 10 | 12.5 | % |  | 4 |
| VCC range for BV_OK low impedance | VLI | 1 |  | 3.8 | V |  | 4 |
| VCC Threshold Reference for BV_OK Input (POR) | VBV_TH | 2.6 |  | 2.8 | V |  | 4 |
| Shunt Monitor Offset Voltage, room temp | VSM_OV | -150 |  | 150 | µV |  | 4 |
| Differential Amp Input Offset Voltage, 25°C | VD_OVRT | -2 |  | 2 | mV |  | 4 |
| Differential Amp Input Offset Voltage, -40°C to 105°C | VD_OVT | -6 |  | 6 | mV |  | 4 |
| Differential Amp Common-Mode Voltage | VCMR | 575 |  | 875 | mV |  | 4 |
| Differential Amp Closed Loop Gain | GDA | 0.994 | 1 | 1.006 | V/V | 3-sigma variation | 4 |
| Shunt Current Gain Range |  | 2 |  | 24 | V/V | See Table 6 | 4 |
| Shunt Current Gain Tolerance |  | -0.6 |  | 0.6 | % | 3-sigma variation | 4 |
| VBUS Gain Tolerance |  | -0.6 |  | 0.6 | % |  | 5 |
| MUX_SEL Timeout |  | 35 | 39 | 43 | s | from falling edge of MUX_SEL | 4 |
| Multiplexer Settling Time (to 9.375 mV) | TSTAB1 |  |  | 100 | ns | TJ = 25°C | 4 |
| Multiplexer Settling Time (to 3 mV) | TSTAB2 |  |  | 300 | ns | TJ = 25°C | 4 |
| Power-up Time | TPWR_UP |  |  | 40 | s | STANDBY or Limited Function to Full Function | 4 |
| I_VCC (Fully Functional) | IVCC_F |  |  | 2 | mA | EN_B = 0, MUX_SEL clocked at 2 MHz | 4 |
| I_VCC (Limited Function) | IVCC_L |  |  | 400 | µA | EN_B = Tristate | 4 |
| I_VCC (STANDBY) | IVCC_S |  |  | 200 | µA | VEN = VCC; for every IN_Px channel not floating | 5 |
| I_BV_IN (STANDBY mode) | IBV_IN_S |  |  | 2 | µA |  | 5 |
| I_BV_IN (LIMITED mode) | IBV_IN_L |  |  | 120 | µA |  | 5 |
| I_BV_IN (Full Function) | IBV_IN_F |  |  | 600 | µA |  | 5 |
| I_BV_IN (VCC floating) | IBV_IN |  |  | 2 | µA | VCC = FLOATING | 5 |
| I_IN_N (STANDBY/LIMITED) | IIN_N |  |  | 1 | µA | VCC = 2.8 V to 3.8 V | 5 |
| I_IN_P (STANDBY/LIMITED) | IIN_P |  |  | 1 | µA | VCC = 2.8 V to 3.8 V | 5 |
| I_IN_N (Full Function) |  |  |  | 60 | µA | VCC = 2.8 V to 3.8 V | 5 |
| I_IN_P (Full Function) |  |  |  | 60 | µA | VCC = 2.8 V to 3.8 V | 5 |
| IMONx Channel Input Leakage Current |  |  |  | 100 | nA |  | 4 |
| BG_REF_OUT maximum loading | IBG |  |  | 100 | µA |  | 4 |
| BV_OK Logic Low Impedance | RBV_OK |  |  | 300 | Ω |  | 4 |
| Shunt Monitor CMRR | SM_CMRR | 80 |  |  | dB | VIN_Px in valid range | 4 |
| Differential Amp PSRR | DA_PSRR | 54 |  |  | dB | VCC = 2.8 V to 3.8 V | 4 |
| Shunt Monitor Offset Voltage Drift | SM_VD |  |  | 2 | µV/°C |  | 4 |
| Differential Amp Capacitive Load Capability | CDIFF |  |  | 82 | pF |  | 4 |
| Differential Full Scale Output | VFSO | 800 |  |  | mVpp |  | 4 |
| Input Impedance (EN_B tri-stated) | RFLOAT | 100 |  |  | kΩ | EN_B pin tri-stated | 4 |
| ESD Capability, Human Body Model | ESDHBM | 2 |  |  | kV | AEC-Q100-002, TA = 25°C; printed as >2.0 | 3 |
| ESD Capability, Charged Device Model | ESDCDM | 0.5 |  |  | kV | JESD22-C101, TA = 25°C; printed as >0.5 | 3 |

## CAD (KiCad official)

- Symbol: `NCP45495XMNTWG`
- Footprint: `Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm`
- 3D model: QFN-32(4x4) (KiCad packages3D, STEP)
- 3D model files: `ncp45495xmntwg-etched.step` / `ncp45495xmntwg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ncp45495xmntwg.step` / `ncp45495xmntwg.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/ncp45495xmntw-d.pdf) (19 pp, sha256 `cddd0040872e7742`, retrieved 2026-10-22, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ncp45495xmntwg-datasheet.pdf)