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NCP161AMX330TBG

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onsemi Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NCP161AMX330TBG

onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)

NCP161AMX330TBG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output voltage; the output should be bypassed with a small 1 µF ceramic capacitor.
2 GND power_in Common ground connection.
3 EN input Chip enable: applying VEN < 0.4 V disables the regulator, and pulling VEN > 1.2 V enables the LDO.
4 IN power_in Input voltage supply pin; absolute maximum input voltage is -0.3 V to 6 V.
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer onsemi
Package XDFN-4-EP(1x1)
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 1.9 5.5 V 3
Output Voltage Accuracy VOUT -2 2 % VIN = VOUT(NOM) + 1 V, 0 mA ≤ IOUT ≤ 450 mA, WLCSP4, XDFN4 3
Dropout Voltage (VOUT(NOM) = 3.3 V) VDO 160 260 mV IOUT = 450 mA, WLCSP4, XDFN4, VOUT(NOM) = 3.3 V 3
Output Current Limit ICL 450 700 mA VOUT = 90% VOUT(NOM) 3
Quiescent Current IQ 18 23 µA IOUT = 0 mA 3
Shutdown Current IDIS 0.01 1 µA VEN ≤ 0.4 V, VIN = 4.8 V 3
EN Input Voltage High VENH 1.2 V 3
EN Input Voltage Low VENL 0.4 V 3
EN Pull Down Current IEN 0.2 0.5 µA VEN = 4.8 V 3
Line Transient TranLINE -1 1 mV VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 µs, IOUT = 1 mA; VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V) in 30 µs, IOUT = 1 mA 3
Load Transient TranLOAD -40 40 mV IOUT = 1 mA to 450 mA in 10 µs; IOUT = 450 mA to 1 mA in 10 µs 3
Input Voltage (absolute maximum) VIN -0.3 6 V Note 1 2
Output Voltage (absolute maximum) VOUT -0.3 6 V VOUT range −0.3 to VIN + 0.3, max. 6 V 2
Chip Enable Input Voltage (absolute maximum) VCE -0.3 6 V 2
Maximum Junction Temperature TJ 150 °C 2
Storage Temperature TSTG -55 150 °C 2
Thermal Resistance, Junction-to-Air (XDFN4) RJA 198.1 °C/W XDFN4; measured per JEDEC board specification (JESD51-7) 2
Operating Junction Temperature Range TJ -40 125 °C −40 °C ≤ TJ ≤ 125 °C (electrical characteristics range) 3

CAD (KiCad official)

  • Symbol: NCP161AMX330TBG
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp161amx330tbg-etched.step / ncp161amx330tbg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp161amx330tbg.step / ncp161amx330tbg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (22 pp, sha256 87f4bf1f8c4d9f5a, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF