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Contents

README

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NCP170AMX330TCG

onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · DFN-4-EP(1x1)

NCP170AMX330TCG from onsemi, in a DFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output pin; the absolute maximum rating for VOUT is −0.3 V to VIN + 0.3 V.
2 GND power_in Power supply ground pin, the common return for the device.
3 EN input Chip enable pin, active high; the chip enable input is rated −0.3 V to 6.0 V.
4 IN power_in Power supply input pin; the absolute maximum input voltage (VIN) is 6.0 V.
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer onsemi
Package DFN-4-EP(1x1)
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 2.2 5.5 V 9
Output Voltage VOUT 3.267 3.3 3.333 V TA = +25°C 9
Output Voltage 3.234 3.3 3.366 V −40°C ≤ TJ ≤ 85°C 9
Line Regulation LineReg 0.05 0.2 %/V 4.3 V < VIN ≤ 5.5 V, IOUT = 1 mA 9
Load Regulation LoadReg -20 1 20 mV 0 mA < IOUT ≤ 150 mA, VIN = 4.3 V 9
Dropout Voltage VDO 180 250 mV IOUT = 150 mA (Note 28) 9
Output Current IOUT 150 mA 9
Quiescent Current IQ 0.5 0.9 A IOUT = 0 mA 9
Standby Current ISTB 0.1 0.5 A VEN = 0 V, TJ = 25°C 9
EN Pin Threshold Voltage (H) VENH 1.2 V EN Input Voltage “H” 9
EN Pin Threshold Voltage (L) VENL 0.4 V EN Input Voltage “L” 9
Input Voltage (absolute maximum) VIN 6 V 2
Output Voltage (absolute maximum) VOUT -0.3 V Printed upper limit is VIN + 0.3 V 2
Chip Enable Input Voltage (absolute maximum) VCE -0.3 6 V 2
Maximum Junction Temperature TJ(MAX) 150 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V Human Body Model (Note 2) 2
ESD Capability, Machine Model ESDMM 200 V Machine Model (Note 2) 2
Thermal Resistance, Junction-to-Air (XDFN4 1 × 1 mm) RJA 250 °C/W XDFN4 1 × 1 mm 2

CAD (KiCad official)

  • Symbol: NCP170AMX330TCG
  • Footprint: Package_DFN_QFN:UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm
  • 3D model: DFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp170amx330tcg-etched.step / ncp170amx330tcg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp170amx330tcg.step / ncp170amx330tcg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (25 pp, sha256 1f1f83124b69bba4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF