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Contents

README

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NCEP0135AK

Wuxi NCE Power Semiconductor · MOSFETs · TO-252-2L

NCEP0135AK from Wuxi NCE Power Semiconductor, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with VGS rated ±20 V and a gate threshold of 1.2 V min, 2.0 V typ and 2.8 V max.
2 D passive Drain, shown as the middle stub and the metal tab; VDS is rated at 100 V and continuous ID at 35 A.
3 S passive Source; the body diode runs from source to drain, with continuous diode forward current IS of 35 A.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous (Silicon Limited) ID 35 A 1
Drain Current-Continuous ID (100℃) 24.7 A TC=100℃ 1
Pulsed Drain Current (Package Limited) IDM 180 A 1
Maximum Power Dissipation PD 110 W TC=25℃ 1
Single pulse avalanche energy EAS 200 mJ 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 1
Thermal Resistance, Junction-to-Case RθJC 1.36 ℃/W 2
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=100V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 1.2 2 2.8 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 18 23 mΩ VGS=10V, ID=20A 2
Drain-Source On-State Resistance RDS(ON) 22 27 mΩ VGS=4.5V, ID=20A 2
Diode Forward Current IS 35 A 2

CAD (KiCad official)

  • Symbol: NCEP0135AK
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: ncep0135ak-etched.step / ncep0135ak-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncep0135ak.step / ncep0135ak.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (6 pp, sha256 df79817372aef2e9, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF