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Ray Publish 0.1.0 ff9e970 17d ago

NCE30P25S

Wuxi NCE Power Semiconductor · MOSFETs · SOP-8

NCE30P25S from Wuxi NCE Power Semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the P-channel MOSFET, tied with pins 2 and 3.
2 S passive Source terminal of the P-channel MOSFET, tied with pins 1 and 3.
3 S passive Source terminal of the P-channel MOSFET, tied with pins 1 and 2.
4 G input Gate terminal; VGS rated ±20 V maximum with threshold -1.0 to -2.5 V.
5 D passive Drain terminal, tied with pins 6, 7 and 8; VDS -30 V and ID -25 A maximum continuous.
6 D passive Drain terminal, tied with pins 5, 7 and 8; VDS -30 V and ID -25 A maximum continuous.
7 D passive Drain terminal, tied with pins 5, 6 and 8; VDS -30 V and ID -25 A maximum continuous.
8 D passive Drain terminal, tied with pins 5, 6 and 7; VDS -30 V and ID -25 A maximum continuous.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 -33 V VGS=0V ID=-250μA 1
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-30V,VGS=0V 1
Gate-Body Leakage Current IGSS 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -1 -1.5 -2.5 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(ON) 6.4 9 mΩ VGS=-10V, ID=-15A 2
Drain-Source On-State Resistance RDS(ON) 8.3 14 mΩ VGS=-4.5V, ID=-10A 2
Forward Transconductance gFS 30 S VDS=-10V,ID=-15A 2
Diode Forward Voltage VSD -1.2 V VGS=0V,IS=-25A 2
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID -25 A 1
Drain Current-Pulsed IDM -70 A Note 1 (repetitive rating; pulse width limited by maximum junction temperature) 1
Maximum Power Dissipation PD 3.5 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 36 ℃/W Surface mounted on FR4 board, t ≤ 10 sec (Note 2) 1

CAD (KiCad official)

  • Symbol: NCE30P25S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: nce30p25s-etched.step / nce30p25s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce30p25s.step / nce30p25s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 d15f7317f2098cb4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF