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NCP160AMX290TBG

Public Made by Adom

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onsemi Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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NCP160AMX290TBG

onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)

NCP160AMX290TBG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output voltage; the output should be bypassed with a small 1 µF ceramic capacitor.
2 GND power_in Common ground connection.
3 EN input Chip enable: VEN < 0.4 V disables the regulator, VEN > 1.2 V enables the LDO.
4 IN power_in Input voltage supply pin, operating range 1.9 V to 5.5 V.
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer onsemi
Package XDFN-4-EP(1x1)
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 1.9 5.5 V 3
Output Voltage Accuracy VOUT -2 2 % VIN = VOUT(NOM) + 1 V, 0 mA ≤ IOUT ≤ 250 mA 3
Nominal Output Voltage VOUT(NOM) 2.9 V NCP160AMX290TBG ordering table 18
Line Regulation LineReg 0.02 %/V VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V 3
Load Regulation LoadReg 0.001 %/mA IOUT = 1 mA to 250 mA 3
EN Input Voltage High VENH 1.2 V 3
EN Input Voltage Low VENL 0.4 V 3
Thermal Shutdown Threshold, rising TSDH 160 °C Temperature rising 3
Thermal Shutdown Threshold, falling TSDL 140 °C Temperature falling 3
Active Output Discharge Resistance RDIS 280 Ω VEN < 0.4 V, Version A only 3
Input Voltage VIN -0.3 6 V 2
Output Voltage VOUT -0.3 6 V -0.3 to VIN + 0.3, max. 6 V 2
Chip Enable Input VCE -0.3 6 V 2
Maximum Junction Temperature TJ 150 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V 2
ESD Capability, Machine Model ESDMM 200 V 2
Thermal Resistance, Junction-to-Air, XDFN4 RθJA 198.1 °C/W JEDEC JESD51-7 board 2

CAD (KiCad official)

  • Symbol: NCP160AMX290TBG
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp160amx290tbg-etched.step / ncp160amx290tbg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp160amx290tbg.step / ncp160amx290tbg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (22 pp, sha256 5f4f5df0f9d7894d, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF