component
NCP115CMX250TCG
Public Made by Adomby adom
onsemi Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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NCP115CMX250TCG
onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · XDFN-4-EP(1x1)
NCP115CMX250TCG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage pin; a small ceramic capacitor of minimum 1 µF is needed from this pin to ground to assure stability. |
| 2 | GND | power_in | Power supply ground, which the exposed pad should be connected directly to. |
| 3 | EN | input | Driving EN over 0.9 V turns on the regulator and driving EN below 0.4 V puts it into shutdown mode. |
| 4 | IN | power_in | Input pin with an operating input voltage range of 1.7 V to 5.5 V; a small capacitor is needed from this pin to ground to assure stability. |
| 5 | EPAD | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | XDFN-4-EP(1x1) |
| Category | Power Management (PMIC) |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Input Voltage | VIN | 1.7 | 5.5 | V | 3 | ||
| Output Voltage Accuracy | VOUT | -2 | 2 | % | −40°C ≤ TJ ≤ 85°C; VOUT > 2.0 V | 3 | |
| Line Regulation | RegLINE | 0.01 | 0.1 | %/V | VOUT + 0.5 V ≤ VIN ≤ 5.5 V (VIN ≥ 1.7 V) | 3 | |
| Load Regulation − XDFN4 package | RegLOAD | 12 | 30 | mV | IOUT = 1 mA to 300 mA | 3 | |
| Output Current Limit | ICL | 300 | 600 | mA | VOUT = 90% VOUT(nom) | 3 | |
| Quiescent Current | IQ | 50 | 95 | µA | IOUT = 0 mA | 3 | |
| Shutdown Current | IDIS | 0.01 | 1 | µA | VEN ≤ 0.4 V, VIN = 5.5 V | 3 | |
| EN Pin Threshold Voltage − High Threshold | VEN_HI | 0.9 | V | VEN Voltage increasing | 3 | ||
| EN Pin Threshold Voltage − Low Threshold | VEN_LO | 0.4 | V | VEN Voltage decreasing | 3 | ||
| VOUT Slew Rate | VOUT_SR | 20 | mV/s | VOUT = 3.3 V, IOUT = 10 mA; Slow (version C and D) | 3 | ||
| EN Pin Input Current | IEN | 0.3 | 1 | µA | VEN = 5.5 V | 3 | |
| Power Supply Rejection Ratio | PSRR | 70 | dB | VIN = 3.8 V, VOUT = 3.5 V; IOUT = 10 mA; f = 1 kHz | 3 | ||
| Output Noise Voltage | VN | 70 | µVrms | f = 10 Hz to 100 kHz | 3 | ||
| Thermal Shutdown Temperature | TSD | 160 | °C | Temperature increasing from TJ = +25°C | 3 | ||
| Thermal Shutdown Hysteresis | TSDH | 20 | °C | Temperature falling from TSD | 3 | ||
| Active Output Discharge Resistance | RDIS | 100 | Ω | VEN < 0.4 V, Version A and C only | 3 | ||
| Input Voltage (absolute maximum) | VIN | -0.3 | 6 | V | Note 1 | 2 | |
| Output Voltage (absolute maximum) | VOUT | -0.3 | V | Printed upper limit: VIN + 0.3 V or 6 V | 2 | ||
| Enable Input Voltage (absolute maximum) | VEN | -0.3 | 6 | V | 2 | ||
| Maximum Junction Temperature | TJ(MAX) | 150 | °C | 2 | |||
| Storage Temperature | TSTG | -55 | 150 | °C | 2 | ||
| ESD Capability, Human Body Model | ESDHBM | 2000 | V | EIA/JESD22-A114 (Note 2) | 2 | ||
| ESD Capability, Machine Model | ESDMM | 200 | V | EIA/JESD22-A115 (Note 2) | 2 | ||
| Thermal Resistance, Junction-to-Air (XDFN4 1x1 mm) | RJA | 208 | °C/W | Single component on 1 oz FR4 PCB with 645 mm2 Cu area (Note 3) | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | copper area connected to the pins will also improve the | 14 |
CAD (KiCad official)
- Symbol:
NCP115CMX250TCG - Footprint:
Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm - 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files:
ncp115cmx250tcg-etched.step/ncp115cmx250tcg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ncp115cmx250tcg.step/ncp115cmx250tcg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (19 pp, sha256
50d755fd53bcfc9a, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# NCP115CMX250TCG
**onsemi** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · XDFN-4-EP(1x1)
NCP115CMX250TCG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage pin; a small ceramic capacitor of minimum 1 µF is needed from this pin to ground to assure stability. |
| 2 | GND | power_in | Power supply ground, which the exposed pad should be connected directly to. |
| 3 | EN | input | Driving EN over 0.9 V turns on the regulator and driving EN below 0.4 V puts it into shutdown mode. |
| 4 | IN | power_in | Input pin with an operating input voltage range of 1.7 V to 5.5 V; a small capacitor is needed from this pin to ground to assure stability. |
| 5 | EPAD | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | XDFN-4-EP(1x1) |
| Category | Power Management (PMIC) |
| Pins | 5 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Input Voltage | VIN | 1.7 | | 5.5 | V | | 3 |
| Output Voltage Accuracy | VOUT | -2 | | 2 | % | −40°C ≤ TJ ≤ 85°C; VOUT > 2.0 V | 3 |
| Line Regulation | RegLINE | | 0.01 | 0.1 | %/V | VOUT + 0.5 V ≤ VIN ≤ 5.5 V (VIN ≥ 1.7 V) | 3 |
| Load Regulation − XDFN4 package | RegLOAD | | 12 | 30 | mV | IOUT = 1 mA to 300 mA | 3 |
| Output Current Limit | ICL | 300 | 600 | | mA | VOUT = 90% VOUT(nom) | 3 |
| Quiescent Current | IQ | | 50 | 95 | µA | IOUT = 0 mA | 3 |
| Shutdown Current | IDIS | | 0.01 | 1 | µA | VEN ≤ 0.4 V, VIN = 5.5 V | 3 |
| EN Pin Threshold Voltage − High Threshold | VEN_HI | 0.9 | | | V | VEN Voltage increasing | 3 |
| EN Pin Threshold Voltage − Low Threshold | VEN_LO | | | 0.4 | V | VEN Voltage decreasing | 3 |
| VOUT Slew Rate | VOUT_SR | | 20 | | mV/s | VOUT = 3.3 V, IOUT = 10 mA; Slow (version C and D) | 3 |
| EN Pin Input Current | IEN | | 0.3 | 1 | µA | VEN = 5.5 V | 3 |
| Power Supply Rejection Ratio | PSRR | | 70 | | dB | VIN = 3.8 V, VOUT = 3.5 V; IOUT = 10 mA; f = 1 kHz | 3 |
| Output Noise Voltage | VN | | 70 | | µVrms | f = 10 Hz to 100 kHz | 3 |
| Thermal Shutdown Temperature | TSD | | 160 | | °C | Temperature increasing from TJ = +25°C | 3 |
| Thermal Shutdown Hysteresis | TSDH | | 20 | | °C | Temperature falling from TSD | 3 |
| Active Output Discharge Resistance | RDIS | | 100 | | Ω | VEN < 0.4 V, Version A and C only | 3 |
| Input Voltage (absolute maximum) | VIN | -0.3 | | 6 | V | Note 1 | 2 |
| Output Voltage (absolute maximum) | VOUT | -0.3 | | | V | Printed upper limit: VIN + 0.3 V or 6 V | 2 |
| Enable Input Voltage (absolute maximum) | VEN | -0.3 | | 6 | V | | 2 |
| Maximum Junction Temperature | TJ(MAX) | | | 150 | °C | | 2 |
| Storage Temperature | TSTG | -55 | | 150 | °C | | 2 |
| ESD Capability, Human Body Model | ESDHBM | | | 2000 | V | EIA/JESD22-A114 (Note 2) | 2 |
| ESD Capability, Machine Model | ESDMM | | | 200 | V | EIA/JESD22-A115 (Note 2) | 2 |
| Thermal Resistance, Junction-to-Air (XDFN4 1x1 mm) | RJA | | 208 | | °C/W | Single component on 1 oz FR4 PCB with 645 mm2 Cu area (Note 3) | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | copper area connected to the pins will also improve the | 14 |
## CAD (KiCad official)
- Symbol: `NCP115CMX250TCG`
- Footprint: `Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm`
- 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files: `ncp115cmx250tcg-etched.step` / `ncp115cmx250tcg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ncp115cmx250tcg.step` / `ncp115cmx250tcg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588914563521646592) (19 pp, sha256 `50d755fd53bcfc9a`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ncp115cmx250tcg-datasheet.pdf)