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Contents

README

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NCP1631DR2G

onsemi · AC-DC Controllers And Regulators · SOIC-16

NCP1631DR2G from onsemi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ZCD2 input Zero current detection input for phase 2 of the interleaved PFC stage; apply the auxiliary winding voltage to detect inductor core reset and the MOSFET drain-source valley.
2 FB input Receives a portion of the pre-converter output voltage for regulation and 'output low' detection (VOUTL), which speeds up the loop response when the output drops below 95.5% of the wished level.
3 Rt passive A resistor between this pin and ground adjusts the maximum on-time for both phases and hence the maximum power the PFC stage can deliver.
4 OSC passive Connect a capacitor to set the clamp frequency of the PFC stage; the circuit delays the next cycle until the core is reset, so the stage can operate in Critical Conduction Mode.
5 Vcontrol output Error amplifier output; the capacitor to ground sets the regulation loop bandwidth (typically below 20 Hz), and the pin is grounded when the circuit is off to give a soft-start.
6 FFOLD passive A resistor to ground adjusts the oscillator charge current, clamped not to exceed 100 µA and proportional to power level, for frequency fold-back at light load.
7 BO input Brown-out detection input fed with an averaged portion of the input voltage; a 50-ms internal delay blanks short mains interruptions, a 7-µA current source gives programmable hysteresis, and grounding the pin disables the part.
8 OVP / UVP input Output over/under-voltage sense; the circuit turns off when the pin goes below 480 mV (UVP) and disables the drive while the pin exceeds 2.5 V (OVP).
9 CS input Monitors a negative voltage proportional to the coil current, used to limit the maximum coil current and protect against in-rush currents.
10 Latch input Applying a voltage higher than 2.5 V latches off the circuit; reset by a brown-out detection or by forcing VCC below VCCRST (4 V typically).
11 DRV2 output Gate drive output for phase 2 of the interleaved PFC stage, a totem pole drive with +0.5/-0.8 A capability.
12 VCC power_in Positive supply of the IC; starts operating when VCC exceeds 12 V and turns off below 10 V (typical), with an operating range of 9.5 V to 20 V after start-up.
13 GND power_in Connect to the pre-converter ground.
14 DRV1 output Gate drive output for phase 1 of the interleaved PFC stage, a totem pole drive with +0.5/-0.8 A capability.
15 REF5V/pfcOK output High (5 V) when the PFC stage is in normal steady state and low otherwise, informing the downstream converter that the PFC stage is ready.
16 ZCD1 input Zero current detection input for phase 1 of the interleaved PFC stage; apply the auxiliary winding voltage to detect inductor core reset and the MOSFET drain-source valley.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-16
Category Power Management (PMIC)
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Power Supply Voltage VCC(MAX) -0.3 20 V Continuous 2
Maximum Voltage on DRV Pins DRVMAX -0.3 V 2
Maximum Input Voltage on Low Power Pins VMAX -0.3 9 V 2
VControl Pin Maximum Input Voltage VControl(MAX) -0.3 V 2
Maximum Power Dissipation PD 550 mW TA = 70°C 2
Operating Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range TS(MAX) -65 150 °C 2
Lead Temperature (Soldering) TL(MAX) 300 °C 10 s 2
Supply Voltage Startup Threshold VCC(on) 11 11.85 12.7 V VCC increasing 3
Minimum Operating Voltage VCC(off) 9.5 10 10.5 V VCC decreasing 3
Hysteresis VCC(on), VCC(off) VCC(hyst) 1.5 1.85 V 3
Internal Logic Reset VCC(reset) 4 5.75 7.5 V VCC decreasing 3
Startup current ICC(start) 35 100 µA VCC = 9.4 V 3
Supply Current ICC1 5 7 mA Device Enabled/No output load on pin6; Fsw = 130 kHz (Note 4) 3
Clamping Charging Current IOSC(clamp) 30 35 38.5 µA Pin 6 open; TJ = −55°C to +125°C (Note 6) 3
Charge Current with no frequency foldback IOSC(CH1) 120 140 154 µA Pin 6 grounded; TJ = −55°C to +125°C (Note 6) 3
Maximum Discharge Current with no frequency foldback IOSC(DISCH1) 90 105 115.5 µA Pin 6 grounded; TJ = −55°C to +125°C (Note 6) 3
Current Sense Protection Threshold IILIM1 202 210 226 µA TJ = 25°C 3
Current Sense Protection Threshold IILIM1 173 210 226 µA TJ = −55°C to +125°C (Note 6) 3
Threshold for In-rush Current Detection Iin−rush 10.4 14 17 µA TJ = −55°C to +125°C 3
Drive Resistance DRV1 Sink RSNK1 7 15 Ω Ipin14 = 100 mA 3
Drive Resistance DRV1 Source RSRC1 15 25 Ω Ipin14 = −100 mA 3
Drive Resistance DRV2 Sink RSNK2 7 15 Ω Ipin11 = 100 mA 3
Drive Resistance DRV2 Source RSRC2 15 25 Ω Ipin11 = −100 mA 3
Feedback Voltage Reference VREF 2.44 2.5 2.56 V 4
Pin 5 Source Current when (Vout(low) Detect) is activated IControl(boost) 178 230 276 µA TJ = −55°C to +125°C (Note 6) 4
Pin 5 Voltage VControl(clamp) 3 3.6 4.2 V @ Vpin2 = 2.4 V 4
Pin 5 Voltage VControl(MIN) 0 0.6 1.2 V @ Vpin2 = 2.6 V 4
Pin 5 Voltage range VControl(range) 2.7 3 3.3 V 4
Ratio (Vout(low) Detect Threshold / VREF) Vout(low)/VREF 95 95.5 96 % FB falling 4
Duty Cycle DMIN 0 % Vpin2 = 3 V 4
Maximum DRV1 and DRV2 On-Time ton1 13 19.5 22.5 µs TJ = −55°C to +125°C; Vpin7 = 1.1 V, Ipin3 = 50 µA (Note 6) 5
Maximum DRV1 and DRV2 On-Time ton2 1 1.35 1.6 µs TJ = −55°C to +125°C; Vpin7 = 1.1 V, Ipin3 = 200 µA (Note 5) 5
Maximum DRV1 and DRV2 On-Time ton3 3.7 5 6 µs TJ = −55°C to +125°C; Vpin7 = 2.2 V, Ipin3 = 100 µA (Note 5) 5
Maximum DRV1 and DRV2 On-Time ton4 0.32 0.41 0.48 µs TJ = −55°C to +125°C; Vpin7 = 2.2 V, Ipin3 = 400 µA (Note 5) 5
Pin 3 voltage VRt1 1.071 1.096 1.121 V VBO = Vpin7 = 1.1 V, Ipin3 = 50 µA 5
Pin 3 voltage VRt3 2.169 2.196 2.223 V VBO = Vpin7 = 2.2 V, Ipin3 = 50 µA 5
Pin 3 Current Capability IRt(MAX) 1 mA 5
ZCD Threshold Voltage VZCD(TH),H 0.4 0.5 0.6 V VZCD increasing 5
ZCD Threshold Voltage VZCD(TH),L 0.2 0.25 0.3 V VZCD falling 5
ZCD Watchdog Delay tZCD 80 200 320 µs 5
Brown-Out Comparator Threshold VBO(TH) 0.97 1 1.03 V 5
Brown-Out Current Source IBO 5.7 7 8 µA TJ = −55°C to +125°C (Note 6) 5
Brown-Out Blanking Time tBO(BLANK) 38 50 63.5 ms TJ = −55°C to +125°C 5
Brown-Out Monitoring Window tBO(window) 38 50 62 ms 5
Current Capability of the BO Clamp IBO(clamp) 100 µA 5
Hysteresis VBO(TH), VBO(clamp) VBO(HYS) 10 35 60 mV Ipin7 = −100 µA 5
Over-Voltage Protection Threshold VOVP 2.425 2.5 2.575 V 5
Ratio (VOVP / VREF) VOVP/VREF 99.2 99.7 100.2 % 5
Ratio UVP Threshold over VREF VUVP/VREF 8 12 16 % 5
Pin 15 Voltage Low State VREF5V(low) 60 120 mV Vpin7 = 0 V, Ipin15 = 250 µA 6
Pin 15 Voltage High State VREF5V(high) 4.7 4.85 5.3 V Vpin7 = 0 V, Ipin15 = 5 mA 6
Current Capability IREF5V 5 10 mA 6
Pin Latch Threshold for Shutdown VLatch 2.375 2.5 2.625 V 6
Thermal Shutdown Threshold TSHDN 130 140 150 °C 6
ESD Capability, HBM model ESD HBM 3 kV Human Body Model (Note 2) 2
ESD Capability, Machine Model ESD MM 250 V Machine Model (Note 2) 2
Thermal Resistance Junction-to-Air RJ−A 145 °C/W 2

CAD (KiCad official)

  • Symbol: NCP1631DR2G
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: ncp1631dr2g-etched.step / ncp1631dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp1631dr2g.step / ncp1631dr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (25 pp, sha256 8db8af2fb647e499, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF