component
NCP114AMX250TBG
Public Made by Adomby adom
onsemi Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, UDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownNCP114AMX250TBG
onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · UDFN-4-EP(1x1)
NCP114AMX250TBG from onsemi, in a UDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage pin; a small ceramic capacitor with a minimum value of 1 µF is needed from this pin to ground to assure stability. |
| 2 | GND | power_in | Power supply ground; the exposed pad should be connected directly to this pin. |
| 3 | EN | input | Driving EN above 0.9 V turns on the regulator and driving EN below 0.4 V puts it into shutdown mode; an internal pull-down of typ. 300 nA keeps the device off when EN is not connected. |
| 4 | IN | power_in | Input pin; a small capacitor is needed from this pin to ground to assure stability, with an operating input voltage range of 1.7 V to 5.5 V. |
| 5 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | UDFN-4-EP(1x1) |
| Category | Power Management (PMIC) |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Input Voltage | VIN | 1.7 | 5.5 | V | 3 | ||
| Output Voltage Accuracy (VOUT > 2.0 V) | VOUT | -2 | 2 | % | −40°C ≤ TJ ≤ 85°C; VOUT > 2.0 V | 3 | |
| Load Regulation - UDFN package | RegLOAD | 12 | 30 | mV | IOUT = 1 mA to 300 mA | 3 | |
| Load Transient | TranLOAD | -50 | 30 | mV | IOUT = 1 mA to 300 mA or 300 mA to 1 mA in 1 µs, COUT = 1 µF | 3 | |
| Output Current Limit | ICL | 300 | 600 | mA | VOUT = 90% VOUT(nom) | 3 | |
| Ground Current | IQ | 50 | 95 | µA | IOUT = 0 mA | 3 | |
| Shutdown Current | IDIS | 0.01 | 1 | µA | VEN ≤ 0.4 V, VIN = 5.5 V | 3 | |
| EN Pin Threshold Voltage High | VEN_HI | 0.9 | V | VEN Voltage increasing | 3 | ||
| EN Pin Threshold Voltage Low | VEN_LO | 0.4 | V | VEN Voltage decreasing | 3 | ||
| EN Pin Input Current | IEN | 0.3 | 1 | µA | VEN = 5.5 V | 3 | |
| Power Supply Rejection Ratio | PSRR | 75 | dB | VIN = 3.6 V, VOUT = 3.1 V, IOUT = 150 mA, f = 1 kHz | 3 | ||
| Output Noise Voltage | VN | 70 | µVrms | VIN = 2.5 V, VOUT = 1.8 V, IOUT = 150 mA, f = 10 Hz to 100 kHz | 3 | ||
| Thermal Shutdown Temperature | TSD | 160 | °C | Temperature increasing from TJ = +25°C | 3 | ||
| Thermal Shutdown Hysteresis | TSDH | 20 | °C | Temperature falling from TSD | 3 | ||
| Active Output Discharge Resistance | RDIS | 100 | Ω | VEN < 0.4 V, Version A only | 3 | ||
| Input Voltage (Note 1) | VIN | -0.3 | 6 | V | 2 | ||
| Output Voltage (upper limit VIN + 0.3 V or 6 V) | VOUT | -0.3 | V | 2 | |||
| Enable Input Voltage | VEN | -0.3 | 6 | V | 2 | ||
| Maximum Junction Temperature | TJ(MAX) | 150 | °C | 2 | |||
| Storage Temperature | TSTG | -55 | 150 | °C | 2 | ||
| ESD Capability, Human Body Model | ESDHBM | 2000 | V | ESD HBM per EIA/JESD22-A114 (Note 2) | 2 | ||
| ESD Capability, Machine Model | ESDMM | 200 | V | ESD MM per EIA/JESD22-A115 (Note 2) | 2 | ||
| Thermal Resistance, Junction-to-Air, UDFN4 1x1 mm | RJA | 170 | °C/W | Note 3: single component on 1 oz FR4 PCB, 645 mm² Cu area | 2 | ||
| Operating Junction Temperature Range | TJ | -40 | 85 | °C | 3 | ||
| Output Capacitor Effective Capacitance (minimum) | 0.22 | µF | Stability over temperature, DC bias and package size | 13 | |||
| Output Capacitor ESR (maximum) | 2 | Ω | COUT | 13 | |||
| Input Capacitor (minimum) | CIN | 1 | µF | Ceramic X5R or X7R, as close as possible to IN pin | 13 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | copper area connected to the pins will also improve the | 14 |
CAD (KiCad official)
- Symbol:
NCP114AMX250TBG - Footprint:
Package_DFN_QFN:UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm - 3D model: UDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files:
ncp114amx250tbg-etched.step/ncp114amx250tbg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ncp114amx250tbg.step/ncp114amx250tbg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (19 pp, sha256
141e9c1ab1f728a9, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).