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NCP1117ST25T3G

onsemi · Linear Voltage Regulators (LDO) · SOT-223

NCP1117ST25T3G from onsemi, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Adjust/Ground power_in Adjust/Ground pin serves as the ground return for the fixed-output devices, where the ground current Ignd ranges from 3.0 mA to 5.0 mA depending on output voltage.
2 Output power_out Output pin delivers the regulated voltage at more than 1.0 A, with a maximum dropout of 1.2 V at 800 mA over temperature, and is electrically connected to the heatsink tab.
3 Input power_in Input pin accepts up to 20 V, which is the maximum input voltage rating for the device.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-223
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage, Fixed 2.5 V (Vin = 3.9 V to 10 V) Vout 2.45 2.5 2.55 V Vin = 3.9 V to 10 V, Iout = 0 mA to 800 mA (Note 4) 3
Output Voltage, Fixed 2.5 V (25 C, Vin = 4.5 V) Vout 2.475 2.5 2.525 V Vin = 4.5 V, Iout = 10 mA, TA = 25 C 3
Dropout Voltage (Iout = 100 mA) Vin-Vout 0.95 1.1 V Measured at Vout - 100 mV, Iout = 100 mA 3
Dropout Voltage (Iout = 500 mA) Vin-Vout 1.01 1.15 V Measured at Vout - 100 mV, Iout = 500 mA 3
Dropout Voltage (Iout = 800 mA) Vin-Vout 1.07 1.2 V Measured at Vout - 100 mV, Iout = 800 mA 3
Output Current Limit Iout 1000 1500 2200 mA Vin-Vout = 5.0 V, TA = 25 C, Note 6 3
Quiescent Current 2.5 V IQ 5.2 10 mA Vin = 10 V 4
Line Regulation 2.5 V Regline 0.5 2.5 mV Vin = 3.9 V to 10 V, Iout = 0 mA 3
Load Regulation 2.5 V Regline 3.3 7.5 mV Iout = 0 mA to 800 mA, Vin = 3.9 V 3
Ripple Rejection 2.5 V RR 62 68 dB Vin-Vout = 6.4 V, Iout = 500 mA, 10 Vpp 120 Hz Sinewave 4
Thermal Regulation 0.01 0.1 %/W TA = 25 C, 30 ms Pulse 4
Input Voltage Vin 20 V Note 1 2
Operating Ambient Temperature Range (NCP1117) TA 0 125 C NCP1117 (non-automotive) 2
Maximum Die Junction Temperature Range TJ -55 150 C 2
Storage Temperature Range Tstg -65 150 C 2
Thermal Resistance, Junction-to-Ambient, SOT-223 RJA 160 C/W Minimum Size Pad 2
Thermal Resistance, Junction-to-Case, SOT-223 RJC 15 C/W 2

CAD (KiCad official)

  • Symbol: NCP1117ST25T3G
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: ncp1117st25t3g-etched.step / ncp1117st25t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp1117st25t3g.step / ncp1117st25t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (17 pp, sha256 1852f8c8cf0eb18c, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF