component
NCP170AMX180TCG
Public Made by Adomby adom
onsemi Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 16d ago |
| viewers | 16d ago |
| ncp170amx180tcg-etched.glb | 16d ago |
| ncp170amx180tcg-etched.step | 16d ago |
| ncp170amx180tcg-hero.glb | 16d ago |
| ncp170amx180tcg-hero.overlay.json | 16d ago |
| ncp170amx180tcg.glb | 16d ago |
| ncp170amx180tcg.kicad_mod | 16d ago |
| ncp170amx180tcg.kicad_sym | 16d ago |
| ncp170amx180tcg.lbr | 16d ago |
| ncp170amx180tcg.step | 16d ago |
| package.json | 16d ago |
| page.json | 16d ago |
| README.md | 16d ago |
NCP170AMX180TCG
onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)
NCP170AMX180TCG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output pin; connect a ceramic output capacitor of 1.0 µF or greater (up to 10 µF) as close as possible to this pin. |
| 2 | GND | power_in | Power supply ground. |
| 3 | EN | input | Chip enable, active high: below 0.4 V the device is disabled (and output discharged on the A option), above 1.2 V it is enabled; tie to IN if unused. |
| 4 | IN | power_in | Power supply input voltage, operating range 2.2 V to 5.5 V, with at least a 1 µF ceramic capacitor to GND recommended. |
| 5 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | XDFN-4-EP(1x1) |
| Category | Power Management ICs |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Input Voltage | VIN | 2.2 | 5.5 | V | 5 | ||
| Operating Input Voltage (low load) | VIN | 2 | 5.5 | V | IOUT < 30 mA | 5 | |
| Output Voltage | VOUT | 1.782 | 1.8 | 1.818 | V | TA = +25°C | 5 |
| Output Voltage | VOUT | 1.764 | 1.8 | 1.836 | V | −40°C ≤ TJ ≤ 85°C | 5 |
| Line Regulation | LineReg | 0.05 | 0.2 | %/V | 2.8 V < VIN ≤ 5.5 V, IOUT = 1 mA | 5 | |
| Load Regulation | LoadReg | -20 | 1 | 20 | mV | 0 mA < IOUT ≤ 150 mA, VIN = 2.8 V | 5 |
| Dropout Voltage | VDO | 350 | 480 | mV | IOUT = 150 mA | 5 | |
| Output Current | IOUT | 150 | mA | Respect SOA | 5 | ||
| Short Circuit Current Limit | ISC | 225 | mA | VOUT = 0 V | 5 | ||
| Quiescent Current | IQ | 0.5 | 0.9 | µA | IOUT = 0 mA | 5 | |
| Standby Current | ISTB | 0.1 | 0.5 | µA | VEN = 0 V, TJ = 25°C | 5 | |
| EN Pin Threshold Voltage High | VENH | 1.2 | V | EN Input Voltage "H" | 5 | ||
| EN Pin Threshold Voltage Low | VENL | 0.4 | V | EN Input Voltage "L" | 5 | ||
| EN Pull Down Current | IEN | 10 | nA | VEN ≤ VIN ≤ 5.5 V | 5 | ||
| Power Supply Rejection Ratio | PSRR | 57 | dB | f = 1 kHz, VIN = 2.8 V + 200 mVpp Modulation, IOUT = 150 mA | 5 | ||
| Output Noise Voltage | VNOISE | 95 | µVrms | VIN = 5.5 V, IOUT = 1 mA, f = 100 Hz to 1 MHz, COUT = 1 µF | 5 | ||
| Active Output Discharge Resistance | RLOW | 100 | Ω | VIN = 5.5 V, VEN = 0 V | 5 | ||
| Thermal Shutdown Temperature | TSD | 175 | °C | Temperature Increasing from TJ = +25°C | 5 | ||
| Thermal Shutdown Hysteresis | TSDH | 25 | °C | Temperature Falling from TSD | 5 | ||
| Input Voltage | VIN | 6 | V | 2 | |||
| Output Voltage | VOUT | -0.3 | V | −0.3 to VIN + 0.3 V | 2 | ||
| Chip Enable Input | VCE | -0.3 | 6 | V | 2 | ||
| Maximum Junction Temperature | TJ(MAX) | 150 | °C | 2 | |||
| Storage Temperature | TSTG | -55 | 150 | °C | 2 | ||
| ESD Capability, Human Body Model | ESDHBM | 2000 | V | 2 | |||
| ESD Capability, Machine Model | ESDMM | 200 | V | 2 | |||
| Thermal Resistance, Junction-to-Air | RθJA | 250 | °C/W | XDFN4 1 × 1 mm | 2 |
CAD (KiCad official)
- Symbol:
NCP170AMX180TCG - Footprint:
Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm - 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files:
ncp170amx180tcg-etched.step/ncp170amx180tcg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ncp170amx180tcg.step/ncp170amx180tcg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (26 pp, sha256
90144f6bdd5bed12, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).