component
NCP110AMX120TBG
Public Made by Adomby adom
onsemi Linear Voltage Regulators (LDO), XDFN-4-EP(1x1). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownNCP110AMX120TBG
onsemi · Linear Voltage Regulators (LDO) · XDFN-4-EP(1x1)
NCP110AMX120TBG from onsemi, in a XDFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage; the output should be bypassed with a small 1 F ceramic capacitor. |
| 2 | GND | power_in | Common ground connection. |
| 3 | EN | input | Chip enable: applying VEN < 0.2 V disables the regulator, and pulling VEN > 0.7 V enables the LDO. |
| 4 | IN | power_in | Input voltage supply pin. |
| 5 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | XDFN-4-EP(1x1) |
| Category | Power Management ICs |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage Accuracy | VOUT | -30 | 30 | mV | VIN = VOUT(NOM) + 0.3 V (VIN ≥ 1.1 V); VOUT(NOM) ≤ 1.5 V | 4 | |
| Dropout Voltage | VDO | 60 | 140 | mV | VOUT(NOM) = 1.20 V; IOUT = 110 mA | 4 | |
| Dropout Voltage | VDO | 110 | 190 | mV | VOUT(NOM) = 1.20 V; IOUT = 200 mA | 4 | |
| Operating Input Voltage | VIN | 1.1 | 5.5 | V | 4 | ||
| Output Current Limit | ICL | 225 | 300 | mA | VOUT = 90% VOUT(NOM) | 4 | |
| Quiescent Current | IQ | 20 | 25 | µA | IOUT = 0 mA | 4 | |
| Shutdown Current | IDIS | 0.01 | 1 | µA | VEN ≤ 0.2 V, VIN = 1.1 V | 4 | |
| EN Input Voltage High | VENH | 0.7 | V | EN Input Voltage “H” | 4 | ||
| EN Input Voltage Low | VENL | 0.2 | V | EN Input Voltage “L” | 4 | ||
| EN Pull Down Current | IEN | 0.2 | 0.5 | µA | VEN = 1.1 V | 4 | |
| Absolute Maximum Input Voltage | VIN | -0.3 | 6 | V | 3 | ||
| Absolute Maximum Output Voltage | VOUT | -0.3 | 6 | V | VIN + 0.3, max. 6 V | 3 | |
| Absolute Maximum Chip Enable Input Voltage | VCE | -0.3 | 6 | V | 3 | ||
| Absolute Maximum Junction Temperature | TJ | 150 | °C | 3 | |||
| Absolute Maximum Storage Temperature | TSTG | -55 | 150 | °C | 3 | ||
| ESD Capability, Human Body Model | ESDHBM | 2000 | V | 3 | |||
| ESD Capability, Machine Model | ESDMM | 200 | V | 3 | |||
| Thermal Resistance, Junction-to-Air, XDFN4 | RJA | 208 | °C/W | 3 | |||
| Operating Junction Temperature | TJ | -40 | 125 | °C | Operating junction temperature range | 4 | |
| Short Circuit Current | ISC | 300 | mA | VOUT = 0 V | 4 | ||
| Line Regulation | LineReg | 0.02 | %/V | VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.5 V, (VIN ≥ 1.1 V) | 4 | ||
| Load Regulation | LoadReg | 0.001 | %/mA | IOUT = 1 mA to 200 mA | 4 | ||
| Turn-On Time | tON | 120 | µs | COUT = 1 µF, from assertion of VEN to VOUT = 95% VOUT(NOM) | 4 | ||
| Power Supply Rejection Ratio | PSRR | 90 | dB | IOUT = 20 mA, VIN = VOUT + 0.3 V, f = 100 Hz | 4 | ||
| Power Supply Rejection Ratio | PSRR | 95 | dB | IOUT = 20 mA, VIN = VOUT + 0.3 V, f = 1 kHz | 4 | ||
| Power Supply Rejection Ratio | PSRR | 85 | dB | IOUT = 20 mA, VIN = VOUT + 0.3 V, f = 10 kHz | 4 | ||
| Power Supply Rejection Ratio | PSRR | 55 | dB | IOUT = 20 mA, VIN = VOUT + 0.3 V, f = 100 kHz | 4 | ||
| Output Voltage Noise | VN | 8.8 | VRMS | f = 10 Hz to 100 kHz | 4 | ||
| Thermal Shutdown Threshold, Temperature Rising | TSDH | 160 | °C | Temperature rising | 4 | ||
| Thermal Shutdown Threshold, Temperature Falling | TSDL | 140 | °C | Temperature falling | 4 | ||
| Active Output Discharge Resistance | RDIS | 280 | Ω | VEN < 0.2 V, Version A only | 4 |
CAD (KiCad official)
- Symbol:
NCP110AMX120TBG - Footprint:
Package_DFN_QFN:OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm - 3D model: XDFN-4-EP(1x1) (KiCad packages3D, STEP)
- 3D model files:
ncp110amx120tbg-etched.step/ncp110amx120tbg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ncp110amx120tbg.step/ncp110amx120tbg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (18 pp, sha256
852726895c73c069, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).