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NCE82H140D

Wuxi NCE Power Semiconductor · MOSFETs · TO-263-2L

NCE82H140D from Wuxi NCE Power Semiconductor, in a TO-263-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V with threshold VGS(th) of 2 V min to 4 V max at ID=250μA.
2 D passive Drain, connected to the exposed tab; VDS 82 V max and continuous ID 140 A (99 A at TC=100℃), pulsed IDM 480 A.
3 S passive Source; body-diode forward current IS is 140 A max with VSD of 1.2 V max.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package TO-263-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 82 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 140 A 1
Drain Current-Continuous (TC=100℃) ID (100℃) 99 A TC=100℃ 1
Pulsed Drain Current IDM 480 A 1
Maximum Power Dissipation PD 220 W 1
Single pulse avalanche energy EAS 1500 mJ Note 5: Tj=25℃, VDD=40V, VG=10V, L=0.5mH, Rg=25Ω 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 1
Thermal Resistance, Junction-to-Case RθJc 0.68 ℃/W Note 2: Surface Mounted on FR4 Board, t ≤ 10 sec 2
Drain-Source Breakdown Voltage BVDSS 82 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=82V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 2 3 4 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 4.3 5.2 mΩ VGS=10V, ID=20A 2
Forward Transconductance gFS 65 S VDS=5V,ID=20A 2
Diode Forward Voltage VSD 1.2 V VGS=0V,IS=140A 2
Diode Forward Current IS 140 A Note 2: Surface Mounted on FR4 Board, t ≤ 10 sec 2

CAD (KiCad official)

  • Symbol: NCE82H140D
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263-2L (KiCad packages3D, STEP)
  • 3D model files: nce82h140d-etched.step / nce82h140d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce82h140d.step / nce82h140d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (8 pp, sha256 06951ff6ffe997b3, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF