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Contents

README

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NCE30ND07S

Wuxi NCE Power Semiconductor · MOSFETs · SOP-8

NCE30ND07S from Wuxi NCE Power Semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S2 passive Source of MOSFET 2 (N-channel, VDS 30V, ID 7A).
2 G2 input Gate of MOSFET 2, with a gate-source voltage limit of ±20V.
3 S1 passive Source of MOSFET 1 (N-channel, VDS 30V, ID 7A).
4 G1 input Gate of MOSFET 1, with a gate-source voltage limit of ±20V.
5 D1 passive Drain of MOSFET 1 (shorted to pin 6), with a drain-source voltage rating of 30V.
6 D1 passive Drain of MOSFET 1 (shorted to pin 5), with a drain-source voltage rating of 30V.
7 D2 passive Drain of MOSFET 2 (shorted to pin 8), with a drain-source voltage rating of 30V.
8 D2 passive Drain of MOSFET 2 (shorted to pin 7), with a drain-source voltage rating of 30V.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package SOP-8
Category Transistors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 7 A 1
Drain Current-Continuous ID (100℃) 4.95 A TC=100℃ 1
Pulsed Drain Current IDM 40 A 1
Maximum Power Dissipation PD 2 W 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 ℃ 1
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=30V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 1.1 2.1 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 18 23 mΩ VGS=10V, ID=7A 2
Drain-Source On-State Resistance RDS(ON) 25 40 mΩ VGS=4.5V, ID=6A 2
Diode Forward Voltage VSD 1.2 V VGS=0V,IS=7A 2
Diode Forward Current IS 7 A Note 2 2
Thermal Resistance, Junction-to-Ambient RθJA 62.5 85 ℃/W Note 2 1

CAD (KiCad official)

  • Symbol: NCE30ND07S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: nce30nd07s-etched.step / nce30nd07s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce30nd07s.step / nce30nd07s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 c046caaf47ed0f8b, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF