component
NCP115AMX250TCG
Public Made by Adomby adom
onsemi Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 1d ago |
| viewers | 1d ago |
| ncp115amx250tcg-etched.glb | 1d ago |
| ncp115amx250tcg-etched.step | 1d ago |
| ncp115amx250tcg-hero.glb | 1d ago |
| ncp115amx250tcg-hero.overlay.json | 1d ago |
| ncp115amx250tcg.glb | 1d ago |
| ncp115amx250tcg.kicad_mod | 1d ago |
| ncp115amx250tcg.kicad_sym | 1d ago |
| ncp115amx250tcg.lbr | 1d ago |
| ncp115amx250tcg.step | 1d ago |
| package.json | 1d ago |
| page.json | 1d ago |
| README.md | 1d ago |
| verification.json | 1d ago |
NCP115AMX250TCG
onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)
NCP115AMX250TCG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage pin; a small ceramic capacitor with a minimum value of 1 µF is needed from this pin to ground to assure stability. |
| 2 | GND | power_in | Power supply ground. |
| 3 | EN | input | Driving EN above 0.9 V turns on the regulator and driving EN below 0.4 V puts the regulator into shutdown mode. |
| 4 | IN | power_in | Input pin; a small capacitor is needed from this pin to ground to assure stability (absolute maximum input voltage is −0.3 V to 6 V). |
| 5 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | XDFN-4-EP(1x1) |
| Category | Power Management ICs |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage Accuracy (VOUT > 2.0 V) | VOUT | -2 | 2 | % | −40°C ≤ TJ ≤ 85°C, VOUT > 2.0 V | 3 | |
| Load Regulation (XDFN4) | RegLOAD | 12 | 30 | mV | IOUT = 1 mA to 300 mA | 3 | |
| Line Regulation | RegLINE | 0.01 | 0.1 | %/V | VOUT + 0.5 V ≤ VIN ≤ 5.5 V (VIN ≥ 1.7 V) | 3 | |
| Output Current Limit | ICL | 300 | 600 | mA | VOUT = 90% VOUT(nom) | 3 | |
| EN Pin Threshold Voltage, High | VEN_HI | 0.9 | V | VEN voltage increasing | 3 | ||
| EN Pin Threshold Voltage, Low | VEN_LO | 0.4 | V | VEN voltage decreasing | 3 | ||
| Operating Input Voltage | VIN | 1.7 | 5.5 | V | 3 | ||
| Operating Junction Temperature | TJ | -40 | 85 | °C | Electrical characteristics operating range | 3 | |
| Quiescent Current | IQ | 50 | 95 | µA | IOUT = 0 mA | 3 | |
| Shutdown Current | IDIS | 0.01 | 1 | µA | VEN ≤ 0.4 V, VIN = 5.5 V | 3 | |
| EN Pin Input Current | IEN | 0.3 | 1 | µA | VEN = 5.5 V | 3 | |
| VOUT Slew Rate (Normal, version A) | VOUT_SR | 190 | mV/s | Normal (version A and B); VOUT = 3.3 V, IOUT = 10 mA | 3 | ||
| Power Supply Rejection Ratio | PSRR | 70 | dB | VIN = 3.8 V, VOUT = 3.5 V, IOUT = 10 mA, f = 1 kHz | 3 | ||
| Output Noise Voltage | VN | 70 | µVrms | f = 10 Hz to 100 kHz | 3 | ||
| Thermal Shutdown Temperature | TSD | 160 | °C | Temperature increasing from TJ = +25°C | 3 | ||
| Thermal Shutdown Hysteresis | TSDH | 20 | °C | Temperature falling from TSD | 3 | ||
| Active Output Discharge Resistance | RDIS | 100 | Ω | VEN < 0.4 V, Version A and C only | 3 | ||
| Input Voltage (absolute maximum) | VIN | -0.3 | 6 | V | 2 | ||
| Output Voltage (absolute maximum) | VOUT | -0.3 | V | Upper limit printed as VIN + 0.3 V or 6 V | 2 | ||
| Enable Input Voltage (absolute maximum) | VEN | -0.3 | 6 | V | 2 | ||
| Maximum Junction Temperature | TJ(MAX) | 150 | °C | 2 | |||
| Storage Temperature | TSTG | -55 | 150 | °C | 2 | ||
| ESD Capability, Human Body Model | ESDHBM | 2000 | V | Per EIA/JESD22-A114 | 2 | ||
| ESD Capability, Machine Model | ESDMM | 200 | V | Per EIA/JESD22-A115 | 2 | ||
| Thermal Resistance, Junction-to-Air (XDFN4 1x1 mm) | RJA | 208 | °C/W | Single component on 1 oz FR4 PCB, 645 mm² Cu area | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | copper area connected to the pins will also improve the | 14 |
CAD (KiCad official)
- Symbol:
NCP115AMX250TCG - Footprint:
Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm - 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files:
ncp115amx250tcg-etched.step/ncp115amx250tcg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ncp115amx250tcg.step/ncp115amx250tcg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (19 pp, sha256
74cf00416de9004f, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).