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Contents

README

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NCP1117IST50T3G

onsemi · Linear Voltage Regulators (LDO) · SOT-223

NCP1117IST50T3G from onsemi, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin (listed as Adjust/Ground; for the fixed 5.0 V version it is ground, with ground current of 3.0 mA to 5.0 mA).
2 OUTPUT power_out Regulated 5.0 V output, over 1.0 A capable, needing an output capacitor of at least 4.7 µF with ESR of 33 mΩ (typ) to 2.2 Ω for stability; the heatsink tab is connected to this pin.
3 INPUT power_in Unregulated input supply, operates up to 20 V maximum input voltage.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-223
Category Power Supply Chip
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage, 5.0 V Vout 4.95 5 5.05 V Vin = 7.0 V, Iout = 10 mA, TA = 25 °C 3
Output Voltage, 5.0 V over line/load Vout 4.9 5.1 V Vin = 6.5 V to 12 V, Iout = 0 mA to 800 mA 3
Line Regulation, 5.0 V Regline 6 7.5 mV Vin = 6.5 V to 15 V, Iout = 0 mA 3
Load Regulation, 5.0 V Regload 6.7 15 mV Iout = 0 mA to 800 mA, Vin = 6.5 V 3
Dropout Voltage Vin-Vout 0.95 1.1 V Measured at Vout - 100 mV, Iout = 100 mA 3
Dropout Voltage Vin-Vout 1.01 1.15 V Measured at Vout - 100 mV, Iout = 500 mA 3
Dropout Voltage Vin-Vout 1.07 1.2 V Measured at Vout - 100 mV, Iout = 800 mA 3
Output Current Limit Iout 1000 1500 2200 mA Vin-Vout = 5.0 V, TA = 25°C 3
Quiescent Current, 5.0 V IQ 6 10 mA Vin = 15 V 4
Thermal Regulation 0.01 0.1 %/W TA = 25°C, 30 ms Pulse 4
Ripple Rejection, 5.0 V RR 57 64 dB Vin-Vout = 6.4 V, Iout = 500 mA, 10 Vpp 120 Hz Sinewave 4
Temperature Stability ST 0.5 % 4
Long Term Stability St 0.3 % TA = 25°C, 1000 Hrs End Point Measurement 4
RMS Output Noise N 0.003 %Vout f = 10 Hz to 10 kHz 4
Input Voltage Vin 20 V 2
Maximum Die Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range Tstg -65 150 °C 2
Operating Ambient Temperature Range (NCP1117I) TA -40 125 °C NCP1117I 2
Thermal Resistance, Junction-to-Ambient RθJA 160 °C/W Case 318H (SOT-223), Minimum Size Pad 2
Thermal Resistance, Junction-to-Case RθJC 15 °C/W Case 318H (SOT-223) 2

CAD (KiCad official)

  • Symbol: NCP1117IST50T3G
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: ncp1117ist50t3g-etched.step / ncp1117ist50t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncp1117ist50t3g.step / ncp1117ist50t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (19 pp, sha256 8bd6d0050aa83242, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF