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Ray Publish 0.1.0 1f584f4 16d ago

NCE60P25K

Wuxi NCE Power Semiconductor · MOSFETs · TO-252-2L

NCE60P25K from Wuxi NCE Power Semiconductor, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with absolute maximum VGS of ±20 V and threshold VGS(th) of -2 V to -3.5 V at ID=-250μA.
2 D passive Drain, connected to the exposed tab and the short middle stub; rated VDS -60 V and continuous ID -25 A.
3 S passive Source; the body diode runs from source to drain, with continuous diode forward current IS of -25 A.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -60 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID -25 A 1
Drain Current-Continuous (TC=100℃) ID (100℃) -17.7 A TC=100℃ 1
Pulsed Drain Current IDM -60 A 1
Maximum Power Dissipation PD 90 W 1
Derating factor 0.72 W/℃ 1
Single pulse avalanche energy EAS 300 mJ Tj=25℃,VDD=-20V,VG=-10V,L=1mH,Rg=25Ω,IAS=33A (Note 5) 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Drain-Source Breakdown Voltage BVDSS -60 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-60V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -2 -2.6 -3.5 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(ON) 37 45 mΩ VGS=-10V, ID=-20A 2
Diode Forward Current IS -25 A 2
Thermal Resistance, Junction-to-Case RθJC 1.4 ℃/W (Note 2) 2

CAD (KiCad official)

  • Symbol: NCE60P25K
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: nce60p25k-etched.step / nce60p25k-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce60p25k.step / nce60p25k.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 5dae18c4441530fc, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF