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NCP4308DDR2G

onsemi · Monitors & Reset Circuits · SOIC-8

NCP4308DDR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage pin; the features list gives an operating voltage range up to VCC = 35 V.
2 MIN_TOFF input Adjusts the minimum off-time period through a resistor connected to ground.
3 MIN_TON input Adjusts the minimum on-time period through a resistor connected to ground.
4 NC unconnected Leave this pin open or tie it to ground.
5 NC unconnected Leave this pin open or tie it to ground (for version D this pin is NC; the MAX_TON function applies only to version Q).
6 CS input Current sense pin detects whether current flows through the SR MOSFET and/or its body diode; the basic turn-off detection threshold is 0 mV and a series resistor can decrease the turn-off threshold if needed.
7 GND power_in Ground connection for the SR MOSFET driver, VCC decoupling capacitor and the minimum on/off time adjust resistors; it should be wired directly to the SR MOSFET source using a Kelvin connection.
8 DRV output Driver output for the SR MOSFET; the features list gives 8 A / 4 A peak sink/source drive capability.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 37 V 6
MIN_TON, MIN_TOFF, MAX_TON Input Voltage (printed max is VCC) VMIN_TON, VMIN_TOFF, VMAX_TON -0.3 V 6
Driver Output Voltage VDRV -0.3 17 V 6
Current Sense Input Voltage VCS -4 150 V 6
Current Sense Dynamic Input Voltage VCS_DYN -10 150 V tPW = 200 ns 6
MIN_TON, MIN_TOFF, MAX_TON Input Current IMIN_TON, IMIN_TOFF, IMAX_TON -10 10 mA 6
Maximum Junction Temperature TJMAX 150 °C 6
Storage Temperature TSTG -60 150 °C 6
ESD Capability, Human Body Model, Except Pin 6 ESDHBM 2000 V Except Pin 6, per JESD22-A114E 6
ESD Capability, Human Body Model, Pin 6 ESDHBM 1000 V Pin 6, per JESD22-A114E 6
ESD Capability, Machine Model ESDMM 200 V per JESD22-A115-A 6
ESD Capability, Charged Device Model, Except Pin 6 ESDCDM 750 V Except Pin 6, per JESD22-C101F 6
ESD Capability, Charged Device Model, Pin 6 ESDCDM 250 V Pin 6, per JESD22-C101F 6
Junction to Air Thermal Resistance, 1 oz 1 in2 Copper Area, SOIC8 RJ-A_SOIC8 160 °C/W 1 oz 1 in2 Copper Area 6
Maximum Operating Input Voltage VCC 35 V 6
Operating Junction Temperature TJ -40 125 °C 6
VCC UVLO rising (ver. A, D & Q) VCCON 4.2 4.45 4.8 V VCC rising, VCS = 0 V 7
VCC UVLO falling (ver. A, D & Q) VCCOFF 3.7 3.95 4.2 V VCC falling, VCS = 0 V 7
Start-up Delay tSTART_DEL 75 125 s VCC rising from 0 to VCCON + 1 V @ tr = 10 s, VCS = 0 V 7
Current Consumption, RMIN_TON = RMIN_TOFF = 0 k, CDRV = 0 nF, fCS = 500 kHz (ver. B, D, Q) ICC 3.5 4.5 6 mA RMIN_TON = RMIN_TOFF = 0 k, CDRV = 0 nF, fCS = 500 kHz 7
Current Consumption, CDRV = 1 nF, fCS = 500 kHz (ver. B, D, Q) ICC 7.7 9 10.7 mA RMIN_TON = RMIN_TOFF = 0 k, CDRV = 1 nF, fCS = 500 kHz 7
Current Consumption, CDRV = 10 nF, fCS = 500 kHz (ver. B, D, Q) ICC 40 50 60 mA RMIN_TON = RMIN_TOFF = 0 k, CDRV = 10 nF, fCS = 500 kHz 7
Current Consumption, no switching (SOIC8) ICC 1.5 2 2.5 mA No switching, VCS = 0 V, RMIN_TON = RMIN_TOFF = 0 k 7
Current Consumption below UVLO ICC_UVLO 75 125 A No switching, VCC = VCCOFF, 0.1 V, VCS = 0 V 7
Output Voltage Rise-Time tr 40 55 ns CDRV = 10 nF, 10% to 90% 7
Output Voltage Fall-Time tf 20 35 ns CDRV = 10 nF, 90% to 10% 7
Maximum Driver Output Voltage (ver. B, D and Q) VDRVMAX 9 9.5 10.5 V VCC = 35 V, CDRV > 1 nF 7
Minimum Driver Output Voltage (ver. A, D and Q) VDRVMIN 3.6 4 4.4 V VCC = VCCOFF + 200 mV 7
Total Propagation Delay From CS to DRV Output On tPD_ON 35 60 ns VCS goes down from 4 to −1 V, tf_CS = 5 ns 7
Total Propagation Delay From CS to DRV Output Off tPD_OFF 12 23 ns VCS goes up from −1 to 4 V, tr_CS = 5 ns 7
CS Bias Current ICS -105 -100 -95 A VCS = −20 mV 7
Turn On CS Threshold Voltage VTH_CS_ON -120 -75 -40 mV 7
Turn Off CS Threshold Voltage VTH_CS_OFF -1 0 mV Guaranteed by Design 7
Turn Off Timer Reset Threshold Voltage VTH_CS_RESET 0.4 0.5 0.6 V 7
Minimum tON time tON_MIN 35 55 75 ns RMIN_TON = 0 8
Minimum tOFF time tOFF_MIN 190 245 290 ns RMIN_TOFF = 0 8
Minimum tON time tON_MIN 0.92 1 1.08 s RMIN_TON = 10 k 8
Minimum tOFF time tOFF_MIN 0.92 1 1.08 s RMIN_TOFF = 10 k 8
Minimum tON time tON_MIN 4.62 5 5.38 s RMIN_TON = 50 k 8
Minimum tOFF time tOFF_MIN 4.62 5 5.38 s RMIN_TOFF = 50 k 8

CAD (KiCad official)

  • Symbol: NCP4308DDR2G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ncp4308ddr2g-etched.step / ncp4308ddr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp4308ddr2g.step / ncp4308ddr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (31 pp, sha256 90d18ad6f47f5a13, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF