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NCP1342DADBDGD1R2G

onsemi · AC-DC Controllers And Regulators · SOP-10

NCP1342DADBDGD1R2G from onsemi, in a SOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Fault input The controller enters fault mode if the voltage on this pin is pulled above or below the fault thresholds, and a precise pull-up current source allows direct interface with an NTC thermistor.
2 FMAX input A resistor to ground sets the value for the maximum switching frequency clamp, and if this pin is pulled above 4 V the maximum frequency clamp is disabled.
3 FB input Feedback input for the QR flyback controller that allows direct connection to an optocoupler.
4 ZCD/OPP input A resistor divider from the auxiliary winding to this pin provides input to the demagnetization detection comparator and sets the OPP compensation level.
5 CS input Input to the cycle-by-cycle current limit comparator.
6 GND power_in Ground reference of the controller.
7 DRV output Drive pin of the circuit, with high-current capability of -0.5 / +0.8 A that makes it suitable to effectively drive high gate charge power MOSFETs.
8 VCC power_in Positive supply of the IC; the circuit starts to operate when VCC exceeds 17 V and turns off when VCC goes below 9 V (typical values), with an operating range of 9 V to 28 V after start-up.
9 N/C unconnected Removed for creepage distance.
10 HV input Input for the high-voltage startup and brownout detection circuits, which also contains the line removal detection circuit to safely discharge the X2 capacitors when the line is removed.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOP-10
Category Power Management (PMIC)
Pins 10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
High Voltage Startup Circuit Input Voltage VHV(MAX) -0.3 700 V 6
High Voltage Startup Circuit Input Current IHV(MAX) 20 mA 6
Supply Input Voltage VCC(MAX) -0.3 30 V 6
Supply Input Current ICC(MAX) 30 mA 6
Supply Input Voltage Slew Rate dVCC/dt 1 V/s 6
Fault Input Voltage VFault(MAX) -0.3 V upper limit printed as VCC + 0.7 V 6
Fault Input Current IFault(MAX) 10 mA 6
Zero Current Detection and OPP Input Voltage VZCD(MAX) -0.3 V upper limit printed as VCC + 0.7 V 6
Zero Current Detection and OPP Input Current IZCD(MAX) -2 5 mA 6
Maximum Input Voltage (Other Pins) VMAX -0.3 5.5 V 6
Maximum Input Current (Other Pins) IMAX 10 mA 6
Driver Maximum Voltage VDRV -0.3 V upper limit VDRV(high) per Note 1 6
Driver Maximum Source Current IDRV(SRC) 500 mA 6
Driver Maximum Sink Current IDRV(SNK) 800 mA 6
Operating Junction Temperature TJ -40 125 °C 6
Maximum Junction Temperature TJ(MAX) 150 °C 6
Storage Temperature Range TSTG -60 150 °C 6
Power Dissipation, SOIC-9 (D1R2G suffix) PD(MAX) 330 mW TA = 25°C, 1 oz. Cu, 42 mm2 copper clad PCB 6
Thermal Resistance Junction-to-Ambient, SOIC-9 (D1R2G suffix) RJA 300 °C/W TA = 25°C, 1 oz. Cu, 42 mm2 copper clad PCB 6
Supply Voltage Startup Threshold VCC(on) 16 17 18 V dV/dt = 0.1 V/ms; VCC increasing 7
VCC Minimum Operating Voltage (VCC(off)) VCC(off) 8.5 9 9.5 V VCC decreasing 7
Operating Hysteresis VCC(HYS) 7.5 V VCC(on) − VCC(off) 7
VCC Overvoltage Protection Threshold VCC(OVP) 27 28 29 V 7
Inhibit Current Sourced from VCC Pin Istart1 0.2 0.5 0.65 mA Vcc = 0 V 7
Start-Up Current Sourced from VCC Pin Istart2 2.4 3.75 5 mA Vcc = Vcc(on) − 0.5 V, −40°C to 105°C 7
Start-Up Current Sourced from VCC Pin Istart2 2 3.75 5 mA Vcc = Vcc(on) − 0.5 V, −40°C to 125°C 7
Supply Current, Fault or Latch ICC1 0.115 0.25 mA VCC = VCC(on) − 0.5 V 7
Supply Current, Skip Mode (excluding FB current) ICC2 0.23 0.4 mA VCC = VCC(on) − 0.5 V, VFB = 0 V 7
Supply Current, Operating ICC3 1 1.5 mA fsw = 50 kHz, CDRV = open 7
System Start-Up Threshold (other versions) VBO(start) 107 112 116 V VHV increasing 7
Brownout Threshold (other versions) VBO(stop) 93 98 102 V VHV decreasing 7
Brownout Hysteresis (other versions) VBO(HYS) 9 14 V VHV increasing 7
High State Voltage VDRV(high2) 10 12 14 V VCC = 30 V, RDRV = 10 k 8
Low Stage Voltage VDRV(low) 0.25 V VFault = 0 V 8
Rise Time tDRV(rise) 20 40 ns VDRV from 10% to 90% 7
Fall Time tDRV(fall) 5 30 ns VDRV from 90% to 10% 7
Open Pin Voltage VFB(open) 4.8 5 5.1 V 8
VFB to Internal Current Setpoint Division Ratio KFB 3.7 4 4.3 8
Internal Pull-Up Resistor RFB 17 20 23 k VFB = 0.4 V 8
Valley Threshold, Transition from 1st to 2nd valley V1to2 1.316 1.4 1.484 V VFB decreasing 8
Valley Threshold, Transition from 2nd to 1st valley V2to1 1.88 2 2.12 V VFB increasing 8
Valley Threshold, Transition from 5th to 6th valley V5to6 0.846 0.9 0.954 V VFB decreasing 8
Valley Threshold, Transition from 6th to 5th valley V6to5 1.41 1.5 1.59 V VFB increasing 8
Maximum Frequency Clamp fMAX1 440 500 560 kHz VFMAX = 0.5 V 8
Maximum Frequency Clamp fMAX2 61 70 79 kHz VFMAX = 3.5 V 8
FMAX Disable Threshold VFMAX(disable) 3.85 4 4.15 V 8
ZCD Threshold Voltage VZCD(trig) 35 60 90 mV VZCD decreasing 8
ZCD Hysteresis VZCD(HYS) 15 25 55 mV VZCD increasing 8
Blanking Delay After Turn-Off tZCD(blank) 600 700 800 ns 8
Current Limit Threshold Voltage VILIM1 0.76 0.8 0.84 V VCS increasing 8
Leading Edge Blanking Duration tLEB1 220 265 330 ns DRV minimum width minus tdelay(ILIM1) 8
Minimum Peak Current (version xxxBx) VCS(MIN) 115 150 185 mV Versions xxxBx 9
Abnormal Overcurrent Fault Threshold Voltage VILIM2 1.125 1.2 1.275 V VCS increasing, VFB = 4 V 9
Pull-Up Current Source ICS 0.7 1 1.5 A VCS = VILIM2 − 10 mV 9
Jitter Frequency (version xAxxx) fjitter 1.43 1.55 1.68 kHz Versions xAxxx 9
Peak Jitter Voltage (version xAxxx) Vjitter 65 75 85 mV Versions xAxxx 9
Flyback Overload Fault Timer (other versions) tOVLD 120 160 200 ms VCS = VILIM1 9
Overvoltage Protection (OVP) Threshold VFault(OVP) 2.79 3 3.21 V VFault increasing 9
Overtemperature Protection (OTP) Threshold VFault(OTP_in) 380 400 420 mV VFault decreasing 9
Autorecovery Timer trestart 1.8 2 2.2 s 9

CAD (KiCad official)

  • Symbol: NCP1342DADBDGD1R2G
  • Footprint: Package_SO:SOIC-10_3.9x4.9mm_P1mm
  • 3D model: SOP-10, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.75 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: ncp1342dadbdgd1r2g-etched.step / ncp1342dadbdgd1r2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp1342dadbdgd1r2g.step / ncp1342dadbdgd1r2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (44 pp, sha256 d866dd96ea7357e3, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF