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NCP170AMX300TCG

Public Made by Adom

by adom

onsemi Linear Voltage Regulators (LDO), DFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NCP170AMX300TCG

onsemi · Linear Voltage Regulators (LDO) · DFN-4-EP(1x1)

NCP170AMX300TCG from onsemi, in a DFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Output pin of the regulator, with VOUT absolute range of −0.3 V to VIN + 0.3 V.
2 GND power_in Power supply ground.
3 EN input Chip enable pin (active H) with an input voltage absolute range of −0.3 V to 6.0 V.
4 IN power_in Power supply input voltage with an absolute maximum rating of 6.0 V.
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer onsemi
Package DFN-4-EP(1x1)
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 2.2 5.5 V 8
Output Voltage (TA=+25°C) VOUT 2.97 3 3.03 V TA = +25°C 8
Output Voltage (over temperature) VOUT 2.94 3 3.06 V −40°C ≤ TJ ≤ 85°C 8
Line Regulation LineReg 0.05 0.2 %/V 4.0 V < VIN ≤ 5.5 V, IOUT = 1 mA 8
Load Regulation LoadReg -20 1 20 mV 0 mA < IOUT ≤ 150 mA, VIN = 4 V 8
Dropout Voltage VDO 190 260 mV IOUT = 150 mA (Note 24) 8
Output Current IOUT 150 mA 8
Quiescent Current IQ 0.5 0.9 A IOUT = 0 mA 8
Standby Current ISTB 0.1 0.5 A VEN = 0 V, TJ = 25°C 8
EN Pin Threshold Voltage High VENH 1.2 V EN Input Voltage “H” 8
EN Pin Threshold Voltage Low VENL 0.4 V EN Input Voltage “L” 8
Input Voltage VIN 6 V Note 1 2
Output Voltage VOUT -0.3 V Upper limit printed as VIN + 0.3 V 2
Chip Enable Input VCE -0.3 6 V 2
Maximum Junction Temperature TJ(MAX) 150 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V Note 2; ESD HBM per AEC-Q100-002 2
ESD Capability, Machine Model ESDMM 200 V Note 2; ESD MM per AEC-Q100-003 2
Thermal Resistance, Junction-to-Air, XDFN4 1 × 1 mm RJA 250 °C/W XDFN4 1 × 1 mm 2

CAD (KiCad official)

  • Symbol: NCP170AMX300TCG
  • Footprint: Package_DFN_QFN:UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm
  • 3D model: DFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp170amx300tcg-etched.step / ncp170amx300tcg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp170amx300tcg.step / ncp170amx300tcg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (23 pp, sha256 c2370ab360118306, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF