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NCP160AMX330TBG

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onsemi New Arrivals, XDFN-4(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentothersncp160amx330tbgfactory-2.0.0extractor-text

Verified NCP160AMX330TBG

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 5 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: NCP160AMX330TBG · XDFN-4(1x1) · 5 pins
  • ✓copper: 5 copper pads, none touching another net
  • ✓datasheet: all 5 pin names found in the 23-page datasheet
  • ✓distributor: lcsc C464237, digikey NCP160AMX330TBGOSTR-ND, mouser 863-NCP160AMX330TBG
  • ✓family: OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-he8yhh2u/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): the datasheet dimensions give no height or body size to compare (datasheet p.22)
  • ✓pads: 5 pins = 5 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 5 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ ncp160amx330tbg.kicad_sym✓ ncp160amx330tbg.kicad_mod✓ ncp160amx330tbg.step
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Ray Publish 0.1.0 a5c65a2 6d ago

NCP160AMX330TBG

onsemi · New Arrivals · XDFN-4(1x1)

NCP160AMX330TBG from onsemi, in a XDFN-4(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output voltage; the output should be bypassed with a small 1 µF ceramic capacitor, and the device is specified for 0 mA to 250 mA output current.
2 GND power_in Common ground connection.
3 EN input Chip enable: VEN below 0.4 V disables the regulator and VEN above 1.2 V enables it, with an absolute maximum rating of −0.3 V to 6 V.
4 IN power_in Input voltage supply pin; the operating input voltage range is 1.9 V to 5.5 V, with an absolute maximum of −0.3 V to 6 V.
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer onsemi
Package XDFN-4(1x1)
Category Others
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 1.9 5.5 V 4
Output Voltage Accuracy VOUT -2 2 % VIN = VOUT(NOM) + 1 V; 0 mA ≤ IOUT ≤ 250 mA 4
Dropout Voltage, VOUT(NOM) = 3.3 V VDO 80 145 mV IOUT = 250 mA 4
Output Current Limit ICL 250 700 mA VOUT = 90% VOUT(NOM) 4
Quiescent Current IQ 18 23 µA IOUT = 0 mA 4
Shutdown Current IDIS 0.01 1 µA VEN ≤ 0.4 V, VIN = 4.8 V 4
EN Input Voltage High VENH 1.2 V EN Input Voltage “H” 4
EN Input Voltage Low VENL 0.4 V EN Input Voltage “L” 4
EN Pull Down Current IEN 0.2 0.5 µA VEN = 4.8 V 4
Line Transient, rising VIN step TranLINE -1 mV VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 µs, IOUT = 1 mA 4
Line Transient, falling VIN step TranLINE 1 mV VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V) in 30 µs, IOUT = 1 mA 4
Load Transient, 1 mA to 200 mA step TranLOAD -40 mV IOUT = 1 mA to 200 mA in 10 µs 4
Load Transient, 200 mA to 1 mA step TranLOAD 40 mV IOUT = 200 mA to 1 mA in 10 µs 4
Input Voltage (absolute maximum) VIN -0.3 6 V 3
Output Voltage (absolute maximum) VOUT -0.3 6 V VOUT ≤ VIN + 0.3, max. 6 V 3
Chip Enable Input (absolute maximum) VCE -0.3 6 V 3
Maximum Junction Temperature TJ 150 °C 3
Storage Temperature TSTG -55 150 °C 3
ESD Capability, Human Body Model ESDHBM 2000 V Tested per EIA/JESD22-A114 3
ESD Capability, Machine Model ESDMM 200 V Tested per EIA/JESD22-A115 3
Output Capacitor Effective Capacitance COUT 0.7 µF Accounts for temperature, DC bias and package size 14
Output Capacitor ESR ESR 2 Ω COUT ESR 14
Thermal Resistance, Junction-to-Air, XDFN4 RJA 198.1 °C/W JEDEC board per JESD51-7 (Note 3) 3

CAD (KiCad official)

  • Symbol: NCP160AMX330TBG
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp160amx330tbg-etched.step / ncp160amx330tbg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp160amx330tbg.step / ncp160amx330tbg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (23 pp, sha256 c3a4fa49f103f81f, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF