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Contents

README

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NCE6050A

Wuxi NCE Power Semiconductor · MOSFETs · TO-220-3L

NCE6050A from Wuxi NCE Power Semiconductor, in a TO-220-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, VGS limit ±20V, threshold 1.4V min to 2.5V max at VDS=VGS, ID=250μA.
2 D passive Drain (also connected to the tab); VDS max 60V, continuous ID 50A, pulsed IDM 90A.
3 S passive Source; continuous diode forward current IS max 50A, RDS(ON) below 20mΩ at VGS=10V.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package TO-220-3L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=60V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 1.4 1.9 2.5 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 14 20 mΩ VGS=10V, ID=20A 2
Forward Transconductance gFS 18 S VDS=5V,ID=20A 2
Diode Forward Current IS 50 A 2
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 50 A 1
Drain Current-Continuous (TC=100℃) ID(100℃) 35.4 A TC=100℃ 1
Pulsed Drain Current IDM 90 A 1
Maximum Power Dissipation PD 85 W TC=25℃ (table header) 1
Derating factor 0.3 W/℃ 1
Single pulse avalanche energy EAS 245 mJ Note 5: Tj=25℃, VDD=30V, VG=10V, L=0.5mH, Rg=25Ω 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 1
Thermal Resistance, Junction-to-Case RθJC 3.3 ℃/W Note 2: Surface Mounted on FR4 Board, t ≤ 10 sec 2

CAD (KiCad official)

  • Symbol: NCE6050A
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220-3L (KiCad packages3D, STEP)
  • 3D model files: nce6050a-etched.step / nce6050a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce6050a.step / nce6050a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 3190ab77203baaa6, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF