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NCP167BMX330TBG

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onsemi Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NCP167BMX330TBG

onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)

NCP167BMX330TBG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output voltage, to be bypassed with a small 1 µF ceramic capacitor; the datasheet gives an absolute maximum of VIN + 0.3 V (max 6 V) and requires a minimum effective output capacitance of 0.7 µF.
2 GND power_in Common ground connection.
3 EN input Chip enable: VEN below 0.4 V disables the regulator and VEN above 1.2 V enables it, with an absolute maximum of VIN + 0.3 V (max 6 V).
4 IN power_in Input voltage supply pin with an operating input voltage range of 1.9 V to 5.5 V and an absolute maximum of −0.3 V to 6 V.
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer onsemi
Package XDFN-4-EP(1x1)
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 1.9 5.5 V 3
Output Voltage Accuracy VOUT -2 2 % VIN = VOUT(NOM) + 1 V to 5.5 V, 0 mA ≤ IOUT ≤ 700 mA 3
Dropout Voltage VOUT(NOM) = 3.3 V VDO 190 290 mV IOUT = 700 mA, VOUT(NOM) = 3.3 V 3
Output Current Limit ICL 800 1000 mA VOUT = 90% VOUT(NOM) 3
Quiescent Current IQ 9.7 18 uA IOUT = 0 mA 3
Shutdown Current IDIS 0.01 1 uA VEN ≤ 0.4 V, VIN = 4.8 V 3
EN Input Voltage H VENH 1.2 V EN Input Voltage “H” 3
EN Input Voltage L VENL 0.4 V EN Input Voltage “L” 3
EN Pull Down Current IEN 0.2 0.5 uA VEN = 4.8 V 3
Thermal Shutdown Threshold, temperature rising TSDH 160 °C Temperature rising 3
Thermal Shutdown Threshold, temperature falling TSDL 140 °C Temperature falling 3
Operating Junction Temperature TJ -40 125 °C Electrical characteristics range 3
Minimum Effective Output Capacitance COUT 0.7 uF Stable over temperature, DC bias and package size 7
Output Capacitor ESR ESR 1.7 Ω COUT maximum ESR 7
Input Voltage VIN -0.3 6 V 2
Output Voltage VOUT -0.3 6 V VOUT -0.3 to VIN + 0.3, max. 6 V 2
Chip Enable Input VCE -0.3 6 V VCE -0.3 to VIN + 0.3, max. 6 V 2
Maximum Junction Temperature TJ 150 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V Per EIA/JESD22-A114 2
ESD Capability, Machine Model ESDMM 200 V Per EIA/JESD22-A115 2
Thermal Resistance, Junction-to-Air, XDFN4 RJA 198 °C/W JEDEC board specification (Note 3) 2

CAD (KiCad official)

  • Symbol: NCP167BMX330TBG
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp167bmx330tbg-etched.step / ncp167bmx330tbg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp167bmx330tbg.step / ncp167bmx330tbg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (13 pp, sha256 edf3f1ff26da2a4a, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF