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Contents

README

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NCE30P12S

Wuxi NCE Power Semiconductor · MOSFETs · SOP-8

NCE30P12S from Wuxi NCE Power Semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source of the P-channel MOSFET, tied to pins 2 and 3; device is rated VDS = -30V.
2 S passive Source of the P-channel MOSFET, tied to pins 1 and 3 externally on the board.
3 S passive Source of the P-channel MOSFET, tied to pins 1 and 2 externally on the board.
4 G input Gate of the P-channel MOSFET; absolute maximum VGS is ±20V, with RDS(ON) specified at VGS=-4.5V and -10V.
5 D passive Drain of the P-channel MOSFET, common with pins 6, 7 and 8; continuous ID is -12A.
6 D passive Drain of the P-channel MOSFET, common with pins 5, 7 and 8; pulsed IDM is -48A.
7 D passive Drain of the P-channel MOSFET, common with pins 5, 6 and 8.
8 D passive Drain of the P-channel MOSFET, common with pins 5, 6 and 7.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 -33 V VGS=0V ID=-250μA 2
Zero Gate Voltage Drain Current IDSS -1 μA VDS=-30V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) -1 -1.5 -3 V VDS=VGS,ID=-250μA 2
Drain-Source On-State Resistance RDS(ON) 11.5 15 mΩ VGS=-10V, ID=-10A 2
Drain-Source On-State Resistance RDS(ON) 18 25 mΩ VGS=-4.5V, ID=-7A 2
Forward Transconductance gFS 20 S VDS=-10V,ID=-10A 2
Diode Forward Voltage VSD -1.2 V VGS=0V,IS=-2A 2
Drain-Source Voltage VDS -30 V TA=25℃ 1
Gate-Source Voltage VGS -20 20 V TA=25℃ 1
Drain Current-Continuous ID -12 A TA=25℃ 1
Drain Current-Pulsed (Note 1) IDM -48 A TA=25℃; Note 1: repetitive rating, pulse width limited by maximum junction temperature 1
Maximum Power Dissipation PD 3 W TA=25℃ 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Thermal Resistance, Junction-to-Ambient (Note 2) RθJA 41.67 ℃/W Note 2: surface mounted on FR4 board, t ≤ 10 sec 1

CAD (KiCad official)

  • Symbol: NCE30P12S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: nce30p12s-etched.step / nce30p12s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce30p12s.step / nce30p12s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 a653162686f1eb04, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF