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NCP170BMX190TCG

Public Made by Adom

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onsemi Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NCP170BMX190TCG

onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)

NCP170BMX190TCG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulator output pin; the absolute maximum output voltage is −0.3 V to VIN + 0.3 V.
2 GND power_in Power supply ground reference for the device.
3 EN input Chip enable input, active high; the absolute maximum chip enable input voltage is −0.3 V to 6.0 V.
4 IN power_in Power supply input; the absolute maximum input voltage is 6.0 V, and the operating input range is 2.2 V to 5.5 V.
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer onsemi
Package XDFN-4-EP(1x1)
Category Power Supply Chip
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 2.2 5.5 V 6
Output Voltage VOUT 1.881 1.9 1.919 V TA = +25°C 6
Output Voltage VOUT 1.862 1.9 1.938 V −40°C ≤ TJ ≤ 85°C 6
Line Regulation LineReg 0.05 0.2 %/V 3.5 V < VIN ≤ 5.5 V, IOUT = 1 mA 6
Load Regulation LoadReg -20 1 20 mV 0 mA < IOUT ≤ 150 mA, VIN = 3.5 V 6
Dropout Voltage VDO 335 460 mV IOUT = 150 mA (Note 16) 6
Output Current IOUT 150 mA 6
Quiescent Current IQ 0.5 0.9 A IOUT = 0 mA 6
Standby Current ISTB 0.1 0.5 A VEN = 0 V, TJ = 25°C 6
EN Pin Threshold Voltage (high) VENH 1.2 V EN Input Voltage “H” 6
EN Pin Threshold Voltage (low) VENL 0.4 V EN Input Voltage “L” 6
Input Voltage VIN 6 V Note 1 2
Output Voltage VOUT -0.3 V Range −0.3 to VIN + 0.3 2
Chip Enable Input VCE -0.3 6 V 2
Maximum Junction Temperature TJ(MAX) 150 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V Note 2 2
ESD Capability, Machine Model ESDMM 200 V Note 2 2
Thermal Resistance, Junction-to-Air (XDFN4 1×1 mm) RJA 250 °C/W XDFN4 1 × 1 mm 2
Operating Junction Temperature TJ -40 85 °C Electrical characteristics operating range 3
Recommended Maximum Junction Temperature TJ 125 °C For reliable operation (application information) 21

CAD (KiCad official)

  • Symbol: NCP170BMX190TCG
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp170bmx190tcg-etched.step / ncp170bmx190tcg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp170bmx190tcg.step / ncp170bmx190tcg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (28 pp, sha256 e9ce3964b316d909, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF