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NCE30H15K

Wuxi NCE Power Semiconductor · MOSFETs · TO-252-2L

NCE30H15K from Wuxi NCE Power Semiconductor, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V absolute maximum, with VGS(th) 1.2 V min to 2.5 V max at 250 μA.
2 D passive Drain, the center lead which is also the exposed tab; VDS 30 V maximum and continuous drain current 150 A at TC=25℃.
3 S passive Source; continuous body-diode forward current IS is 150 A maximum.

Key specifications

Parameter Value
Manufacturer Wuxi NCE Power Semiconductor
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 150 A 1
Drain Current-Continuous ID (100℃) 105 A TC=100℃ 1
Pulsed Drain Current IDM 600 A 1
Maximum Power Dissipation PD 130 W 1
Single pulse avalanche energy EAS 1700 mJ Tj=25℃,VDD=20V,VG=10V,L=1mH,Rg=25Ω,IAS=58.5A (Note 5) 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 1
Drain-Source Breakdown Voltage BVDSS 30 35 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=30V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 1.2 1.7 2.5 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 3 4 mΩ VGS=10V, ID=20A 2
Drain-Source On-State Resistance RDS(ON) 4.4 5 mΩ VGS=4.5V, ID=10A 2
Forward Transconductance gFS 32 S VDS=10V,ID=20A 2
Diode Forward Current IS 150 A 2
Thermal Resistance, Junction-to-Case RθJC 1.15 ℃/W 2

CAD (KiCad official)

  • Symbol: NCE30H15K
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: nce30h15k-etched.step / nce30h15k-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); nce30h15k.step / nce30h15k.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi NCE Power Semiconductor datasheet (7 pp, sha256 d1a143f1aa95bd4a, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF