NCP163AMX270TBG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	OUT	power_out	Regulated output voltage; the output should be bypassed with a small 1 μF ceramic capacitor placed close to the pin.
2	GND	power_in	Common ground connection.
3	EN	input	Chip enable: VEN below 0.4 V disables the regulator and VEN above 1.2 V enables the LDO; the absolute maximum chip enable input voltage is -0.3 V to 6 V.
4	IN	power_in	Input voltage supply pin; operating input voltage range is 2.2 V to 5.5 V, with an absolute maximum input voltage of 6 V.
5	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	onsemi
Package	XDFN-4-EP(1x1)
Category	Power Management ICs
Pins	5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Output Voltage Accuracy	VOUT	-2		2	%	VIN = (VOUT(NOM) + 1 V) to 5.5 V; 0 mA ≤ IOUT ≤ 250 mA	3
Operating Input Voltage	VIN	2.2		5.5	V		3
Operating Junction Temperature Range	TJ	-40		125	°C	Electrical characteristics temperature range	3
Quiescent Current	IQ		12	20	µA	IOUT = 0 mA	3
Shutdown Current	IDIS		0.01	1	µA	VEN ≤ 0.4 V, VIN = 4.8 V	3
EN Input Voltage High	VENH	1.2			V		3
EN Input Voltage Low	VENL			0.4	V		3
EN Pull Down Current	IEN		0.2	0.5	µA	VEN = 4.8 V	3
Output Current Limit	ICL	250	700		mA	VOUT = 90% VOUT(NOM)	3
Short Circuit Current	ISC		690		mA	VOUT = 0 V	3
Power Supply Rejection Ratio at 1 kHz	PSRR		92		dB	IOUT = 20 mA, f = 1 kHz	3
Thermal Shutdown Threshold (rising)	TSDH		160		°C	Temperature rising	4
Thermal Shutdown Threshold (falling)	TSDL		140		°C	Temperature falling	4
Active Output Discharge Resistance	RDIS		280		Ω	VEN < 0.4 V, Version A only	4
Line Transient (step up)	TranLINE	-1			mV	VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 s, IOUT = 1 mA	4
Line Transient (step down)	TranLINE			1	mV	VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V) in 30 s, IOUT = 1 mA	4
Load Transient (load step up)	TranLOAD	-40			mV	IOUT = 1 mA to 200 mA in 10 s	4
Load Transient (load step down)	TranLOAD			40	mV	IOUT = 200 mA to 1 mA in 10 s	4
Input Voltage	VIN	-0.3		6	V		2
Output Voltage	VOUT	-0.3		6	V	Upper limit VIN + 0.3, max. 6 V	2
Chip Enable Input Voltage	VCE	-0.3		6	V		2
Maximum Junction Temperature	TJ			150	°C		2
Storage Temperature	TSTG	-55		150	°C		2
ESD Capability, Human Body Model	ESDHBM			2000	V	Tested per EIA/JESD22-A114	2
ESD Capability, Machine Model	ESDMM			200	V	Tested per EIA/JESD22-A115	2
ESD Capability, Charged Device Model	ESDCDM			1000	V	Tested per EIA/JESD22-C101	2
Thermal Resistance, Junction-to-Air (XDFN4)	RJA		198.1		°C/W	JEDEC board specification (Note 3)	3

CAD (KiCad official)

Symbol: NCP163AMX270TBG
Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
3D model files: ncp163amx270tbg-etched.step / ncp163amx270tbg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp163amx270tbg.step / ncp163amx270tbg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: onsemi datasheet (23 pp, sha256 024c06f95e392f4d, retrieved 2026-11-05, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

NCP163AMX270TBG

Verified NCP163AMX270TBG

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3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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