component
NCN26010XMNTXG
Public Made by Adomby adom
onsemi Ethernet ICs, QFN-32(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownNCN26010XMNTXG
onsemi · Ethernet ICs · QFN-32(4x4)
NCN26010XMNTXG from onsemi, in a QFN-32(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | XO | output | XTAL oscillator output: connects to one pin of a quartz crystal when a crystal is the clock source, and must be left floating (no connect) when an external clock is used. |
| 2 | XI | input | XTAL system clock input, optionally connected to an external crystal or a 3.3 V LVCMOS reference clock signal (25 MHz, ±100 ppm). |
| 3 | GND | power_in | Analog ground. |
| 4 | VDD | power_in | 3.3 V chip supply; recommended operating range 2.97 V to 3.63 V, absolute maximum −0.3 V to 3.63 V. |
| 5 | GND | power_in | Ground. |
| 6 | LINEP | bidirectional | Positive MDI data line of the 10BASE-T1S differential pair; absolute maximum line voltage −30 V to 30 V. |
| 7 | LINEN | bidirectional | Negative MDI data line of the 10BASE-T1S differential pair; absolute maximum line voltage −30 V to 30 V. |
| 8 | VDRVN | bidirectional | TX driver regulator output; connect to an off-chip 2.2 µF decoupling capacitor. |
| 9 | GND | power_in | Ground. |
| 10 | GND | power_in | Ground. |
| 11 | LED1/DIO1 | output | General-purpose I/O (8X LVCMOS) with programmable pull-up/pull-down that can drive an external LED through a bias resistor or other circuitry. |
| 12 | LED0/DIO0 | output | General-purpose I/O (8X LVCMOS) with programmable pull-up/pull-down that can drive an external LED through a bias resistor or other circuitry. |
| 13 | RSTn | bidirectional | Active-low asynchronous reset (8X open-drain, Schmitt-trigger) with internal pull-up of 54 kΩ typical; onsemi recommends an external 10 kΩ pull-up to VDDIO in noise-sensitive applications, and any driver must be open drain. |
| 14 | GND | power_in | Ground. |
| 15 | SCLK | input | SPI clock input with Schmitt-trigger input. |
| 16 | IRQn | output | Active-low interrupt request (4X open-drain), configurable to trigger on various events. |
| 17 | VDDIO | power_in | Digital I/O supply: 3.3 V (2.97 V to 3.63 V) or 2.5 V (2.25 V to 2.75 V) to support 2.5 V LVCMOS. |
| 18 | MOSI | input | SPI data input with Schmitt-trigger input. |
| 19 | CSn | input | Active-low SPI chip select input with Schmitt-trigger input; selects the device for SPI communication. |
| 20 | CLKO | output | 25 MHz clock output (4X LVCMOS) for other devices; designed to drive a maximum of four LVCMOS input loads, and an external clock buffer is recommended when driving 2.5 V I/O. |
| 21 | VDDIO | power_in | Digital I/O supply: 3.3 V (2.97 V to 3.63 V) or 2.5 V (2.25 V to 2.75 V) to support 2.5 V LVCMOS. |
| 22 | GND | power_in | Ground. |
| 23 | MISO | output | SPI data output (8X LVCMOS). |
| 24 | GND | power_in | Ground. |
| 25 | NC | unconnected | Do not connect. |
| 26 | NC | unconnected | Do not connect. |
| 27 | NC | unconnected | Do not connect. |
| 28 | DVDD | bidirectional | Output of the LDO supplying the digital core; connect to 2.2 µF decoupling capacitance. |
| 29 | DVDD | bidirectional | Always connect to pin 28 in the application. |
| 30 | GND | power_in | Ground. |
| 31 | GND | power_in | Ground. |
| 32 | NC | unconnected | Reserved; do not connect in the application. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | QFN-32(4x4) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 33 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Chip Supply (absolute maximum) | VDD | -0.3 | 3.63 | V | 5 | ||
| Ground (absolute maximum) | GND | -0.3 | 0 | V | 5 | ||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 5 | ||
| Lead Temperature, Soldering | TSLD | 260 | °C | 10 Sec. | 5 | ||
| Line Voltage P | LINEP | -30 | 30 | V | 5 | ||
| Line Voltage N | LINEN | -30 | 30 | V | 5 | ||
| ESD Capability, Human Body Model | ESDHBM | 2 | kV | Human Body Model per JESD22-A114, TA = 25°C (Note 1) | 5 | ||
| ESD Capability for LINEP and LINEN Pins, Human Body Model | ESDHBM_LINE | 8 | kV | Human Body Model per JESD22-A114, TA = 25°C (Note 1) | 5 | ||
| ESD Capability, Charged Device Model | ESDCDM | 0.5 | kV | Charged Device Model per ESD STM5.3.1, TA = 25°C (Note 1) | 5 | ||
| Latch-up Current Immunity | LU | 100 | mA | Latch-up Current per JESD78, TA = 25°C (Note 1) | 5 | ||
| Chip Supply | VDD | 2.97 | 3.3 | 3.63 | V | 5 | |
| I/O Supply for 3.3 V Operation | VDDIO | 2.97 | 3.3 | 3.63 | V | 5 | |
| I/O Supply for 2.5 V Operation | VDDIO | 2.25 | 2.5 | 2.75 | V | 5 | |
| Ambient Operating Temperature | TAMB | -40 | 125 | °C | 5 | ||
| Power Consumption (Transmitting and Receiving Ethernet Packets) | PACTIVE | 150 | 215 | mW | VDDIO = VDD = 3.3 V ±10% | 6 | |
| XTAL Clock Frequency (tolerance around nominal 25 MHz) | FXTAL | -100 | 100 | ppm | VDD = VDDIO = 3.3 V ±10%; nominal 25 MHz | 6 | |
| External Clock Frequency (tolerance around nominal 25 MHz) | FEXT | -100 | 100 | ppm | VDD = 3.3 V ±10%, VDDIO = 2.5 V ±10%; nominal 25 MHz | 6 | |
| SPI Clock Frequency | FSPI | 25 | MHz | VDD = VDDIO = 3.3 V ±10% | 6 | ||
| SPI Clock Frequency | FSPI | 20 | MHz | VDD = 3.3 V ±10%, VDDIO = 2.5 V ±10% | 6 | ||
| Data Rate (10BASE-T1S) | BITf | 10 | Mb/s | 6 | |||
| Peak Differential Output (Peak-to-peak) | VOUTpp | 800 | 1000 | 1200 | mV | VDD = 3.3 V ±10%, TX_GAIN = default (Note 2) | 6 |
| Cycle-to-Cycle Jitter | JTX | 0.2 | 1 | ns | 6 | ||
| Output Impedance | ROUT | 40 | 50 | 60 | VDD = 3.3 V ±10% | 6 | |
| Threshold Accuracy | Vacc | -30 | 30 | mV | 6 | ||
| Common Mode Voltage Range | VCM | -20 | 20 | V | 6 | ||
| Differential Input Resistance | RIN | 25 | 40 | 60 | k | Driver is High-Z (Not Transmitting) | 6 |
| Differential Input Capacitance | CIN | 5.5 | 7.5 | pF | at 20 MHz | 6 | |
| LVCMOS Input Level Low | VIL | -0.3 | 0.7 | V | VDDIO = 2.5 V ±10% | 6 | |
| LVCMOS Input Level Low | VIL | -0.3 | 0.8 | V | VDDIO = 3.3 V ±10% | 6 | |
| LVCMOS Input Level High | VIH | 1.7 | V | VDDIO = 2.5 V ±10% | 6 | ||
| LVCMOS Input Level High | VIH | 2 | V | VDDIO = 3.3 V ±10% | 6 | ||
| Schmitt Trigger Input Level Low | Vt−(VIL) | 0.7 | 1.5 | V | VDDIO = 2.5 V ±10% | 6 | |
| Schmitt Trigger Input Level Low | Vt−(VIL) | 0.7 | 1.9 | V | VDDIO = 3.3 V ±10% | 6 | |
| Schmitt Trigger Input Level High | Vt+(VIH) | 0.9 | 1.7 | V | VDDIO = 2.5 V ±10% | 6 | |
| Schmitt Trigger Input Level High | Vt+(VIH) | 0.9 | 2.1 | V | VDDIO = 3.3 V ±10% | 6 | |
| Schmitt Trigger Input Hysteresis | Vhyst (/Vt+−Vt−/) | 0.2 | 1 | V | VDDIO = 2.5 V ±10% | 7 | |
| Schmitt Trigger Input Hysteresis | Vhyst (/Vt+−Vt−/) | 0.2 | 1.4 | V | VDDIO = 3.3 V ±10% | 7 | |
| Output Level Low, 4X-Type | VOL | 0 | 0.45 | V | VDDIO = 2.5 V −10%, IOL = 2.48 mA (Note 3) | 7 | |
| Output Level Low, 8X-Type | VOL | 0 | 0.45 | V | VDDIO = 2.5 V −10%, IOL = 4.83 mA | 7 | |
| Output Level Low, 4X-Type | VOL | 0 | 0.4 | V | VDDIO = 3.3 V −10%, IOL = 2.93 mA | 7 | |
| Output Level Low, 8X-Type | VOL | 0 | 0.4 | V | VDDIO = 3.3 V −10%, IOL = 5.65 mA | 7 | |
| Input Current Low | IIL | -11 | 11 | A | 0.0 V ≤ Vin ≤ VDDIO, max supply = 3.63 V | 7 | |
| Input Current High | IIH | -11 | 11 | A | 0.0 V ≤ Vin ≤ VDDIO, max supply = 3.63 V | 7 | |
| Pull-Up Resistance | RPU | 33 | 54 | 103 | k | 7 | |
| Pull-Down Resistance | RPD | 30 | 44 | 73 | k | 7 | |
| SPI Clock Period | tclkp | 40 | ns | VDDIO = 2.25 V − 3.63 V | 8 | ||
| Data Input Setup Time | tsu | 8 | ns | VDDIO = 2.25 V − 3.63 V | 8 | ||
| Data Input Hold Time | thd | 5 | ns | VDDIO = 2.25 V − 3.63 V | 8 | ||
| Output Data Valid | tdv | 12 | ns | VDDIO = 3.3 V ±10% | 8 | ||
| Output Data Valid | tdv | 14.5 | ns | VDDIO = 2.5 V ±10% | 8 | ||
| CS Low to MISO Out Valid | totv | 12 | ns | VDDIO = 3.3 V ±10% | 8 | ||
| CS Low to MISO Out Valid | totv | 14.5 | ns | VDDIO = 2.5 V ±10% | 8 | ||
| CS Low to Rising Edge of SCLK | tfc | 20 | ns | VDDIO = 2.25 V − 3.63 V | 8 | ||
| SCLK Falling to CS De-assert | tcsh | 5 | ns | VDDIO = 2.25 V − 3.63 V | 8 | ||
| SCLK Falling to CS De-assert | tcsh | 5 | 14.5 | ns | VDDIO = 2.5 V ±10% | 8 | |
| CS De-assert to MISO HIGH-Z | tdz | 12 | ns | VDDIO = 3.3 V ±10% | 8 | ||
| CS De-assert to MISO HIGH-Z | tdz | 14.5 | ns | VDDIO = 2.5 V ±10% | 8 | ||
| Junction-to-Ambient, Still Air (NCN26010XMNTXG) | JA | 56.5 | K/W | Still air; NCN26010XMNTXG | 5 |
CAD (KiCad official)
- Symbol:
NCN26010XMNTXG - Footprint:
Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm - 3D model: QFN-32(4x4) (KiCad packages3D, STEP)
- 3D model files:
ncn26010xmntxg-etched.step/ncn26010xmntxg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ncn26010xmntxg.step/ncn26010xmntxg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (57 pp, sha256
b012d85d9428e0c5, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).