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NCP12400CAHAB0DR2G

onsemi · AC-DC Controllers & Regulators · SOIC-7

NCP12400CAHAB0DR2G from onsemi, in a SOIC-7. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FAULT input Pull the pin up or down to stop the controller, and an internal current source allows direct connection of an NTC for over temperature detection.
2 FB input An optocoupler connected to ground controls the output regulation, and the part goes to the low consumption Off mode if the FB pin is pulled to GND.
3 CS input This input senses the primary current for current-mode operation, offers an overpower compensation adjustment, and implements overvoltage protection.
4 GND power_in The controller ground.
5 DRV output Drives the external MOSFET.
6 VCC power_in This supply pin accepts up to 28 Vdc with overvoltage detection and is connected to an external auxiliary voltage.
8 HV input Connects to the rectified ac line for start-up current source, self-supply, brown-out detection, X2 capacitor discharge and HV sensing, and it is not allowed to connect this pin to a dc voltage.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-7
Category Power Management ICs
Pins 7

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum voltage on DRV pin -0.3 20 V DC current self-limited if operated within the allowed range (Note 2) 5
DRV pin current (peak) -1000 1000 mA Peak 5
Power supply voltage, VCC pin, continuous voltage VCC -0.3 36 V Continuous voltage 5
VCC pin current (peak) VCC -30 30 mA Peak 5
Maximum voltage on HV pin -0.3 750 V DC current self-limited if operated within the allowed range 5
HV pin current -20 20 mA 5
Maximum voltage on low power pins (except pin 5, pin 6 and pin 8) Vmax -0.3 5.5 V DC current self-limited if operated within the allowed range (Note 2) 5
Low power pins current (peak) -10 10 mA Peak 5
Operating Junction Temperature TJMAX -40 150 °C 5
Storage Temperature Range TSTRGMAX -60 150 °C 5
ESD Capability, HBM model (All pins except HV) 4000 V HBM, all pins except HV (Note 1) 5
ESD Capability, HBM model (pin 8, HV) 2000 V HBM, pin 8 (HV) 5
ESD Capability, Charge Discharge Model 500 V Charge discharge model (Note 1) 5
Minimum voltage for current source operation VHV(min) 30 40 V 5
Current flowing out of VCC pin Istart1 0.2 0.5 0.8 mA VCC = 0 V 5
Current flowing out of VCC pin Istart2 5 8 11 mA VCC = VCC(on) − 0.5 V 5
Off-state leakage current Istart(off) 2 6 A VHV = 750 V, VCC = 15 V 5
HV current source restart threshold VCC(min) 9.5 10.5 11.5 V 5
Turn-off threshold VCC(off) 8.4 8.9 9.3 V 5
Overvoltage threshold VCC(ovp) 25 26.5 28 V Standard version (not option EAHBB, BBBBB) 5
VCC decreasing level at which the internal logic resets VCC(reset) 4.8 7 7.7 V 6
VCC level for ISTART1 to ISTART2 transition VCC(inhibit) 1 2.1 3 V 6
Internal current consumption ICC1 1 1.3 2 mA DRV open, VFB = 3 V, 65 kHz 6
Internal current consumption ICC3 1.5 2.1 2.9 mA Cdrv = 1 nF, VFB = 3 V, 65 kHz 6
Brown-out threshold (option C), VHV going up VHV(start) 87 95 103 V VHV going up 6
Brown-out threshold (option C), VHV going down VHV(stop) 85 93 101 V VHV going down 6
Comparator hysteresis observed at HV pin VHV(hyst) 2 3 4 V 6
Shunt regulator voltage at VCC pin during X2 discharge event VCC(dis) 10 11 12 V 6
Timer duration for no line detection tDET 21 32 43 ms 6
Discharge timer duration tDIS 21 32 43 ms 6
Oscillator frequency 65 kHz version fOSC 61 65 69 kHz 65 kHz version 6
Maximum duty-ratio (corresponding to maximum on time at maximum switching frequency) DMAX 75 80 85 % 6
Frequency jittering amplitude, in percentage of FOSC Ajitter 3 4 5 kHz Printed as ±3.0/±4.0/±5.0 kHz, percentage of FOSC 6
Frequency jittering modulation frequency Fjitter 85 125 165 Hz 6
Feedback voltage threshold below which frequency foldback starts VFB(foldS) 2.4 2.5 2.6 V TJ = 25°C 6
Feedback voltage threshold below which frequency foldback is complete VFB(foldE) 2.05 2.15 2.25 V TJ = 25°C 6
Minimum switching frequency fOSC(min) 25 28 31 kHz VFB = Vskip(in) + 0.1 6
Rise time, 10 to 90% of VCC trise 40 70 ns VCC = VCC(off) + 0.2 V, CDRV = 1 nF 7
Fall time, 90 to 10% of VCC tfall 30 60 ns VCC = VCC(off) + 0.2 V, CDRV = 1 nF 7
Clamping voltage (maximum gate voltage) VDRV(clamp) 10 12 14 V VCC = VCC(ovp), 0.2 V, DRV high, RDRV = 33 k, Cload = 220 pF 7
High-state voltage drop VDRV(drop) 1 V VCC = VCC(min) + 0.2 V, RDRV = 33 k, DRV high 7
Maximum internal current setpoint VILIM 0.66 0.7 0.74 V VFB > 3.5 V 7
Propagation delay from VIlimit detection to DRV off tdelay 50 70 ns VCS = VILIM 7
Leading Edge Blanking Duration for VILIM tLEB 180 250 320 ns 7
Threshold for immediate fault protection activation VCS(stop) 0.95 1.05 1.15 V 7
Leading Edge Blanking Duration for VCS(stop) tBCS 75 120 150 ns Note 6 7
Soft-start duration (option A) tSSTART 3.2 4 4.8 ms From 1st pulse to VCS = VILIM 7
Frozen current setpoint (option H) VI(freeze) 250 300 350 mV Option H 7
Over voltage protection threshold when DRV is low VOVP(CS) 1 1.05 1.1 V VCS going up 7
Blanking duration on OVP detection tOVP,CS 0.7 1 1.3 s 7
Internal pull-up resistor RFB(up) 30 40 50 k TJ = 25°C 7
Feedback voltage thresholds for skip mode, VFB going down Vskip(in) 0.9 1 1.1 V VFB going down, TJ = 25°C 7
Feedback voltage thresholds for skip mode, VFB going up Vskip(out) 1.05 1.15 1.25 V VFB going up, TJ = 25°C 7
Internal pull-up voltage on the FB pin VFB(ref) 4.5 5 5.5 V 7
The voltage below which the part enters the off mode VOFF 0.5 0.6 0.7 V VCC > VCC(off) 8
Fault timer duration tfault 108 128 178 ms 8
Fault timer reset time tfault,res 150 200 250 s VCS < 0.7 V, D < 90% DMAX 8
Autorecovery mode latch-off time duration tautorec 0.85 1 1.35 s 8
FB voltage above which IOPC is applied VFB(OPCF) 2.6 V VHV = 365 V 8
High threshold VOVP 2.43 2.5 2.57 V VLatch going up 8
Low threshold VOTP 0.38 0.4 0.42 V VLatch going down, TJ = 25°C 8
OTP resistance threshold (TJ = 25°C) ROTP 7.6 8 8.5 k External NTC resistance is going down 8
Temperature shutdown TTSD 150 °C TJ going up 8
Temperature shutdown hysteresis TTSD(HYS) 30 °C TJ going down 8
Thermal Resistance Junction-to-Air, low conductivity PCB RJ-A 162 °C/W SOIC-7, low conductivity PCB (Note 3) 5
Thermal Resistance Junction-to-Case RJ-C 73 °C/W SOIC-7 5

CAD (KiCad official)

  • Symbol: NCP12400CAHAB0DR2G
  • Footprint: Package_SO:SOIC-8-N7_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-7 (KiCad packages3D, STEP)
  • 3D model files: ncp12400cahab0dr2g-etched.step / ncp12400cahab0dr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp12400cahab0dr2g.step / ncp12400cahab0dr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (47 pp, sha256 5b6a98e6b6537aad, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF