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Contents

README

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NCEP0116K

Wuxi NCE Power Semiconductor · MOSFETs · TO-252-2L

NCEP0116K from Wuxi NCE Power Semiconductor, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V, threshold VGS(th) 2.0 V min to 4.0 V max at ID=250μA.
2 D passive Drain (center stub, connected to the drain tab); VDS up to 100 V, continuous ID 16 A, pulsed IDM 64 A.
3 S passive Source; diode forward current IS up to 16 A.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate Threshold Voltage VGS(th) 2 3.2 4 V VDS=VGS, ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 78 95 mΩ VGS=10V, ID=16A 2
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=100V, VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=10A 2
Diode Forward Current IS 16 A 2
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 16 A 1
Drain Current-Continuous (TC=100℃) ID(100℃) 11.3 A TC=100℃ 1
Pulsed Drain Current IDM 64 A 1
Maximum Power Dissipation PD 55 W 1
Derating factor 0.37 W/℃ 1
Single pulse avalanche energy EAS 26 mJ Note 5: Tj=25℃, VDD=50V, VG=10V, L=0.5mH, Rg=25Ω 1
Drain Source voltage slope, VDS ≤120 V dv/dt 50 V/ns VDS ≤120 V 1
Drain Source voltage slope, VDS ≤120 V, ISD<ID dv/dt 50 V/ns VDS ≤120 V, ISD<ID 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 1
Thermal Resistance, Junction-to-Case RθJC 2.7 ℃/W Note 2: Surface Mounted on FR4 Board, t ≤ 10 sec 2

CAD (KiCad official)

  • Symbol: NCEP0116K
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: ncep0116k-etched.step / ncep0116k-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ncep0116k.step / ncep0116k.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (8 pp, sha256 6b958b63a773b82c, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF