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Contents

README

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NCP115CMX280TCG

onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)

NCP115CMX280TCG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output voltage pin; a ceramic capacitor of at least 1 µF is needed from this pin to ground to assure stability.
2 GND power_in Power supply ground.
3 EN input Driving EN over 0.9 V turns on the regulator; driving EN below 0.4 V puts the regulator into shutdown mode.
4 IN power_in Input pin (1.7 V to 5.5 V operating range); a small capacitor is needed from this pin to ground to assure stability.
5 EPAD passive Exposed pad should be connected directly to the GND pin and soldered to a large ground copper plane for effective heat removal.

Key specifications

Parameter Value
Manufacturer onsemi
Package XDFN-4-EP(1x1)
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Input Voltage VIN 1.7 5.5 V 3
Output Voltage Accuracy (VOUT > 2.0 V) VOUT -2 2 % -40°C ≤ TJ ≤ 85°C, VOUT > 2.0 V 3
Line Regulation RegLINE 0.01 0.1 %/V VOUT + 0.5 V ≤ VIN ≤ 5.5 V (VIN ≥ 1.7 V) 3
Load Regulation - XDFN4 package RegLOAD 12 30 mV IOUT = 1 mA to 300 mA 3
Dropout Voltage - XDFN4 package VDO 250 320 mV IOUT = 300 mA, VOUT = 2.8 V 3
Output Current Limit ICL 300 600 mA VOUT = 90% VOUT(nom) 3
Quiescent Current IQ 50 95 µA IOUT = 0 mA 3
Shutdown Current IDIS 0.01 1 µA VEN ≤ 0.4 V, VIN = 5.5 V 3
EN Pin Threshold Voltage High VEN_HI 0.9 V VEN voltage increasing 3
EN Pin Threshold Voltage Low VEN_LO 0.4 V VEN voltage decreasing 3
EN Pin Input Current IEN 0.3 1 µA VEN = 5.5 V 3
VOUT Slew Rate (Slow, version C and D) VOUT_SR 20 mV/µs VOUT = 3.3 V, IOUT = 10 mA 3
Power Supply Rejection Ratio PSRR 70 dB VIN = 3.8 V, VOUT = 3.5 V, IOUT = 10 mA, f = 1 kHz 3
Output Noise Voltage VN 70 µVrms f = 10 Hz to 100 kHz 3
Thermal Shutdown Temperature TSD 160 °C Temperature increasing from TJ = +25°C 3
Thermal Shutdown Hysteresis TSDH 20 °C Temperature falling from TSD 3
Active Output Discharge Resistance RDIS 100 Ω VEN < 0.4 V, Version A and C only 3
Input Voltage VIN -0.3 6 V 2
Output Voltage VOUT -0.3 6 V -0.3 V to VIN + 0.3 V or 6 V 2
Enable Input VEN -0.3 6 V 2
Maximum Junction Temperature TJ(MAX) 150 °C 2
Storage Temperature TSTG -55 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V 2
ESD Capability, Machine Model ESDMM 200 V 2
Thermal Resistance, Junction-to-Air, XDFN4 1x1 mm RθJA 208 °C/W 1 oz, FR 4 PCB with 645 mm2 Cu area 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper copper area connected to the pins will also improve the 14

CAD (KiCad official)

  • Symbol: NCP115CMX280TCG
  • Footprint: Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
  • 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: ncp115cmx280tcg-etched.step / ncp115cmx280tcg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp115cmx280tcg.step / ncp115cmx280tcg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (19 pp, sha256 50d755fd53bcfc9a, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF