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NCE30TD60BD
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Wuxi NCE Power Semiconductor IGBT Transistors / Modules, TO-263. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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NCE30TD60BD
Wuxi NCE Power Semiconductor · IGBT Transistors / Modules · TO-263
NCE30TD60BD from Wuxi NCE Power Semiconductor, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-emitter voltage is limited to ±30 V (VGES) and the gate threshold voltage is 4.0 to 6.0 V at IC=1mA. |
| 2 | C | passive | Collector (also the mounting tab); collector-emitter voltage is rated 600 V (VCES) with 60 A continuous collector current and 30 A at TC=100°C. |
| 3 | E | passive | Emitter, which is also the anode of the co-packaged anti-parallel diode; the diode is rated 30 A continuous forward current at TC=100°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Wuxi NCE Power Semiconductor |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCES | 600 | V | 1 | |||
| Gate-Emitter Voltage | VGES | -30 | 30 | V | 1 | ||
| Collector Current | IC | 60 | A | 1 | |||
| Collector Current | IC | 30 | A | TC = 100°C | 1 | ||
| Pulsed Collector Current | ICplus | 90 | A | tp limited by Tjmax | 1 | ||
| Turn-off safe operating area collector current | 90 | A | VCE=600V, Tj=150°C | 1 | |||
| Diode Continuous Forward Current | IF | 30 | A | TC = 100°C | 1 | ||
| Diode Maximum Forward Current | IFM | 90 | A | 1 | |||
| Power Dissipation | PD | 190 | W | TC = 25°C | 1 | ||
| Power Dissipation | PD | 76 | W | TC = 100 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ,Tstg | -55 | 150 | °C | 1 | ||
| Maximum Temperature for Soldering | TL | 260 | °C | 1 | |||
| Short circuit withstand time | tsc | 3 | us | VGE=15V, VCC≤400V, Tj≤150°C, time between short circuits ≥1.0s, allowed number of short circuits <1000 | 1 | ||
| Thermal Resistance, Junction to case for IGBT | RθJC | 0.65 | °C/W | 2 | |||
| Thermal Resistance, Junction to case for Diode | RθJC | 1.08 | °C/W | 2 | |||
| Thermal Resistance, Junction to Ambient | RθJA | 40 | °C/W | 2 | |||
| Collector-Emitter Breakdown Voltage | V(BR)CES | 600 | V | VGE=0V, ICE=1mA | 2 | ||
| Collector-Emitter Leakage Current | ICES | 4 | uA | VGE=0V, VCE=600V | 2 | ||
| Gate to Emitter Forward Leakage | IGES(F) | 200 | nA | VGE=+30V, VCE=0V | 2 | ||
| Gate to Source Reverse Leakage | IGES(R) | 200 | nA | VGE=-30V, VCE=0V | 2 | ||
| Collector-Emitter Saturation Voltage | VCE(sat) | 1.7 | 1.9 | V | IC=30A, VGE=15V, Tj=25°C | 2 | |
| Collector-Emitter Saturation Voltage | VCE(sat) | 1.9 | V | IC=30A, VGE=15V, Tj=150°C | 2 | ||
| Gate Threshold Voltage | VGE(th) | 4 | 5 | 6 | V | IC=1mA, VCE=VGE | 2 |
| Diode Forward Voltage | VFM | 1.7 | 1.9 | V | IF=30A | 2 | |
| Input Capacitance | Cies | 3552 | pF | VCE=25V, VGE=0V, f=1MHz | 2 | ||
| Output Capacitance | Coes | 106 | pF | VCE=25V, VGE=0V, f=1MHz | 2 | ||
| Reverse Transfer Capacitance | Cres | 67 | pF | VCE=25V, VGE=0V, f=1MHz | 2 | ||
| Total Gate Charge | Qg | 132 | nC | VCC=480V, IC=30A, VGE=15V | 2 | ||
| Gate to Emitter Charge | Qge | 28 | nC | VCC=480V, IC=30A, VGE=15V | 2 | ||
| Gate to Collector Charge | Qgc | 54 | nC | VCC=480V, IC=30A, VGE=15V | 2 | ||
| Short circuit collector current | IC(SC) | 190 | A | VGE=15V, VCC≤400V, tSC≤3us, Tj≤150°C | 2 | ||
| Turn-on Delay Time | td(ON) | 19 | ns | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 | ||
| Rise Time | tr | 17 | ns | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 | ||
| Turn-Off Delay Time | td(OFF) | 166 | ns | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 | ||
| Fall Time | tf | 16 | ns | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 | ||
| Turn-On Switching Loss | Eon | 0.36 | mJ | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 | ||
| Turn-Off Switching Loss | Eoff | 0.32 | mJ | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 | ||
| Total Switching Loss | Ets | 0.68 | mJ | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 | ||
| Diode Peak Reverse Recovery Current | IRRM | 4 | A | IF=30A, di/dt=200A/us | 2 | ||
| Reverse Recovery Time | Trr | 178 | ns | IF=30A, di/dt=200A/us | 2 | ||
| Reverse Recovery Charge | Qrr | 0.4 | uC | IF=30A, di/dt=200A/us | 2 |
CAD (KiCad official)
- Symbol:
NCE30TD60BD - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files:
nce30td60bd-etched.step/nce30td60bd-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);nce30td60bd.step/nce30td60bd.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Wuxi NCE Power Semiconductor datasheet (8 pp, sha256
34d6daa60f9f9bf9, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# NCE30TD60BD
**Wuxi NCE Power Semiconductor** · IGBT Transistors / Modules · TO-263
NCE30TD60BD from Wuxi NCE Power Semiconductor, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-emitter voltage is limited to ±30 V (VGES) and the gate threshold voltage is 4.0 to 6.0 V at IC=1mA. |
| 2 | C | passive | Collector (also the mounting tab); collector-emitter voltage is rated 600 V (VCES) with 60 A continuous collector current and 30 A at TC=100°C. |
| 3 | E | passive | Emitter, which is also the anode of the co-packaged anti-parallel diode; the diode is rated 30 A continuous forward current at TC=100°C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Wuxi NCE Power Semiconductor |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-Emitter Voltage | VCES | | | 600 | V | | 1 |
| Gate-Emitter Voltage | VGES | -30 | | 30 | V | | 1 |
| Collector Current | IC | | | 60 | A | | 1 |
| Collector Current | IC | | | 30 | A | TC = 100°C | 1 |
| Pulsed Collector Current | ICplus | | | 90 | A | tp limited by Tjmax | 1 |
| Turn-off safe operating area collector current | | | | 90 | A | VCE=600V, Tj=150°C | 1 |
| Diode Continuous Forward Current | IF | | | 30 | A | TC = 100°C | 1 |
| Diode Maximum Forward Current | IFM | | | 90 | A | | 1 |
| Power Dissipation | PD | | | 190 | W | TC = 25°C | 1 |
| Power Dissipation | PD | | | 76 | W | TC = 100 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ,Tstg | -55 | | 150 | °C | | 1 |
| Maximum Temperature for Soldering | TL | | | 260 | °C | | 1 |
| Short circuit withstand time | tsc | | | 3 | us | VGE=15V, VCC≤400V, Tj≤150°C, time between short circuits ≥1.0s, allowed number of short circuits <1000 | 1 |
| Thermal Resistance, Junction to case for IGBT | RθJC | | | 0.65 | °C/W | | 2 |
| Thermal Resistance, Junction to case for Diode | RθJC | | | 1.08 | °C/W | | 2 |
| Thermal Resistance, Junction to Ambient | RθJA | | | 40 | °C/W | | 2 |
| Collector-Emitter Breakdown Voltage | V(BR)CES | 600 | | | V | VGE=0V, ICE=1mA | 2 |
| Collector-Emitter Leakage Current | ICES | | | 4 | uA | VGE=0V, VCE=600V | 2 |
| Gate to Emitter Forward Leakage | IGES(F) | | | 200 | nA | VGE=+30V, VCE=0V | 2 |
| Gate to Source Reverse Leakage | IGES(R) | | | 200 | nA | VGE=-30V, VCE=0V | 2 |
| Collector-Emitter Saturation Voltage | VCE(sat) | | 1.7 | 1.9 | V | IC=30A, VGE=15V, Tj=25°C | 2 |
| Collector-Emitter Saturation Voltage | VCE(sat) | | 1.9 | | V | IC=30A, VGE=15V, Tj=150°C | 2 |
| Gate Threshold Voltage | VGE(th) | 4 | 5 | 6 | V | IC=1mA, VCE=VGE | 2 |
| Diode Forward Voltage | VFM | | 1.7 | 1.9 | V | IF=30A | 2 |
| Input Capacitance | Cies | | 3552 | | pF | VCE=25V, VGE=0V, f=1MHz | 2 |
| Output Capacitance | Coes | | 106 | | pF | VCE=25V, VGE=0V, f=1MHz | 2 |
| Reverse Transfer Capacitance | Cres | | 67 | | pF | VCE=25V, VGE=0V, f=1MHz | 2 |
| Total Gate Charge | Qg | | 132 | | nC | VCC=480V, IC=30A, VGE=15V | 2 |
| Gate to Emitter Charge | Qge | | 28 | | nC | VCC=480V, IC=30A, VGE=15V | 2 |
| Gate to Collector Charge | Qgc | | 54 | | nC | VCC=480V, IC=30A, VGE=15V | 2 |
| Short circuit collector current | IC(SC) | | 190 | | A | VGE=15V, VCC≤400V, tSC≤3us, Tj≤150°C | 2 |
| Turn-on Delay Time | td(ON) | | 19 | | ns | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 |
| Rise Time | tr | | 17 | | ns | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 |
| Turn-Off Delay Time | td(OFF) | | 166 | | ns | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 |
| Fall Time | tf | | 16 | | ns | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 |
| Turn-On Switching Loss | Eon | | 0.36 | | mJ | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 |
| Turn-Off Switching Loss | Eoff | | 0.32 | | mJ | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 |
| Total Switching Loss | Ets | | 0.68 | | mJ | VCC=400V, IC=30A, VGE=0/15V, Rg=5Ω, inductive load | 2 |
| Diode Peak Reverse Recovery Current | IRRM | | 4 | | A | IF=30A, di/dt=200A/us | 2 |
| Reverse Recovery Time | Trr | | 178 | | ns | IF=30A, di/dt=200A/us | 2 |
| Reverse Recovery Charge | Qrr | | 0.4 | | uC | IF=30A, di/dt=200A/us | 2 |
## CAD (KiCad official)
- Symbol: `NCE30TD60BD`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files: `nce30td60bd-etched.step` / `nce30td60bd-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `nce30td60bd.step` / `nce30td60bd.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Wuxi NCE Power Semiconductor datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588912679775293440) (8 pp, sha256 `34d6daa60f9f9bf9`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/nce30td60bd-datasheet.pdf)