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Contents

README

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NCE30P15S

Wuxi NCE Power Semiconductor · MOSFETs · SOP-8

NCE30P15S from Wuxi NCE Power Semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source of the P-channel MOSFET, tied to pins 2 and 3.
2 S passive Source of the P-channel MOSFET, tied to pins 1 and 3.
3 S passive Source of the P-channel MOSFET, tied to pins 1 and 2.
4 G input Gate; threshold VGS(th) -1.0 to -2.2 V, absolute maximum VGS ±20 V.
5 D passive Drain, tied to pins 6, 7 and 8; VDS max -30 V, ID -15 A continuous.
6 D passive Drain, tied to pins 5, 7 and 8; VDS max -30 V, ID -15 A continuous.
7 D passive Drain, tied to pins 5, 6 and 8; VDS max -30 V, ID -15 A continuous.
8 D passive Drain, tied to pins 5, 6 and 7; VDS max -30 V, ID -15 A continuous.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID -15 A 1
Drain Current-Pulsed (Note 1) IDM -80 A Repetitive rating: pulse width limited by maximum junction temperature 1
Maximum Power Dissipation PD 3.1 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient (Note 2) RθJA 40 ℃/W Surface mounted on FR4 board, t ≤ 10 sec 1
Drain-Source Breakdown Voltage BVDSS -30 -33 V VGS=0V, ID=-250μA 1
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-30V, VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Drain-Source On-State Resistance RDS(ON) 8.5 12 mΩ VGS=-10V, ID=-15A 2
Forward Transconductance gFS 30 S VDS=-5V, ID=-15A 2
Diode Forward Voltage (Note 3) VSD -1.2 V VGS=0V, IS=-2A 2

CAD (KiCad official)

  • Symbol: NCE30P15S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: nce30p15s-etched.step / nce30p15s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce30p15s.step / nce30p15s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 5be2396a8f8341f6, retrieved 2026-10-13, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF